Fabrication of a high fill ratio silicon spatial light modulator

• US 8,908,255 B2
• Filed: 03/12/2012
• Issued: 12/09/2014
• Est. Priority Date: 10/28/2005
• Status: Expired due to Fees

• Current Assignee: Miradia Inc. (Walsin Lihwa Corporation)
• Original Assignee: Miradia Inc. (Walsin Lihwa Corporation)
• Inventors: Yang, Xiao, Wang, Yuxiang, Ji, Wook, Payne, Justin Allen, Wang, Ye, Woo, Howard
• Primary Examiner(s): Pham, Thomas K
• Assistant Examiner(s): THOMAS, BRANDI N
• Application Number:
  US13/418,186
• Publication Number:
  US 20120171623A1
• Time in Patent Office: 1,002 Days
• Field of Search: 359/237, 359290-292, 359/295, 359/298
• US Class Current: 359/290
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300° C. to maintain a state of the planarizing material.

Claims

1. A method of forming an optical deflection device, the method comprising:

providing a semiconductor substrate comprising an upper surface and one or more patterned structures on the upper surface, wherein at least one open region is formed between the upper surface and the patterned structures;

forming a planarized material layer overlying the patterned structures and filling the at least one open region; and

forming a mirror plate comprising a silicon material on the planarized material layer at a temperature of less than 300°

C.

2. The method of claim 1 wherein the silicon material is substantially amorphous silicon.

3. The method of claim 2 wherein forming the mirror plate is performed at a temperature of less than 200°

C.

4. The method of claim 3 wherein forming the mirror plate is performed at a temperature of less than 100°

C.

5. The method of claim 2 wherein forming the mirror plate comprises performing a physical vapor deposition process.

6. The method of claim 1 wherein the planarized material layer comprises photoresist.

7. The method of claim 6 wherein forming the planarized material layer comprises:

depositing a photoresist layer;

partially exposing the photoresist layer; and

developing the partially exposed photoresist layer.

8. The method of claim 1 wherein the state of the planarized material layer comprises a cross-sectional shape of the planarized material layer.

9. The method of claim 1 further comprising patterning the silicon material to form a mirror structure.

10. The method of claim 9 further comprising removing the planarized material layer to release the mirror structure.

11. The method of claim 1 further comprising removing a portion of the planarized material layer to expose a hinge device providing a base region for the mirror plate.

12. A method of forming a planarized layer, the method comprising:

providing a semiconductor substrate comprising an upper surface and one or more patterned structures on the upper surface, wherein at least one open region is formed between the upper surface and the patterned structures;

dispensing a fill material having a fluid characteristic on the substrate to fill the at least one open region and to form an upper planarized layer on the patterned structures.

13. The method of claim 12 wherein the open region is characterized by a width to depth aspect ratio of less than one.

14. The method of claim 12 wherein the fill material comprises an organic material.

15. The method of claim 14 wherein the fill material comprises photoresist.

16. The method of claim 14 wherein the fill material comprises a spin on glass material.

17. The method of claim 12 wherein the fluid characteristic is selected to cause the formation of the upper planarized layer.

18. The method of claim 12 further comprising rotating the substrate about an axis during at least a portion of the dispensing step.

19. The method of claim 12 wherein the at least one open region is characterized by a spatial characteristic, the spatial characteristic being at least as large as the patterned structure region.

20. The method of claim 12 wherein the one or more patterned structure regions comprise at least two electrode structures.

21. The method of claim 12 wherein the upper planarized layer forms a fabrication base for a mirror structure.

22. The method of claim 12, further comprising reducing the thickness of the upper planarized layer.

23. The method of claim 12 wherein the upper planarized layer is characterized by a peak to valley roughness of less than 50 nm.