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Interfacing between an integrated circuit and a waveguide through a cavity located in a soft laminate

  • US 8,912,858 B2
  • Filed: 09/08/2009
  • Issued: 12/16/2014
  • Est. Priority Date: 09/08/2009
  • Status: Active Grant
First Claim
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1. A device comprising:

  • a low loss substrate comprising, on a first side, a contact location for a mm-wave integrated circuit, and on a second side, a waveguide location;

    a planar transmission line extending along said first side from said contact location to above said waveguide location as a monopole waveguide feed;

    wherein the planar transmission line including said monopole waveguide feed extends along a single planar conducting layer;

    connection bumps configured to connect said mm-wave integrated circuit to said low loss substrate at said contact location;

    a soft laminate comprising a second cavity located below the waveguide location;

    the second cavity configured to receive a wave transmission from the waveguide feed and forward said wave transmission to a waveguide located below the second cavity; and

    a back-short located essentially above the waveguide location;

    the back-short comprises a first cavity of depth equivalent to about a quarter wave-length, and is configured to reflect energy into said waveguide.

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