Yttrium and titanium high-k dielectric films

• US 8,901,708 B2
• Filed: 11/13/2012
• Issued: 12/02/2014
• Est. Priority Date: 04/23/2008
• Status: Expired due to Fees

• Current Assignee: Intermolecular Incorporated (Merck & Co., Inc.)
• Original Assignee: Intermolecular Incorporated (Merck & Co., Inc.)
• Inventors: Hashim, Imran, Chen, Hanhong, Chiang, Tony, De, Indranil, Fuchigami, Nobumichi, Haywood, Edward, Kumar, Pragati, Malhotra, Sandra, Shanker, Sunil
• Primary Examiner(s): CHEN, BRET P
• Application Number:
  US13/675,971
• Publication Number:
  US 20130069201A1
• Time in Patent Office: 749 Days
• Field of Search: 427/80, 257/532, 257/303
• US Class Current: 257/532
• CPC Class Codes: C23C 16/405 of refractory metals or yttrium
• CPC Class Codes: C23C 16/45529 specially adapted for making a layer stack of alternating different compositions or gradient compositions
• CPC Class Codes: C23C 16/45531 specially adapted for making ternary or higher compositions
• CPC Class Codes: H01L 21/02186 the material containing titanium, e.g. TiO2
• CPC Class Codes: H01L 21/02192 the material containing at least one rare earth metal element, e.g. oxides of lanthanides, scandium or yttrium
• CPC Class Codes: H01L 21/02194 the material containing more than one metal element
• CPC Class Codes: H01L 21/02205 the layer being characterised by the precursor material for deposition
• CPC Class Codes: H01L 21/02266 deposition by physical ablation of a target, e.g. sputtering, reactive sputtering, physical vapour deposition or pulsed laser deposition
• CPC Class Codes: H01L 21/0228 deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD
• CPC Class Codes: H01L 21/02697 Forming conducting materials on a substrate
• CPC Class Codes: H01L 21/3141 Deposition using atomic layer deposition techniques [ALD]
• CPC Class Codes: H01L 21/31604 Deposition from a gas or vapour H01L21/31691, H01L21/31695 take precedence
• CPC Class Codes: H01L 28/40 Capacitors
• CPC Class Codes: H01L 28/65 comprising a noble metal or a noble metal oxide, e.g. platinum (Pt), ruthenium (Ru), ruthenium dioxide (RuO2), iridium (Ir), iridium dioxide (IrO2)
• CPC Class Codes: H10B 12/033 the capacitor extending over the transistor

Abstract

This disclosure provides (a) methods of making an oxide layer (e.g., a dielectric layer) based on yttrium and titanium, to have a high dielectric constant and low leakage characteristic and (b) related devices and structures. An oxide layer having both yttrium and titanium may be fabricated either as an amorphous oxide or as an alternating series of monolayers. In several embodiments, the oxide is characterized by a yttrium contribution to total metal that is specifically controlled. The oxide layer can be produced as the result of a reactive process, if desired, via either a PVD process or, alternatively, via an atomic layer deposition process that employs specific precursor materials to allow for a common process temperature window for both titanium and yttrium reactions.

Claims

1. A semiconductor layer stack comprising:

a first conductive layer;

a second conductive layer; and

a dielectric disposed between the first conductive layer and the second conductive layer,

the dielectric comprising a Ti—

Y—

Ox layer having a yttrium-to-total-metal (Y/(Y+Ti)) constituency of between approximately sixteen to forty-one percent yttrium,

the dielectric having a thickness between 5 nanometers and 20 nanometers,

the dielectric being formed by a physical vapor deposition (PVD) process, the PVD process comprising reactive co-sputtering of a first source and a second source,

wherein the first source comprises metallic yttrium, and

wherein the second source comprises metallic titanium,

wherein yttrium and titanium are intermixed in the dielectric such that the dielectric is a monolayer having a homogeneous composition;

wherein the dielectric is formed in an oxygen-rich environment.

2. The semiconductor layer stack of claim 1, wherein the dielectric has substantially no X-ray diffraction peak associated with crystalline titanium oxide or crystalline yttrium oxide so that the Ti—

Y—

Ox layer represents an amorphous state.

3. The semiconductor layer stack of claim 1, wherein one of the first conductive layer or the second conductive layer comprises one of ruthenium, ruthenium oxide, platinum, a metal nitride, iridium, iridium oxide, silicon and a silicide.

4. The semiconductor layer stack of claim 1, wherein the dielectric has a dielectric constant of at least fifty-five.

5. The semiconductor layer stack of claim 1, wherein the dielectric is substantially amorphous.

6. The semiconductor layer stack of claim 1, wherein the thickness of the dielectric is 10 nanometers.

7. The semiconductor layer stack of claim 1, wherein the first conductive layer comprises one of titanium nitride, platinum, iridium, iridium oxide, tungsten, tungsten oxide, molybdenum, molybdenum oxide, ruthenium, or ruthenium oxide.

8. The semiconductor layer stack of claim 1, wherein the first conductive layer comprises multiple sub-layers having different compositions, one of the multiple sub-layers comprising one of ruthenium, ruthenium oxide, iridium, iridium oxide, or platinum, another one of the multiple sub-layers comprising TiN, TiAIN, TiSiN, TaN, TaAIN, TaSiN, WN, WSiN, or WCN.

9. The semiconductor layer stack of claim 1, wherein the semiconductor layer stack is a part of dynamic random access memory (DRAM) cell.

10. The semiconductor layer stack of claim 1, wherein the semiconductor layer stack is one of a cylinder-shaped capacitor, a pillar-shaped capacitor, a pedestal-shaped capacitor, or a crown-shaped capacitor.

11. A semiconductor layer stack comprising:

a first conductive layer;

a second conductive layer; and

an amorphous oxide layer disposed between the first conductive layer and the second conductive layer,

the amorphous oxide layer comprising yttrium and titanium,

the amorphous oxide layer having a thickness between 5 nanometers and 20 nanometers,

wherein yttrium and titanium are intermixed in the amorphous oxide layer such that the dielectric is a monolayer having a homogeneous composition,

wherein the amorphous oxide layer is characterized by a structure having substantially no crystalline yttrium oxide and substantially no crystalline titanium oxide,

wherein the amorphous oxide layer has a dielectric constant equal to or greater than fifty-five,

wherein the amorphous oxide layer has a yttrium-to-total-metal (Y/(Y+Ti)) constituency of between approximately sixteen to forty-one percent yttrium, and

wherein the amorphous oxide layer is formed by a physical vapor deposition (PVD) process, the PVD process comprising reactive co-sputtering of a first source and a second source,

wherein the first source comprises metallic yttrium, and

wherein the second source comprises metallic titanium;

wherein the amorphous oxide layer is formed in an oxygen-rich environment.

12. The semiconductor layer stack of claim 11, wherein the amorphous oxide layer is composed substantially of Ti—

Y—

Ox.

13. The semiconductor layer stack of claim 11, wherein one of the conductive layers comprises one of ruthenium, ruthenium oxide, platinum, metal nitrides, iridium, iridium oxide, tungsten, tungsten oxide, molybdenum or molybdenum oxide.