LED module having LED chips as light source
First Claim
1. An LED (Light Emitting Diode) module comprising:
- an LED unit having one or more LED chips; and
a case including;
a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface;
a through conductor penetrating through the base plate; and
one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit,wherein the through conductor includes;
a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, at least a part of the main surface exposed portion being buried under the main surface of the base plate, and at least a part of the main surface exposed portion having a caved shape deviated from the LED unit;
a bottom surface exposed portion exposed to the bottom surface; and
a reaching portion connected to the main surface exposed portion and the bottom surface exposed portion,wherein the pads cover at least a portion of the main surface exposed portion,wherein the reaching portion is smaller than the main surface exposed portion and the LED unit when viewed from top, andwherein the main surface exposed portion contains the LED unit when viewed from top.
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Accused Products
Abstract
An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.
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Citations
21 Claims
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1. An LED (Light Emitting Diode) module comprising:
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an LED unit having one or more LED chips; and a case including; a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit, wherein the through conductor includes; a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, at least a part of the main surface exposed portion being buried under the main surface of the base plate, and at least a part of the main surface exposed portion having a caved shape deviated from the LED unit; a bottom surface exposed portion exposed to the bottom surface; and a reaching portion connected to the main surface exposed portion and the bottom surface exposed portion, wherein the pads cover at least a portion of the main surface exposed portion, wherein the reaching portion is smaller than the main surface exposed portion and the LED unit when viewed from top, and wherein the main surface exposed portion contains the LED unit when viewed from top. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An LED (Light Emitting Diode) module comprising:
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an LED unit having one or more LED chips; and a case including one or more pads mounting thereon the LED unit, a base plate having a main surface on which the pads are formed and a bottom surface opposite to the main surface, and a frame unit bonded to the main surface and surrounding the LED unit, wherein the base plate is made of ceramic, wherein the frame unit is made of resin, wherein the case further includes a through conductor penetrating through the base plate and making conductive connection with the pads, wherein the through conductor has a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface exposed portion exposed to the bottom surface, a reaching portion connected to the main surface exposed portion and the bottom surface exposed portion, at least a part of the main surface exposed portion being buried under the main surface of the base plate, and at least a part of the main surface exposed portion having a caved shape deviated from the LED unit, wherein the pads cover at least a portion of the main surface exposed portion, wherein the reaching portion is smaller than the main surface exposed portion and the LED unit when viewed from top, and wherein the main surface exposed portion contains the LED unit when viewed from the top. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification