Touch screen assemblies for electronic devices
First Claim
Patent Images
1. A touch screen assembly for an electronic device, the touch screen assembly comprising:
- a sealing glass comprising ion-exchange strengthened glass having a first coefficient of thermal expansion CTE1, and a plurality of touch sensor electrodes formed on at least an underside of the sealing glass opposite a face of the sealing glass;
a backplane glass comprising ion-exchangeable glass having a device surface, an underside and a second coefficient of thermal expansion CTE2, wherein CTE2 is within +/−
15.0×
10−
7/°
C. of CTE1 and the device surface of the backplane glass is bonded and hermetically sealed to the underside of the sealing glass with a frit seal, the frit seal enclosing a device area between the underside of the sealing glass and the device surface of the backplane glass;
an array of metal oxide thin film transistors deposited on the device surface of the backplane glass in the device area;
wherein the array of metal oxide thin film transistors have a third coefficient of thermal expansion CTE3 which is within +/−
15.0×
1031 7/°
C. of CTE2; and
an array of OLED devices formed over the array of metal oxide thin film transistors in the device area on the device surface of the backplane glass.
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Accused Products
Abstract
In one embodiment, a touch screen assembly includes a sealing glass comprising ion-exchange strengthened glass having a first coefficient of thermal expansion CTE1. The assembly may also include a backplane glass comprising ion-exchangeable glass having a device surface, an underside and a second coefficient of thermal expansion CTE2, wherein CTE2 is within +/−15.0×10−7/° C. of CTE1. The device surface of the backplane glass is bonded and hermetically sealed to the underside of the sealing glass with a frit seal which encloses a device area between the underside of the sealing glass and the device surface of the backplane glass. An array of metal oxide thin film transistors may be deposited on the device surface of the backplane glass in the device area, wherein the array of metal oxide thin film transistors have a third coefficient of thermal expansion CTE3 that is within +/−15.0×10−7/° C. of CTE2.
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Citations
19 Claims
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1. A touch screen assembly for an electronic device, the touch screen assembly comprising:
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a sealing glass comprising ion-exchange strengthened glass having a first coefficient of thermal expansion CTE1, and a plurality of touch sensor electrodes formed on at least an underside of the sealing glass opposite a face of the sealing glass; a backplane glass comprising ion-exchangeable glass having a device surface, an underside and a second coefficient of thermal expansion CTE2, wherein CTE2 is within +/−
15.0×
10−
7/°
C. of CTE1 and the device surface of the backplane glass is bonded and hermetically sealed to the underside of the sealing glass with a frit seal, the frit seal enclosing a device area between the underside of the sealing glass and the device surface of the backplane glass;an array of metal oxide thin film transistors deposited on the device surface of the backplane glass in the device area;
wherein the array of metal oxide thin film transistors have a third coefficient of thermal expansion CTE3 which is within +/−
15.0×
1031 7/°
C. of CTE2; andan array of OLED devices formed over the array of metal oxide thin film transistors in the device area on the device surface of the backplane glass. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A touch screen assembly for an electronic device, the touch screen assembly comprising:
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a sealing glass formed from ion-exchange strengthened alkali-alumino silicate glass having a first coefficient of thermal expansion CTE1, and a plurality of touch sensor electrodes formed on at least an underside of the sealing glass opposite a face of the sealing glass; a backplane glass formed from alkali-alumino silicate glass having the same composition as the sealing glass, the backplane glass having a device surface which is free of alkali ions and an underside, wherein the device surface of the backplane glass is bonded and hermetically sealed to the underside of the sealing glass with a frit seal, the frit seal enclosing a device area between the underside of the sealing glass and the device surface of the backplane glass; an array of metal oxide thin film transistors deposited on the device surface of the backplane glass in the device area; and an array of OLED devices formed over the array of metal oxide thin film transistors in the device area on the device surface of the backplane glass. - View Dependent Claims (14, 15, 16, 17, 18)
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19. A touch screen assembly for an electronic device, the touch screen assembly comprising:
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a sealing glass comprising ion-exchange strengthened glass having a depth of layer of at least 30 μ
m, a compressive stress greater than or equal to 500 MPa, and a first coefficient of thermal expansion CTE1;a backplane glass a device surface, an underside and a second coefficient of thermal expansion CTE2, wherein CTE2 is within +/−
15.0×
10−
7/°
C. of CTE1 and the device surface of the backplane glass is bonded and hermetically sealed to the underside of the sealing glass with a frit seal, the frit seal enclosing a device area between the underside of the sealing glass and the device surface of the backplane glass; andan array of metal oxide thin film transistors deposited on the device surface of the backplane glass in the device area, wherein the array of metal oxide thin film transistors have a third coefficient of thermal expansion CTE3 such that CTE3 is within +/−
15.0×
10−
7/°
C. of CTE2.
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Specification
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Current AssigneeCorning Incorporated
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Original AssigneeCorning Incorporated
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InventorsOrsley, Timothy J.
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Primary Examiner(s)Haley, Joseph
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Assistant Examiner(s)ILUYOMADE, IFEDAYO B
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Application NumberUS13/421,366Publication NumberTime in Patent Office999 DaysField of SearchNoneUS Class Current345/76CPC Class CodesG06F 2203/04103 Manufacturing, i.e. details...G06F 3/0412 Digitisers structurally int...G06F 3/0446 using a grid-like structure...
