Light-emitting diode (LED) wafer picker

• US 8,904,629 B2
• Filed: 03/09/2012
• Issued: 12/09/2014
• Est. Priority Date: 03/09/2012
• Status: Active Grant

• Current Assignee: LG CNS Company Limited (LG Corporation)
• Original Assignee: LG CNS Company Limited (LG Corporation), Robostar Co., Ltd.
• Inventors: Yang, Il Chan, Ryu, In Hwan, Lee, Hak Pyo, Lee, Ho Joong
• Primary Examiner(s): TRINH, MINH N
• Application Number:
  US13/415,982
• Publication Number:
  US 20130234194A1
• Time in Patent Office: 1,005 Days
• Field of Search: 29740-743, 298/32, 294/188, 294/65, 294/86.4, 4147522-7527
• US Class Current: 29/743
• CPC Class Codes: B25J 11/0095 Manipulators transporting wafers
• CPC Class Codes: B25J 15/0616 with vacuum
• CPC Class Codes: B65G 47/911 with air blasts producing partial vacuum
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53191 Means to apply vacuum directly to position or hold work part

Abstract

A light-emitting diode (LED) wafer picker that may increase a suction force and may perform stable adsorption without a concern for contact with a top surface of an LED wafer is provided. An LED wafer picker may include a main body to hold, in an adsorbed state, an LED wafer disposed below the main body, when air drawn in from a top of the LED wafer picker is discharged along a streamlined discharge surface to both sides of the LED wafer picker, a guide member to enable the air to flow along the discharge surface, the guide member being disposed below the discharge surface, a single central hole formed in a central portion of the guide member, excluding a portion facing the discharge surface, and a support portion to support the LED wafer, the support portion extending downward from the guide member. Accordingly, it is possible to easily perform adsorption of an LED wafer that is relatively far from the LED wafer picker. Additionally, it is possible to prevent the top surface of the LED wafer from coming into contact with the guide member, thereby reducing detects due to contamination of foreign substances.

Claims

1. A light-emitting diode (LED) wafer picker, comprising:

a main body to hold, in an adsorbed state, an LED wafer disposed below the main body, when air drawn in from a top of the LED wafer picker is discharged along a streamlined discharge surface to both sides of the LED wafer picker;

a guide member to enable the air to flow along the discharge surface, the guide member being disposed below the discharge surface;

a single central hole formed in a central portion of the guide member, excluding a portion facing the discharge surface; and

a support portion to support the LED wafer, the support portion extending downward from the guide member,

wherein an inclined taper is formed in a lower end of the support portion to have a gradually decreasing diameter toward the lower end of the support portion.

2. The LED wafer picker of claim 1, wherein the main body comprises a sensor hole that is formed in the main body within a range of a diameter of the central hole and into which a sensor is inserted.