Connector design for packaging integrated circuits
First Claim
Patent Images
1. A device comprising:
- a polymer layer having a top surface;
a copper-containing metal pillar comprising a portion over the top surface of the polymer layer;
a first non-wetting layer on a sidewall of the copper-containing metal pillar, wherein the first non-wetting layer comprises a material selected from a group consisting essentially of a copper nitride, a copper oxide, and a copper oxynitride;
a nickel-containing metal cap over the copper-containing metal pillar, wherein the nickel-containing metal cap comprises edge portions extending beyond respective sidewalls of the copper-containing metal pillar;
a second non-wetting layer on a sidewall of the nickel-containing metal cap, wherein the second non-wetting layer comprises a material selected from a group consisting essentially of a nickel nitride, a nickel oxide, and a nickel oxynitride; and
a solder region over the nickel-containing metal cap.
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Abstract
A device includes a top dielectric layer having a top surface. A metal pillar has a portion over the top surface of the top dielectric layer. A non-wetting layer is formed on a sidewall of the metal pillar, wherein the non-wetting layer is not wettable to the molten solder. A solder region is disposed over and electrically coupled to the metal pillar.
94 Citations
15 Claims
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1. A device comprising:
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a polymer layer having a top surface; a copper-containing metal pillar comprising a portion over the top surface of the polymer layer; a first non-wetting layer on a sidewall of the copper-containing metal pillar, wherein the first non-wetting layer comprises a material selected from a group consisting essentially of a copper nitride, a copper oxide, and a copper oxynitride; a nickel-containing metal cap over the copper-containing metal pillar, wherein the nickel-containing metal cap comprises edge portions extending beyond respective sidewalls of the copper-containing metal pillar; a second non-wetting layer on a sidewall of the nickel-containing metal cap, wherein the second non-wetting layer comprises a material selected from a group consisting essentially of a nickel nitride, a nickel oxide, and a nickel oxynitride; and a solder region over the nickel-containing metal cap. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A device comprising:
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a first die comprising a first contact pad; a passivation layer at a surface of the first die, wherein the passivation layer comprises an opening exposing the first contact pad; a first metal pillar electrically connected to the first contact pad, wherein the first metal pillar extends at least partially over the passivation layer; a first metal cap over the first metal pillar; a first non-wetting layer on a sidewall of the first metal cap, wherein the first non-wetting layer is not wettable to molten solder; and a solder region over and electrically coupled to the first metal cap. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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Specification