Electronic device, electronic apparatus, and method of manufacturing electronic device
First Claim
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1. An electronic device comprising:
- a function element disposed within a cavity on a substrate and electrically driven;
a covering portion which has electric conductivity and sections the cavity from an interlayer insulation film surrounding the circumference of the cavity;
a wiring which connects with the function element and penetrates the covering portion; and
a liquid flow preventing portion disposed at the position where the wiring penetrates the covering portion to prevent flow of etchant dissolving the interlayer insulation film from the cavity toward the interlayer insulation film and insulate the wiring from the covering portion,wherein the liquid flow preventing portion has a side wall extension which projects from the covering portion toward the interlayer insulation film.
1 Assignment
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Accused Products
Abstract
An electronic device includes: a vibrator disposed within a cavity on a substrate and electrically driven; an enclosure wall which has electric conductivity and sections the cavity from an insulation layer surrounding the circumference of the cavity; a first wiring and a second wiring which connect with the vibrator and penetrate the enclosure wall; and a liquid flow preventing portion disposed at the position where the first wiring and the second wiring penetrate the enclosure wall to prevent flow of etchant dissolving the insulation layer from the cavity toward the insulation layer and insulate the first wiring and the second wiring from the enclosure wall.
31 Citations
13 Claims
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1. An electronic device comprising:
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a function element disposed within a cavity on a substrate and electrically driven; a covering portion which has electric conductivity and sections the cavity from an interlayer insulation film surrounding the circumference of the cavity; a wiring which connects with the function element and penetrates the covering portion; and a liquid flow preventing portion disposed at the position where the wiring penetrates the covering portion to prevent flow of etchant dissolving the interlayer insulation film from the cavity toward the interlayer insulation film and insulate the wiring from the covering portion, wherein the liquid flow preventing portion has a side wall extension which projects from the covering portion toward the interlayer insulation film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An electronic device, comprising:
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a substrate; a covering portion disposed on the substrate such that a part of the covering portion is opposed to another part of the covering portion with a gap interposed between the opposed parts; an insulation film disposed on the substrate in such a position as to surround the covering portion in the plan view as viewed in the substrate thickness direction; a function element having an electrode and disposed in a space whose outer periphery is defined by the substrate and the covering portion; and a wiring disposed on the substrate and extending between the space and the insulation film in the plan view as viewed in the substrate thickness direction to connect with the electrode, wherein the covering portion has a side wall surrounding the function element in the plan view as viewed in the substrate thickness direction, and a cover disposed away from the function element and closing the upper part of the space, and the side wall has a second insulation film disposed in contact with the wiring and containing a material different from the material of the insulation film, and a conductive portion disposed in contact with the second insulation film. - View Dependent Claims (12)
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13. An electronic device comprising:
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a substrate; a covering portion which is disposed on the substrate such that a part of the covering portion is opposed to another part of the covering portion with a gap interposed between the opposed parts, and has electric conductivity; an insulation film disposed on the substrate in such a position as to surround the covering portion in the plan view as viewed in the substrate thickness direction; a function element having an electrode and disposed in a space whose outer periphery is defined by the substrate and the covering portion; and a wiring disposed on the substrate and extending between the space and the insulation film in the plan view as viewed in the substrate thickness direction to connect with the electrode, wherein the covering portion has a side wall surrounding the function element in the plan view as viewed in the substrate thickness direction, and a cover disposed away from the function element and closing the upper part of the space, the side wall at the position where the wiring penetrates the covering portion has a side wall extension extending toward the insulation film in the plan view as viewed in the substrate thickness direction, and the insulation film extends between the side wall extension and the wiring.
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Specification
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Current AssigneeSeiko Epson Corporation (Seiko Group)
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Original AssigneeSeiko Epson Corporation (Seiko Group)
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InventorsKanemoto, Yoko, Kihara, Ryuji
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Primary Examiner(s)Garber, Charles
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Assistant Examiner(s)Seven, Evren
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Application NumberUS13/306,493Publication NumberTime in Patent Office1,113 DaysField of SearchUS Class Current438/52CPC Class CodesB81B 2201/0271 Resonators; ultrasonic reso...B81B 2207/07 InterconnectsB81C 1/00801 Avoid alteration of functio...B81C 2201/053 Depositing a protective layersY10T 29/49165 by forming conductive walle...
