Wireless communication with dielectric medium
First Claim
1. An electronic device comprising:
- a first dielectric substrate;
at least a first electronic circuit supported by the substrate, for processing data;
at least a first communication unit having a first antenna, the first communication unit mounted to the substrate in communication with the at least a first electronic circuit for converting between a first EHF electromagnetic signal containing digital information and a first data signal conducted by the at least a first electronic circuit, the first electromagnetic signal transmitted or received along a first signal path by the first antenna; and
a first electromagnetic signal guide assembly including a first dielectric element made of a first dielectric material disposed proximate the first antenna in the first signal path and having sides extending along the first signal path, and a first sleeve element extending around the first dielectric element along at least a portion of the sides of the first dielectric element, the first sleeve element impeding transmission of the first electromagnetic signal through the sides of the first dielectric element.
4 Assignments
0 Petitions
Accused Products
Abstract
An electronic device may include a dielectric substrate, an electronic circuit supported by the substrate, for processing data, and a communication unit having an antenna. The communication unit may be mounted to the substrate in communication with the electronic circuit for converting between a first EHF electromagnetic signal containing digital information and a data signal conducted by the electronic circuit. The electromagnetic signal may be transmitted or received along a signal path by the antenna. An electromagnetic signal guide assembly may include a dielectric element made of a dielectric material disposed proximate the antenna in the signal path. The electromagnetic signal guide may have sides extending along the signal path. A sleeve element may extend around the dielectric element along sides of the dielectric element. The sleeve element may impede transmission of the electromagnetic signal through the sides of the dielectric element.
-
Citations
28 Claims
-
1. An electronic device comprising:
-
a first dielectric substrate; at least a first electronic circuit supported by the substrate, for processing data; at least a first communication unit having a first antenna, the first communication unit mounted to the substrate in communication with the at least a first electronic circuit for converting between a first EHF electromagnetic signal containing digital information and a first data signal conducted by the at least a first electronic circuit, the first electromagnetic signal transmitted or received along a first signal path by the first antenna; and a first electromagnetic signal guide assembly including a first dielectric element made of a first dielectric material disposed proximate the first antenna in the first signal path and having sides extending along the first signal path, and a first sleeve element extending around the first dielectric element along at least a portion of the sides of the first dielectric element, the first sleeve element impeding transmission of the first electromagnetic signal through the sides of the first dielectric element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
-
13. A first electronic connector element comprising:
-
a first EHF comm-link chip, a first dielectric material encasing the first comm-link chip and extending from the first chip toward a first interface surface spaced from the first comm-link chip, the first comm-link chip being configured to transmit or receive an electromagnetic signal having a first signal path extending through the dielectric material and the first interface surface, and a shielding material supported by the dielectric material and extending from a first side of the first interface surface around the first comm-link chip opposite the first interface surface to a second side of the first interface surface spaced from the first side of the first interface surface, the shielding material being made of one of an electrically conductive material, an electromagnetically absorptive material, and an electromagnetically dissipative material. - View Dependent Claims (14, 17, 18, 19, 20)
-
-
15. The first electronic connector element of 13, wherein the shielding material is electrically conductive and is connected to a circuit ground of the first comm-link chip.
-
16. The first electronic connector element of 13, wherein the shielding material is configured to substantially absorb and dissipate EHF radiation that reaches the shielding material from the electromagnetic signal.
-
21. A system comprising:
-
a first device including a first electrical circuit and a first electronic connector component having a first dielectric material, a first EHF comm-link chip embedded in the first dielectric material and connected to the first electrical circuit for communicating a first electromagnetic signal that propagates along a first signal path passing through the first dielectric material, and an electrically conductive shielding layer extending around at least a portion of the first signal path in the first dielectric material; and a second device including a second electrical circuit and a second electronic connector component having a second dielectric material and a second EHF comm-link chip embedded in the second dielectric material and connected to the second electrical circuit for communicating a second electromagnetic signal that propagates along a second signal path passing through the second dielectric material, the first and second EHF comm-link chips being configured to communicate with each other when the first and second electronic connector components are positioned with the first dielectric material in contact with the second dielectric material with the first signal path aligned with the second signal path, and communication along the first and second signal paths occurs substantially entirely through the first dielectric material and the second dielectric material. - View Dependent Claims (22, 23)
-
-
24. An adapter for interconnecting a first electronic device having a first electrically conductive connector element with a second electronic device having an EHF electromagnetic signal connector element, the adapter including
a dielectric material; -
an EHF comm-link chip embedded in the dielectric material and configured to communicate the electromagnetic signal with the electromagnetic signal connector element; and a second electrically conductive connector element electrically connected to the comm-link chip and configured to electrically connect to the first electrically conductive connector element; and further comprising a sleeve forming a channel, the comm-link chip being disposed at a first end of the channel, the sleeve being sized and configured to receive the electromagnetic signal connector element.
-
-
25. A system comprising:
-
a first device including a first EHF comm-link chip assembly configured to transmit a first EHF electromagnetic signal, a first shield partly surrounding the first EHF comm-link chip assembly, and a first circuit in communication with the first EHF comm-link chip assembly; and a second device having a second EHF comm-link chip assembly configured to receive the first EHF electromagnetic signal and a second shield partly surrounding the second EHF comm-link chip assembly;
the first and second shields being configured mutually to create a substantially continuous shield around the first and second EHF comm-link chip assemblies when the first and second devices are aligned. - View Dependent Claims (26, 27, 28)
-
Specification