Electronic spectacle frames

• US 8,905,541 B2
• Filed: 11/17/2011
• Issued: 12/09/2014
• Est. Priority Date: 07/02/2010
• Status: Active Grant

• Current Assignee: E-Vision Optics LLC
• Original Assignee: Mitsui Chemicals Incorporated (Mitsui Chemicals)
• Inventors: Blum, Ronald D., Haddock, Joshua N., Graham, Mark, Wang, Yongping, Dalla Longa, Claudio
• Primary Examiner(s): DANG, HUNG XUAN
• Application Number:
  US13/298,992
• Publication Number:
  US 20120127420A1
• Time in Patent Office: 1,118 Days
• Field of Search: 351/158, 351/49, 351/41
• US Class Current: 351/158
• CPC Class Codes: G02C 1/10 Special mounting grooves in the rim or on the lens
• CPC Class Codes: G02C 11/10 Electronic devices other than hearing aids
• CPC Class Codes: G02C 5/146 having special front end
• CPC Class Codes: G02C 5/2236 comprising a sliding hinge member and a coil spring
• CPC Class Codes: G02C 7/081 Ophthalmic lenses with variable focal length
• CPC Class Codes: G02C 7/101 having an electro-optical light valve electro-optical elements per se G02F
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

Embodiments may provide a first device that includes a frame having a first temple and a second temple. The frame may also comprise a housing module coupled (e.g. attached) to a structural member. The first device may further include a first lens and a second lens coupled to the frame and an electronics module that may be located within the housing module. The electronics module may include at least any two of: a power source; a controller; and/or a sensing mechanism.

Claims

1. A first device, comprising:

a frame comprising a first temple and a second temple, wherein the frame comprises a housing module coupled to a structural member;

a first lens and a second lens coupled to the frame; and

an electronics module, wherein the electronics module is located within the housing module;

wherein the electronics module comprises at least any two of;

a power source;

a controller; and

a sensing mechanism; and

wherein an insulating layer is disposed between one or more electronic components located within the electronics module and the frame of the first device.

2. The first device of claim 1, wherein the housing module comprises the insulating layer.

3. The first device of claim 2, wherein the electronics module comprises a conductive material.

4. The first device of claim 1, wherein the housing module comprises a conductive material;

and

wherein the insulating layer is disposed between at least a portion of the housing module and the electronics module.

5. The first device of claim 1, wherein the insulating layer comprises a portion of the electronics module.

6. The first device of claim 5, wherein the housing module comprises a conductive material.

7. The first device of claim 1, wherein the electronics module is removably coupled to the housing module.

8. The first device of claim 7, wherein the electronics module is adapted to be removed and recoupled to the housing module.

9. The first device of claim 1, wherein the housing module comprises a first end, a second end, and a body disposed between the first end and the second end;

wherein the first end comprises an opening; and

wherein the electronics module is configured to be inserted into the opening.

10. The first device of claim 9, wherein the electronics module is pressure fitted to the housing module.

11. The first device of claim 9, wherein the electronics module is located within the body of the housing module.

12. The first device of claim 1, wherein the structural member comprises a cavity in the first temple;

and wherein the housing module is configured to be selectively placed within the cavity.

13. The first device of claim 1, wherein the housing module further comprises an aperture disposed on an outer side of the housing module.

14. The first device of claim 13, wherein the sensing mechanism comprises a touch sensitive switch exposed substantially through the aperture.

15. The first device of claim 14, wherein the touch sensitive switch is a capacitance switch.

16. The first device of claim 1, wherein the structural member comprises the first temple.

17. The first device of claim 16, wherein the first temple comprises a first portion and second portion, and wherein the housing module comprises the first portion of the first temple.

18. The first device of claim 1, wherein the housing module has a thickness that is less than or equal to approximately 0.7 mm.

19. A method of fabricating a device,

wherein the device comprises

a frame having a first temple and second temple;

and

a housing module comprising;

a first end and a second end, wherein the first end comprises an opening; and

a body disposed between the first and second end, wherein the body comprises a cavity;

wherein the method comprises inserting an electronics module into the opening of the first end of the housing module such that the electronics module is disposed in the cavity of the body of the housing module.