Power inverter

• US 8,902,623 B2
• Filed: 09/05/2013
• Issued: 12/02/2014
• Est. Priority Date: 08/09/2007
• Status: Active Grant

• Current Assignee: Hitachi Astemo Ltd. (Hitachi, Ltd.)
• Original Assignee: Hitachi, Ltd.
• Inventors: Nishikimi, Fusanori, Nakatsu, Kinya
• Primary Examiner(s): Tran, Nguyen
• Application Number:
  US14/018,613
• Publication Number:
  US 20140016387A1
• Time in Patent Office: 453 Days
• Field of Search: 363/40, 363/55, 363/56.01, 363/71, 363/72, 363/98, 363/109, 363/131, 363/141, 361/760, 361/761, 361/763, 361/767, 361/775, 361/796, 361/679.46, 361/679.47, 361/703, 361/831
• US Class Current: 363/144
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H02M 7/219 in a bridge configuration
• CPC Class Codes: H02M 7/5387 in a bridge configuration
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.

Claims

1. A power inverter comprising:

a power module that converts a direct current to an alternating current; and

a capacitor module that smooths the direct current;

wherein;

the power module comprises;

a plurality of first power semiconductor devices that constitutes U-phase, V-phase and W-phase upper arms of an inverter circuit;

a plurality of second power semiconductor devices that constitutes U-phase, V-phase and W-phase lower arms of the inverter circuit;

an insulation substrate on which the plurality of first power semiconductor devices are mounted;

a power module case that encloses the plurality of first power semiconductor devices and the plurality of second power semiconductor devices and is formed in a rectangular shape including at least a first side and a second side which is disposed opposite to the first side;

a first direct current positive terminal and a first direct current negative terminal that protrude from the first side of the power module case;

a second direct current positive terminal and a second direct current negative terminal that protrude from the first side of the power module case;

an alternating current power line that protrudes from the second side of the power module case;

a positive conductor that transmits electric current flowing between the first and second direct current positive terminals and the plurality of first power semiconductor devices; and

a negative conductor that transmits electric current flowing between the first and second direct current negative terminals and the plurality of second power semiconductor devices;

the capacitor module includes a capacitor positive terminal connected to the first and second direct current positive terminals and a capacitor negative terminal connected to the first and second direct current negative terminals;

each of the positive conductor and the negative conductor includes;

an extended portion that passes through an area facing the insulation substrate with the plurality of the first power semiconductor devices therebetween;

a U-phase junction that is extended to a vicinity of a space between the U-phase first power semiconductor device and the U-phase second semiconductor device;

a V-phase junction that is extended to a vicinity of a space between the V-phase first power semiconductor device and the V-phase second semiconductor device;

a W-phase junction that is extended to a vicinity of a space between the W-phase first semiconductor device and the W-phase second semiconductor device; and

the extended portion of the positive conductor and the extended portion of the negative conductor are laminated by sandwiching an insulation member in a middle of the area.

2. A power inverter according to claim 1, wherein:

the positive conductor is formed integrally with the first and second direct current positive terminals; and

the negative conductor is formed integrally with the first and second direct current negative terminals.

3. A power inverter according to claim 1, further comprising:

a chassis that forms a coolant passage, wherein;

the power module is disposed in the chassis on one side of the coolant passage so as to face the collant passage;

the capacitor module is disposed on another side of the coolant passage so as to place the coolant passage between the power module and the capacitor module;

a through hole is formed at a side portion of the coolant passage; and

the capacitor positive terminal extends from the other side on which the capacitor module is disposed to the one side on which the power module is disposed through the through hole.

4. A power inverter according to claim 3, wherein:

the capacitor module includes a terminal cover that covers the capacitor positive terminal and the capacitor negative terminal; and

the terminal cover extends from the other side on which the capacitor module is disposed to the one side on which the power module is disposed through the through hole.

5. A power inverter according to claim 3, wherein:

the power module includes a metal base on which the insulation substrate is mounted;

an opening that is open to the coolant passage is formed in the chassis; and

the metal base covers the opening.