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Wireless IC device

  • US 8,905,316 B2
  • Filed: 05/03/2011
  • Issued: 12/09/2014
  • Est. Priority Date: 05/14/2010
  • Status: Active Grant
First Claim
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1. A wireless IC device comprising:

  • a dielectric body including an upper surface and a lower surface;

    a radiator provided on a surface of the dielectric body; and

    a wireless IC element coupled to a feeding portion of the radiator;

    whereinthe radiator includes a flexible metal pattern;

    a plurality of concave portions are provided on at least one of the upper and lower surfaces of the dielectric body so as to increase a flexibility of the dielectric body; and

    each of the plurality of concave portions includes an opening at the respective upper or lower surface of the dielectric body;

    the plurality of concave portions are open and not filled with conductive material; and

    the radiator is disposed on the at least one of the upper and lower surfaces of the dielectric body on which the plurality of concave portions are provided, extends across the openings of the plurality of concave portions, and is not in contact with any surfaces of any of the plurality of concave portions.

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