Dual gate oxide trench MOSFET with channel stop trench
First Claim
1. A semiconductor device comprising:
- a plurality of gate electrodes over a gate insulator layer formed in active trenches located in an active region of a semiconductor substrate;
a first gate runner formed in a first gate runner trench in the semiconductor substrate and electrically connected to the gate electrodes, wherein the first gate runner abuts and surrounds the active region;
a second gate runner formed in a second gate runner trench and connected to the first gate runner for making contact to a gate metal; and
wherein an insulator layer in the first and second gate runner trenches have respective thicknesses T2 greater than a thickness T1 of the gate insulator layer in the active trenches,wherein the thicknesses T2 are thick enough to support a blocking voltage, wherein each active trench contains a single electrode electrically connected to a gate potential as a gate electrode, wherein the active trench is filled only with the single electrode and the gate insulator layer.
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Accused Products
Abstract
A semiconductor device and fabrication methods are disclosed. The device includes a plurality of gate electrodes formed in trenches located in an active region of a semiconductor substrate. A first gate runner is formed in the substrate and electrically connected to the gate electrodes, wherein the first gate runner surrounds the active region. A second gate runner is connected to the first gate runner and located between the active region and a termination region. A termination structure surrounds the first and second gate runners and the active region. The termination structure includes a conductive material in an insulator-lined trench in the substrate, wherein the termination structure is electrically shorted to a source or body layer of the substrate thereby forming a channel stop for the device.
43 Citations
20 Claims
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1. A semiconductor device comprising:
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a plurality of gate electrodes over a gate insulator layer formed in active trenches located in an active region of a semiconductor substrate; a first gate runner formed in a first gate runner trench in the semiconductor substrate and electrically connected to the gate electrodes, wherein the first gate runner abuts and surrounds the active region; a second gate runner formed in a second gate runner trench and connected to the first gate runner for making contact to a gate metal; and wherein an insulator layer in the first and second gate runner trenches have respective thicknesses T2 greater than a thickness T1 of the gate insulator layer in the active trenches, wherein the thicknesses T2 are thick enough to support a blocking voltage, wherein each active trench contains a single electrode electrically connected to a gate potential as a gate electrode, wherein the active trench is filled only with the single electrode and the gate insulator layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor device comprising:
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a plurality of gate electrodes over a gate insulator layer formed in active trenches located in an active region of a semiconductor substrate; a first gate runner formed in a first gate runner trench in the semiconductor substrate and electrically connected to the gate electrodes, wherein the first gate runner abuts and surrounds the active region; a second gate runner formed in a second gate runner trench and connected to the first gate runner for making contact to a gate metal; and wherein an insulator layer in the first and second gate runner trenches have respective thicknesses T2 greater than a thickness T1 of the gate insulator layer in the active trenches, wherein the thicknesses T2 are thick enough to support a blocking voltage, wherein the first or second gate runner trench contains a single gate runner electrically connected to a gate potential, wherein the gate runner trench is filled only with the single gate runner and the gate insulator layer. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification