Wireless communication with dielectric medium

• US 8,909,135 B2
• Filed: 09/14/2012
• Issued: 12/09/2014
• Est. Priority Date: 09/15/2011
• Status: Active Grant

• Current Assignee: Molex LLC (KOCH Industries Incorporated)
• Original Assignee: Keyssa, Inc.
• Inventors: McCormack, Gary D., Kyles, Ian A.
• Primary Examiner(s): Trinh, Sonny
• Application Number:
  US13/618,138
• Publication Number:
  US 20130070817A1
• Time in Patent Office: 816 Days
• Field of Search: 455/41.2, 455/333, 455/39, 455/90.1, 455/73, 257/728, 333/239, 343/905
• US Class Current: 455/39
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/495 Lead-frames or other flat leads H01L23/498 takes precedence; lead frame interconnections between components H01L23/52
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01Q 1/2291 : used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN] H01Q1/241 takes precedence; WLAN in general H04W
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 23/00 : Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 7/00 : Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 9/0485 : Dielectric resonator antennas
• CPC Class Codes: H01Q 9/265 : Open ring dipoles; Circular dipoles
• CPC Class Codes: H04B 1/18 : Input circuits, e.g. for coupling to an antenna or a transmission line coupling networks between antennas or lines and receivers independent of the nature of the receiver H03H
• CPC Class Codes: H04B 1/40 : Circuits
• CPC Class Codes: H04B 5/72 : for local intradevice communication
• CPC Class Codes: H04B 5/79 : for data transfer in combination with power transfer
• CPC Class Codes: H05K 1/0243 : Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/144 : Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 2201/0723 : provided by an inner layer of PCB
• CPC Class Codes: H05K 2201/10522 : Adjacent components
• CPC Class Codes: H05K 9/0056 : specially adapted for microwave applications

Abstract

An electronic device may include a dielectric substrate, an electronic circuit supported by the substrate, for processing data, and a communication unit having an antenna. The communication unit may be mounted to the substrate in communication with the electronic circuit for converting between a first EHF electromagnetic signal containing digital information and a data signal conducted by the electronic circuit. The electromagnetic signal may be transmitted or received along a signal path by the antenna. An electromagnetic signal guide assembly may include a dielectric element made of a dielectric material disposed proximate the antenna in the signal path. The electromagnetic signal guide may have sides extending along the signal path. A sleeve element may extend around the dielectric element along sides of the dielectric element. The sleeve element may impede transmission of the electromagnetic signal through the sides of the dielectric element.

Claims

1. An electronic device comprising:

a first dielectric substrate;

at least a first electronic circuit supported by the substrate, for processing data;

at least a first communication unit having a first antenna, the first communication unit mounted to the substrate in communication with the at least a first electronic circuit for converting between a first EHF electromagnetic signal containing digital information and a first data signal conducted by the at least a first electronic circuit, the first electromagnetic signal transmitted or received along a first signal path by the first antenna; and

a first electromagnetic signal guide assembly including a first dielectric element made of a first dielectric material disposed proximate the first antenna in the first signal path and having sides extending along the first signal path, and a first sleeve element extending around the first dielectric element along at least a portion of the sides of the first dielectric element, the first sleeve element impeding transmission of the first electromagnetic signal through the sides of the first dielectric element.

2. The electronic device of claim 1, wherein the first sleeve element is made of one of an electrically conductive material, an electromagnetically absorptive material, an electromagnetically dissipative material, and a second dielectric material having a dielectric constant that is lower than a dielectric constant of the first dielectric element.

3. The electronic device of claim 2, wherein the first sleeve element is made of the second dielectric material and has sides extending along the signal path corresponding to the sides of the first dielectric element, and the signal guide includes a second sleeve element disposed around the sides of the first sleeve element and made of the electromagnetically dissipative material.

4. The electronic device of claim 1, wherein the first communication unit is a transceiver.

5. The electronic device of claim 1, wherein the at least a first communication unit includes a second communication unit having a second antenna, the second communication unit mounted to the substrate in communication with the at least a first electronic circuit for converting between a second EHF electromagnetic signal containing digital information and a second data signal conducted by the at least a first electronic circuit, the second electromagnetic signal transmitted or received along a second signal path by the second antenna;

and

wherein the electromagnetic signal guide assembly further includes a second dielectric element made of a third dielectric material disposed proximate the second antenna in the second signal path and having sides extending along the second signal path, and a second sleeve element extending around the second dielectric element along at least a portion of the sides of the second dielectric element, the second sleeve element impeding transmission of the second electromagnetic signal through the sides of the second dielectric element.

6. The electronic device of claim 5, wherein the second sleeve element is made of a fourth dielectric material having a dielectric constant that is lower than a dielectric constant of the second dielectric element, the second sleeve element having sides extending along the second signal path corresponding to the sides of the second dielectric element, and the signal guide assembly further includes a sleeve assembly disposed around the sides of the first and second sleeve elements, extending continuously between the first and second sleeve elements, and being made of one of an electrically conductive material, an electromagnetically absorptive material, and an electromagnetically dissipative material.

7. The electronic device of claim 5, wherein the first communication unit is a transmitter and the second communication unit is a receiver.

8. An electronic system comprising the electronic device of claim 1 as a first electronic device, the electronic system further comprising a second electronic device including:

a second dielectric substrate;

at least a second electronic circuit supported by the second substrate, for processing data;

at least a second communication unit having a second antenna, the second communication unit mounted to the second substrate in communication with the at least a second electronic circuit for converting between a second EHF electromagnetic signal containing digital information and a second data signal conducted by the at least a second electronic circuit, the second electromagnetic signal transmitted or received along a second signal path by the second antenna; and

a second electromagnetic signal guide assembly including a second dielectric element made of a second dielectric material disposed proximate the second antenna in the second signal path and having sides extending along the second signal path, and a second sleeve element extending around the second dielectric element along at least a portion of the sides of the second dielectric element, the second sleeve element impeding transmission of the second electromagnetic signal through the sides of the second dielectric element.

9. The electronic system of claim 8, wherein the first communication unit is a transmitter, the second communication unit is a receiver configured to communicate with the first communication unit when the first guide assembly is positioned proximate to and facing the second guide assembly.

10. The electronic system of claim 9, wherein the first and second dielectric elements have corresponding dimensions transverse to the respective first and second signal paths, and when the first guide assembly is positioned proximate to and facing the second guide assembly and the second signal path is aligned with the first signal path, the first sleeve element aligns with the second sleeve element and the first and second sleeve elements in combination impede transmission of the first electromagnetic signal through the sides of the first and second dielectric elements.

11. The electronic system of claim 10, wherein the first and second sleeve elements are made of a material that forms in combination an electric, magnetic, or electromagnetic shield extending along the first and second dielectric elements when the first sleeve element is placed against the second sleeve element.

12. The electronic system of claim 11, wherein the first and second dielectric elements of the two guide assemblies have same cross-section dimensions, and the first and second sleeve elements extend behind the respective first and second communication units.

13. A first electronic connector element comprising:

a first EHF comm-link chip,

a first dielectric material encasing the first comm-link chip and extending from the first chip toward a first interface surface spaced from the first comm-link chip, the first comm-link chip being configured to transmit or receive an electromagnetic signal having a first signal path extending through the dielectric material and the first interface surface, and

a shielding material supported by the dielectric material and extending from a first side of the first interface surface around the first comm-link chip opposite the first interface surface to a second side of the first interface surface spaced from the first side of the first interface surface, the shielding material being made of one of an electrically conductive material, an electromagnetically absorptive material, and an electromagnetically dissipative material.

14. The first electronic connector element of claim 13, wherein the shielding material forms a continuous loop around the interface surface.

17. A system comprising the first electronic connector element of claim 13 and a second electronic connector element, the first electronic connector element further comprising a first mating element forming at least a portion of the first interface surface, the second electronic connector element comprising a second EHF comm-link chip, a second mating surface spaced from the second comm-link chip and a second mating element forming at least a portion of a second interface surface, the second comm-link chip being configured to transmit or receive an electromagnetic signal having a second signal path extending through the second interface surface, the first and second mating elements being complementary and including a combination of a recess formed in one of the first and second interface surfaces and a protrusion formed in the other of the first and second interface surfaces, the protrusion being configured to be received in the recess when the first and second interface surfaces are placed in close proximity to each other, and the first and second comm-link chips are configured to communicate an EHF signal between the first electronic connector element and the second electronic connector element.

18. The first electronic connector element of claim 13, further comprising a second dielectric material at least partially surrounding the first dielectric material transverse to the first signal path, the first dielectric material having a dielectric constant that is substantially higher than a dielectric constant of the second dielectric material.

19. The first electronic connector element of claim 13, wherein the first comm-link chip includes an integrated circuit (IC), an antenna in communication with the IC, and an insulating material holding the IC and antenna in a fixed location.

20. The first electronic connector element of claim 13, wherein the first dielectric material has a dielectric constant between approximately 2 and approximately 5.

15. The first electronic connector element of 13, wherein the shielding material is electrically conductive and is connected to a circuit ground of the first comm-link chip.

16. The first electronic connector element of 13, wherein the shielding material is configured to substantially absorb and dissipate EHF radiation that reaches the shielding material from the electromagnetic signal.

21. A system comprising:

a first device including a first electrical circuit and a first electronic connector component having a first dielectric material, a first EHF comm-link chip embedded in the first dielectric material and connected to the first electrical circuit for communicating a first electromagnetic signal that propagates along a first signal path passing through the first dielectric material, and an electrically conductive shielding layer extending around at least a portion of the first signal path in the first dielectric material; and

a second device including a second electrical circuit and a second electronic connector component having a second dielectric material and a second EHF comm-link chip embedded in the second dielectric material and connected to the second electrical circuit for communicating a second electromagnetic signal that propagates along a second signal path passing through the second dielectric material, the first and second EHF comm-link chips being configured to communicate with each other when the first and second electronic connector components are positioned with the first dielectric material in contact with the second dielectric material with the first signal path aligned with the second signal path, and communication along the first and second signal paths occurs substantially entirely through the first dielectric material and the second dielectric material.

22. The system of claim 21, wherein the electrically conductive shielding layer is a circuit ground for the first electrical circuit.

23. The system of claim 21, wherein the electrically conductive shielding layer is configured to substantially absorb and dissipate EHF electromagnetic radiation.

24. An adapter for interconnecting a first electronic device having a first electrically conductive connector element with a second electronic device having an EHF electromagnetic signal connector element, the adapter including

a dielectric material;

an EHF comm-link chip embedded in the dielectric material and configured to communicate the electromagnetic signal with the electromagnetic signal connector element; and

a second electrically conductive connector element electrically connected to the comm-link chip and configured to electrically connect to the first electrically conductive connector element; and

further comprising a sleeve forming a channel, the comm-link chip being disposed at a first end of the channel, the sleeve being sized and configured to receive the electromagnetic signal connector element.

25. A system comprising:

a first device including a first EHF comm-link chip assembly configured to transmit a first EHF electromagnetic signal, a first shield partly surrounding the first EHF comm-link chip assembly, and a first circuit in communication with the first EHF comm-link chip assembly; and

a second device having a second EHF comm-link chip assembly configured to receive the first EHF electromagnetic signal and a second shield partly surrounding the second EHF comm-link chip assembly;

the first and second shields being configured mutually to create a substantially continuous shield around the first and second EHF comm-link chip assemblies when the first and second devices are aligned.

26. The system of claim 25, wherein the first EHF comm-link chip assembly is in communication with the first circuit and configured to receive a second EHF electromagnetic signal when the first and second devices are aligned;

the second device further includes a second circuit, the second EHF comm-link chip assembly being in communication with the second circuit and configured to transmit the second EHF electromagnetic signal.

27. The system of claim 25, wherein the first and second devices are configured such that alignment of the devices results in substantial alignment of the first and second EHF comm-link chip assemblies, and substantial alignment of the first and second EHF comm-link chip assemblies includes both lateral and proximal alignment sufficient to enable adequate signal communication between the first and second EHF comm-link chip assemblies.

28. The system of claim 25, wherein the first EHF comm-link chip assembly includes insulating material, an integrated circuit (IC), and an antenna that communicates with the IC and is fixed in location relative to the IC by the insulating material.