Semiconductor device including channel formation region including oxide semiconductor

• US 8,901,554 B2
• Filed: 05/31/2012
• Issued: 12/02/2014
• Est. Priority Date: 06/17/2011
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Sasagawa, Shinya, Fujiki, Hiroshi, Ieda, Yoshinori
• Primary Examiner(s): Parker, Allen
• Assistant Examiner(s): SWAN, GARDNER W.S
• Application Number:
  US13/484,742
• Publication Number:
  US 20120319101A1
• Time in Patent Office: 915 Days
• Field of Search: 257/43, 257/774
• US Class Current: 257/43
• CPC Class Codes: H01L 21/02164 the material being a silicon oxide, e.g. SiO2
• CPC Class Codes: H01L 21/02178 the material containing aluminium, e.g. Al2O3
• CPC Class Codes: H01L 21/02554 Oxides
• CPC Class Codes: H01L 21/02565 Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
• CPC Class Codes: H01L 21/47573 Etching the layer
• CPC Class Codes: H01L 29/41733 for thin film transistors with insulated gate
• CPC Class Codes: H01L 29/66742 Thin film unipolar transistors
• CPC Class Codes: H01L 29/66969 of devices having semiconductor bodies not comprising group 14 or group 13/15 materials comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials, comprising cuprous oxide or cuprous iodide H01L21/02365
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate

Abstract

A first insulating film in contact with an oxide semiconductor film and a second insulating film are stacked in this order over an electrode film of a transistor including the oxide semiconductor film, an etching mask is formed over the second insulating film, an opening portion exposing the electrode film is formed by etching a portion of the first insulating film and a portion of the second insulating film, the opening portion exposing the electrode film is exposed to argon plasma, the etching mask is removed, and a conductive film is formed in the opening portion exposing the electrode film. The first insulating film is an insulating film whose oxygen is partly released by heating. The second insulating film is less easily etched than the first insulating film and has a lower gas-permeability than the first insulating film.

Claims

1. A semiconductor device comprising:

an oxide semiconductor film that comprises a source region, a drain region and a channel formation region between the source region and the drain region, wherein each of the source region and the drain region comprises an impurity;

an electrode electrically connected to the oxide semiconductor films, wherein the electrode is one of a source electrode and a drain electrode;

a gate electrode over the oxide semiconductor film, the gate electrode overlapping with the channel formation region;

a first insulating film over the oxide semiconductor film and the electrode, wherein the first insulating film is capable of supplying oxygen into the oxide semiconductor film, and is located between the oxide semiconductor film and the gate electrode;

a second insulating film over the first insulating film; and

a conductive film over the second insulating film, wherein the conductive film is electrically connected to the electrode through an opening of the first insulating film and an opening of the second insulating film,

wherein a first angle between a side surface of the first insulating film and a bottom surface of the first insulating film at the opening of the first insulating film is larger than a second angle between a side surface of the second insulating film and a bottom surface of the second insulating film at the opening of the second insulating film,

wherein the side surface of the first insulating film and the side surface of the second insulating film are in contact with the conductive film at the respective openings, and

wherein the oxide semiconductor film comprises non-single crystals of an In—

Ga—

Zn-based oxide in which a c-axis is aligned in a direction substantially perpendicular to a surface of the oxide semiconductor film, wherein an a-axis of one of the non-single crystals is different from an a-axis of another of the non-single crystals, or a b-axis of one of the non-single crystals is different from a b-axis of another of the non-single crystals.

2. The semiconductor device according to claim 1, further comprising:

a third insulating film over the second insulating film,

wherein a third angle between a side surface of the third insulating film and a bottom surface of the third insulating film is larger than the second angle.

3. The semiconductor device according to claim 1,

wherein the first insulating film comprises one of a silicon oxide, a silicon oxynitride, and a silicon nitride oxide, and

wherein the second insulating film comprises aluminum oxide.

4. The semiconductor device according to claim 1, wherein a thickness of the first insulating film is thinner than the gate electrode.

5. A semiconductor device comprising:

an oxide semiconductor film that comprises a source region, a drain region and a channel formation region between the source region and the drain region, wherein each of the source region and the drain region comprises an impurity;

a source electrode and a drain electrode which are electrically connected to the oxide semiconductor film;

a gate electrode over the oxide semiconductor film, the gate electrode overlapping with the channel formation region;

a first insulating film over the oxide semiconductor film, the source electrode, and the drain electrode, wherein the first insulating film is capable of supplying oxygen into the oxide semiconductor film, and is located between the oxide semiconductor film and the gate electrode;

a second insulating film over the first insulating film and the gate electrode; and

a conductive film over the second insulating film, wherein the conductive film is electrically connected to one of the source electrode and the drain electrode through an opening of the first insulating film and an opening of the second insulating film,

wherein a first angle between a side surface of the first insulating film and a bottom surface of the first insulating film at the opening of the first insulating film is larger than a second angle between a side surface of the second insulating film and a bottom surface of the second insulating film at the opening of the second insulating film,

wherein the side surface of the first insulating film and the side surface of the second insulating film are in contact with the conductive film at the respective openings, and

wherein the oxide semiconductor film comprises non-single crystals of an In—

Ga—

Zn-based oxide in which a c-axis is aligned in a direction substantially perpendicular to a surface of the oxide semiconductor film, wherein an a-axis of one of the non-single crystals is different from an a-axis of another of the non-single crystals, or a b-axis of one of the non-single crystals is different from a b-axis of another of the non-single crystals.

6. The semiconductor device according to claim 5, further comprising:

a third insulating film over the second insulating film,

wherein a third angle between a side surface of the third insulating film and a bottom surface of the third insulating film is larger than the second angle.

7. The semiconductor device according to claim 5,

wherein the first insulating film comprises one of a silicon oxide, a silicon oxynitride, and a silicon nitride oxide, and

wherein the second insulating film comprises aluminum oxide.

8. The semiconductor device according to claim 5, wherein a thickness of the first insulating film is thinner than the gate electrode.

9. The semiconductor device according to claim 5, wherein a concentration of the impurity in each of the source region and the drain region is larger than a concentration of the impurity in the channel formation region.

10. A semiconductor device comprising:

an oxide semiconductor film that comprises a source region, a drain region and a channel formation region between the source region and the drain region, wherein each of the source region and the drain region comprises an impurity;

an electrode electrically connected to the oxide semiconductor film, wherein the electrode is one of a source electrode and a drain electrode;

a gate electrode over the oxide semiconductor film, the gate electrode overlapping with the channel formation region;

a first insulating film over the oxide semiconductor film and the electrode, wherein the first insulating film is capable of supplying oxygen into the oxide semiconductor film, and is located between the oxide semiconductor film and the gate electrode;

a second insulating film over the first insulating film; and

a conductive film over the second insulating film, wherein the conductive film is electrically connected to the electrode through an opening of the first insulating film and an opening of the second insulating film,

wherein a first angle between a side surface of the first insulating film and a bottom surface of the first insulating film at the opening of the first insulating film is larger than a second angle between a side surface of the second insulating film and a bottom surface of the second insulating film at the opening of the second insulating film,

wherein the side surface of the first insulating film and the side surface of the second insulating film are in contact with the conductive film at the respective openings,

wherein the oxide semiconductor film comprises non-single crystals of an In—

Ga—

Zn-based oxide in which a c-axis is aligned in a direction substantially perpendicular to a surface of the oxide semiconductor film, wherein an a-axis of one of the non-single crystals is different from an a-axis of another of the non-single crystals, or a b-axis of one of the non-single crystals is different from a b-axis of another of the non-single crystals, and

wherein the impurity is one of phosphorus and arsenic.

11. The semiconductor device according to claim 10, further comprising:

a third insulating film over the second insulating film,

wherein a third angle between a side surface of the third insulating film and a bottom surface of the third insulating film is larger than the second angle.

12. The semiconductor device according to claim 10,

wherein the first insulating film comprises one of a silicon oxide, a silicon oxynitride, and a silicon nitride oxide, and

wherein the second insulating film comprises aluminum oxide.

13. The semiconductor device according to claim 10, wherein a thickness of the first insulating film is thinner than the gate electrode.