Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes

• US 8,902,565 B2
• Filed: 05/24/2011
• Issued: 12/02/2014
• Est. Priority Date: 05/26/2010
• Status: Active Grant

• Current Assignee: Kemet Electronics Corporation (Yageo Corporation)
• Original Assignee: Kemet Electronics Corporation (Yageo Corporation)
• Inventors: McConnell, John E., Bultitude, John, Phillips, Reggie, Hill, Robert Allen, Renner, Garry L., Lessner, Philip M., Chacko, Antony P., Bell, Jeffrey, Brown, Keith
• Primary Examiner(s): THOMAS, ERIC W
• Application Number:
  US13/114,126
• Publication Number:
  US 20110292567A1
• Time in Patent Office: 1,288 Days
• Field of Search: 361/306.3, 361/308.1, 361/309, 361/311
• US Class Current: 361/306.3
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 1/0053 soldering by means of I.R.
• CPC Class Codes: B23K 1/008 Soldering within a furnace B23K1/012 takes precedence
• CPC Class Codes: B23K 1/203 Fluxing, i.e. applying flux onto surfaces
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: B23K 35/0227 Rods, wires B23K35/0244 takes precedence
• CPC Class Codes: B23K 35/3613 Polymers, e.g. resins
• CPC Class Codes: H01G 4/005 Electrodes
• CPC Class Codes: H01G 4/2325 characterised by the material of the terminals
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: H01L 2224/83825 Solid-liquid interdiffusion
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/01327 Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: Y10T 29/435 Solid dielectric type

Abstract

A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.

Claims

1. A multilayered ceramic capacitor comprising:

first planer internal electrodes in electrical contact with a first external termination;

second planer internal electrodes interleaved with said first planer internal electrodes wherein said second planer internal electrodes are in electrical contact with a second external termination;

a dielectric between said first planer internal electrodes and said second planer internal electrodes; and

at least one of said first external termination and said second external termination comprises transient liquid phase sintering adhesive between at least one of said first external termination and said first planer internal electrodes or said second external termination and said second planer internal electrodes wherein said transient liquid phase sintering adhesive has a melting point of above 300°

C.

2. The multilayered ceramic capacitor of claim 1 further comprising a first lead in electrical contact with said first external termination and a second lead in electrical contact with said second external termination.

3. The multilayered ceramic capacitor of claim 2 wherein said first lead is plated with a material comprising at least one of nickel, copper, gold, silver, tin, palladium and lead.

4. The multilayered ceramic capacitor of claim 2 wherein at least one of said first lead or said second lead is a non-ferrous material or a ferrous material.

5. The multilayered ceramic capacitor of claim 4 wherein said non-ferrous material is selected from copper, phosphor bronze, brass and beryllium copper.

6. The multilayered ceramic capacitor of claim 4 wherein said ferrous material is selected from Alloy 42 and Kovar.

7. The multilayered ceramic capacitor of claim 2 further comprising a second capacitive component wherein said second capacitive component comprises:

third planer internal electrodes in electrical contact with a third external termination;

fourth planer internal electrodes interleaved with said third planer internal electrodes wherein said fourth planer internal electrodes are in electrical contact with a fourth external termination;

a second dielectric between said first planer internal electrodes and said second planer internal electrodes; and

said third external termination is in electrical contact with said first lead and said fourth external termination is in electrical contact with said second lead.

8. The multilayered ceramic capacitor of claim 7 wherein said first external termination is a first distance from said first lead and said third external termination is a second distance from said first lead.

9. The multilayered ceramic capacitor of claim 8 wherein said first distance and said second distance have a difference of no more than 2.54 mm.

10. The multilayered ceramic capacitor of claim 9 wherein said first distance and said second distance have a difference of no more than 0.254 mm.

11. The multilayered ceramic capacitor of claim 7 wherein said third external termination is separated from said first external termination by less than 0.254 mm.

12. The multilayered ceramic capacitor of claim 1 wherein said first, high melting temperature component of the transient liquid phase sintering adhesive comprises at least one member selected from the group consisting of copper, silver, aluminum, gold, platinum, palladium, beryllium, rhodium nickel, cobalt, iron and molybdenum or an alloy of said member.

13. The multilayered ceramic capacitor of claim 1 wherein said second, low melting temperature component of the transient liquid phase sintering adhesive comprises at least one member selected from the group consisting of tin, antimony, bismuth, cadmium, zinc, gallium, indium, tellurium, mercury, thallium, selenium and polonium or an alloy said member.

14. The multilayered ceramic capacitor of claim 1 wherein said transient liquid phase sintering adhesive does not comprise lead.

15. The multilayered ceramic capacitor of claim 1 further comprising a first lead frame in electrical contact with said first external termination wherein said first lead frame is attached to said first external termination.

16. The multilayered ceramic capacitor of claim 15 wherein said first lead frame is plated with a material comprising at least one of nickel, copper, gold, silver, tin, palladium and lead.

17. The multilayered ceramic capacitor of claim 15 wherein said first lead frame is coated with Ni or Cu and overcoating Sn, Ag, Au, Pd, Rh, Pt, Pb, Cu or alloys thereof.

18. The multilayered ceramic capacitor of claim 1 wherein said transient liquid phase sintering adhesive has a melting point of above 400°

C.