Method for manufacturing optical device, optical device, and biological information detector

• US 8,915,857 B2
• Filed: 02/07/2011
• Issued: 12/23/2014
• Est. Priority Date: 02/18/2010
• Status: Expired due to Fees

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Iijima, Yoshitaka, Miyasaka, Hideo, Nakajima, Satoshi
• Primary Examiner(s): Cheng, Jacqueline
• Assistant Examiner(s): Agahi, Puya
• Application Number:
  US13/022,177
• Publication Number:
  US 20110199613A1
• Time in Patent Office: 1,415 Days
• Field of Search: 600/301, 600/500, 600/310, 600/319, 600/323, 600/347, 600/473, 600/476, 600/502, 600/503
• US Class Current: 600/500
• CPC Class Codes: A61B 5/01 Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue clinical contact thermometers G01K13/20
• CPC Class Codes: A61B 5/02427 Details of sensor
• CPC Class Codes: A61B 5/02438 with portable devices, e.g. worn by the patient
• CPC Class Codes: A61B 5/1455 using optical sensors, e.g. spectral photometrical oximeters
• CPC Class Codes: A61B 5/14552 Details of sensors specially adapted therefor
• CPC Class Codes: A61B 5/681 Wristwatch-type devices
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/85186 connecting first outside the semiconductor or solid-state body, i.e. off-chip, reverse stitch
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12043 : Photo diode
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: Y10T 29/49826 : Assembling or joining

Abstract

An optical device comprises a substrate having a first surface and a second surface being opposite the first surface; a light-emitting element having a first center, installed on the second surface; and a light-receiving element having a second center, installed on the first surface. At least a part of the light-emitting element is arranged at a position, overlapping the light-receiving element with respect to a plan view; the light-receiving element, installed after the light-emitting element, has a bonding pad, provided at a position displaced relative to the second center towards a first direction with respect to the plan view; and the first center is provided at a position displaced relative to the second center towards a second direction, being opposite the first direction DR1, with respect to the plan view.

Claims

1. An optical device, comprising:

a substrate having a first surface and a second surface that is opposite the first surface;

a light-emitting element having a first center;

a light-receiving element having a second center, the light-receiving element being installed at a side of the first surface, the light-receiving element further having a rectangular shape with respect to a plan view as viewed in a normal direction relative to the first surface or the second surface, at least a part of the light-emitting element being arranged at a position that overlaps the light-receiving element with respect to the plan view;

a bonding pad being provided at a position that is displaced relative to the second center towards a first direction which is perpendicular to the normal direction, the bonding pad being disposed adjacent to a corner of the light-receiving element with respect to the plan view;

a first reflecting part configured to reflect light emitted by the light-emitting element, the first reflecting part including a first side part and a second side part opposite the first side part, the first side part being disposed on the second surface of the substrate, the light-emitting element being disposed on the second side part, the first reflecting part having a center axis that extends in the normal direction through a diameter center of a diameter of the first reflecting part in the first direction,

the first center being provided at a position that is displaced relative to the second center towards a second direction, which is opposite the first direction and in a direction away from the first center, with respect to the plan view,

the first center of the light-emitting element aligning the center axis of the first reflecting part with respect to the plan view.

2. The optical device according to claim 1, wherein

the light-emitting element has a rectangular profile with respect to the plan view;

wherein

one side of the rectangle profile of the light-emitting element is tangent to a circle having a given radius and having a fourth center positioned on the bonding pad with respect to the plan view.

3. The optical device according to claim 1, wherein

the light-emitting element has a rectangular profile with respect to the plan view;

wherein

one side of the rectangle profile of the light-emitting element is perpendicular to a direction in which the first center and the second center are connected, with respect to the plan view.

4. The optical device according to claim 1, wherein

the entirety of the light-emitting element is arranged at a position at which there is a complete overlapping of the light-receiving element with respect to the plan view.

5. A biological information detector, comprising:

optical device according to of claim 1,

a contact part formed from a material that is transparent with respect to a wavelength of light emitted by the light-emitting element, the contact part having a surface in contact with a test subject; and

a second reflecting part configured to reflect light having biological information;

wherein

the light-emitting element emits light directed at a detection site of the test subject;

the light-receiving element receives light having biological information, the light being light emitted by the light-emitting element and reflected at the detection site;

the substrate is a flexible substrate formed from a material that is transparent with respect to the wavelength of light emitted by the light-emitting element; and

the biological information is a pulse rate.