Semiconductor module and cooler

• US 8,902,589 B2
• Filed: 04/21/2011
• Issued: 12/02/2014
• Est. Priority Date: 04/21/2010
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Gohara, Hiromichi, Ichimura, Takeshi, Morozumi, Akira
• Primary Examiner(s): Datskovskiy, Michail V
• Application Number:
  US13/634,813
• Publication Number:
  US 20130058041A1
• Time in Patent Office: 1,321 Days
• Field of Search: 361/679.46, 361/679.53, 361/688, 361/689, 361698-714, 361/715, 361717-727, 165 802- 805, 165/104.19, 165/104.26, 165/104.33, 165/104.34, 165/185, 257706-727, 174/15.1, 174/16.3, 622/592
• US Class Current: 361/699
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85447 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/85455 Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A semiconductor module and a cooler capable of cooling a semiconductor element efficiently. The semiconductor module supplies a refrigerant to a water jacket configuring the cooler, to cool a circuit element part disposed on an outer surface of a fin base. This semiconductor module has: a fin connected thermally to the circuit element part; a refrigerant introducing passage in the water jacket, which has a guide part that has one surface and another surface inclined to guide the refrigerant toward one side surface of the fin; a refrigerant discharge passage disposed in the water jacket to be parallel to the refrigerant introducing passage, which has a side wall parallel to another side surface of the fin; and a cooling passage formed in a position for communicating the refrigerant introducing passage and the refrigerant discharge passage with each other in the water jacket. The fin is disposed in the cooling passage.

Claims

1. A semiconductor module in which a refrigerant is supplied from an outside to a water jacket configuring a cooler, to cool a semiconductor element disposed on an outer surface of the cooler, the semiconductor module comprising:

a heat sink connected thermally to the semiconductor element;

a first passage in the water jacket, which extends from a refrigerant introduction port;

a guide part formed along the first passage, including a first surface and a second surface to guide the refrigerant toward one side surface of the heat sink, the first surface being inclined to said one side surface of the heat sink;

a second passage in the water jacket to be parallel to the first passage, which extends to a refrigerant discharge port, the second passage having a side wall parallel to another side surface of the heat sink; and

a third passage that is formed in the water jacket in a position for communicating the first passage and the second passage with each other, the heat sink being disposed in the third passage.

2. The semiconductor module according to claim 1, wherein the first surface and the second surface of the guide part collectively form an angled shape which projects toward the heat sink in the first passage.

3. The semiconductor module according to claim 1, wherein the first surface and the second surface are formed sequentially along an introduction direction of the refrigerant and configured in a manner as to gradually reduce a cross-sectional area of the first passage as the first passage extends from the refrigerant introduction port in the introduction direction and to change a rate of reduction of the cross-sectional area as the first passage extends from the refrigerant introduction port in the introduction direction.

4. The semiconductor module according to claim 3, wherein the rate of reduction of the cross-sectional area is greater at the first surface than at the second surface.

5. The semiconductor module according to claim 1, wherein the second surface of the guide part is parallel to the one side surface of the heat sink.

6. The semiconductor module according to claim 5, wherein the second surface is formed near a terminal end part of the first passage to have a length equal to or less than ¼

of a length between the refrigerant introduction port and the terminal end part, and an interval between the second surface and the heat sink is equal to or less than ⅓

of a maximum width of the first passage.

7. The semiconductor module according to claim 5, wherein the second surface has a concavity formed in the vicinity of a terminal end part of the first passage.

8. The semiconductor module according to claim 1, wherein the first surface and the second surface are inclined to the one side surface of the heat sink by the same angle, such that the guide part is inclined uniformly to the one side surface of the heat sink.

9. The semiconductor module according to claim 1, wherein the refrigerant introduction port and the refrigerant discharge port are disposed respectively on wall surfaces of the water jacket that face each other.

10. The semiconductor module according to claim 1, wherein the refrigerant introduction port and the refrigerant discharge port are disposed on the same wall surface of the water jacket.

11. The semiconductor module according to claim 1, wherein the guide part further includes an inclined member on the first and second surfaces the inclined member having a plurality of surfaces, each forming a different inclination angle to said one side of the heat sink.

12. The semiconductor module according to claim 1, wherein

the cooler has a plurality of semiconductor elements disposed on an outer surface thereof along an introduction direction of the refrigerant, the plurality of semiconductor elements having different heat generation characteristics, and

the guide part is formed such that an inclination angle between the guide part and said one side of the heat sink becomes maximum at a part of the guide part corresponding to a region where the semiconductor element of the greatest heat generation characteristics is disposed.

13. The semiconductor module according to claim 1, wherein the guide part is formed into steps on a bottom surface of the first passage.

14. The semiconductor module according to claim 13, further comprising a second guide part superposed on the guide part and disposed along the first passage, wherein:

the second guide part has one surface and another surface that are inclined to the one side surface of the heat sink, to guide the refrigerant toward the one side surface of the heat sink, and an inclination angle of the one surface of the guide part is different from an inclination angle of the one surface of the second guide part.

15. The semiconductor module according to claim 14, wherein an angled part between the first surface and the second surface of the second guide part is located closer to the refrigerant introduction port than an angled part between the one surface and the other surface of the guide part.

16. The semiconductor module according to claim 13, further comprising a third guide part superposed on the guide part, wherein:

the third guide part has one surface and another surface that are inclined to the one side surface of the heat sink, to guide the refrigerant toward the one side surface of the heat sink.

17. The semiconductor module according to claim 16, wherein the guide part and the third guide part are connected to each other by curved surfaces that are formed continuously between the respective steps or in the introduction direction of the refrigerant.

18. The semiconductor module according to claim 1, further comprising a refrigerant guide piece disposed in the second passage at a position in the vicinity of the third passage, wherein the refrigerant guide piece has a height from a bottom surface of the water jacket equal to or less than 70% of a height of the third passage.

19. The semiconductor module according to claim 1, wherein the heat sink has a rectangular cuboid external shape.

20. The semiconductor module according to claim 1, wherein the heat sink is disposed away from a bottom surface of the third passage.

21. The semiconductor module according to claim 1, further comprising a fin base on which the heat sink is formed, wherein, except for the refrigerant introduction port and the refrigerant discharge port, the water jacket is sealed with the fin base.

22. A cooler for supplying a refrigerant from the outside to a water jacket to cool a semiconductor element disposed on an outer surface thereof, the cooler comprising:

a heat sink connected thermally to the semiconductor element;

a first passage in the water jacket, which extends from a refrigerant introduction port;

a guide part formed along the first passage, including a first surface and a second surface to guide the refrigerant toward one side surface of the heat sink, the first surface being inclined to said one side surface of the heat sink;

a second passage in the water jacket to be parallel to the first passage, which extends to a refrigerant discharge port, the second passage having a side wall parallel to another side surface of the heat sink; and

a third passage that is formed in the water jacket in a position for communicating the first passage and the second passage with each other, the heat sink being disposed in the third passage.