Temperature sensor attachment facilitating thermal conductivity to a measurement point and insulation from a surrounding environment

• US 8,905,635 B2
• Filed: 09/30/2011
• Issued: 12/09/2014
• Est. Priority Date: 09/30/2011
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Clark, Matthew, Stark, Terry Dean, Goblish, George, Koshiol, Myles
• Primary Examiner(s): KAPLAN VERBITSKY, GAIL
• Application Number:
  US13/250,478
• Publication Number:
  US 20130083326A1
• Time in Patent Office: 1,166 Days
• Field of Search: 374/170, 374/141, 374/185, 374/163, 374/100, 374117-119, 702/130, 356/459, 735/040.8, 735/033, 735/041.2
• US Class Current: 374/170
• CPC Class Codes: G01K 1/16 Special arrangements for conducting heat from the object to the sensitive element

Abstract

A temperature sensor package includes a temperature sensor having a first side and a second side, wherein the first side of the temperature sensor includes an active region configured for coupling with a target area for temperature measurement of an object. The temperature sensor package further includes a circuit board having a first side and a second side, the first side of the circuit board coupled to the second side of the temperature sensor, wherein the circuit board provides thermal insulation between the active region of the temperature sensor and an environment on the second side of the circuit board.

Claims

1. A temperature sensor package comprising:

a temperature sensor having a first side and a second side, wherein the first side of the temperature sensor includes an active region configured for coupling with a target area for temperature measurement of an object within a laser gyroscope; and

a circuit board having a first side and a second side, the first side of the circuit board coupled to the second side of the temperature sensor, wherein the circuit board provides thermal insulation between the active region of the temperature sensor and an environment on the second side of the circuit board.

2. The temperature sensor package of claim 1, further comprising:

a thermal insulator having a first side and a second side, the first side of the thermal insulator coupled to the second side of the circuit board; and

wherein the thermal insulator further provides thermal insulation between the active region of the temperature sensor and the environment on the second side of the circuit board.

3. The temperature sensor package of claim 2, wherein the circuit board is a flexible circuit board;

and

wherein the thermal insulator is a stiffener configured to stiffen the flexible circuit board facilitating mounting of the second side of the temperature sensor to the first side of the circuit board.

4. The temperature sensor package of claim 3, wherein the second side of the temperature sensor is attached to the first side of the circuit board by soldering.

5. The temperature sensor package of claim 2, wherein the first side of the thermal insulator is positioned on the second side of the circuit board substantially opposite the second side of the temperature sensor.

6. The temperature sensor package of claim 2, wherein the first side of the thermal insulator covers a first area of the second side of the circuit board at least as large as a second area of the first side of the circuit board covered by the second side of the temperature sensor.

7. The temperature sensor package of claim 1, wherein the object is a substrate.

8. The temperature sensor package of claim 1, wherein the object is a laser block;

and

wherein the laser gyroscope is a ring laser gyroscope.

9. The temperature sensor package of claim 1, wherein the object is a laser block.

10. The temperature sensor package of claim 1, wherein the laser gyroscope is a ring laser gyroscope.

11. A ring laser gyroscope package comprising:

a laser block having a top surface and a side surface;

a temperature sensor having a first side and a second side, wherein the first side includes an active region attached to a target area of the side surface of the laser block for temperature measurement of the laser block; and

a circuit board having a first side and a second side, a first portion of the first side of the circuit board attached to the top portion of the laser block and a second portion of the first side of the circuit board attached to the second side of the temperature sensor, wherein the circuit board provides thermal insulation between the active region of the temperature sensor and an environment on the second side of the circuit board.

12. The gyroscope package of claim 11, further comprising:

a thermal insulator having a first side and a second side, the first side of the thermal insulator coupled to the second side of the circuit board; and

wherein the thermal insulator provides further thermal insulation between the active region of the temperature sensor and the environment on the second side of the circuit board.

13. The gyroscope package of claim 12, wherein the circuit board is a flexible circuit board;

and

wherein the thermal insulator is a stiffener configured to stiffen the flexible circuit board facilitating mounting of the second side of the temperature sensor to the first side of the circuit board.

14. The gyroscope package of claim 13, wherein the second side of the temperature sensor is attached to the first side of the circuit board by soldering.