Method for manufacturing semiconductor device
First Claim
1. A method for manufacturing a semiconductor device comprising the steps of:
- forming an oxide semiconductor film over a first oxide insulating film;
etching the oxide semiconductor film to form an island-shaped oxide semiconductor film;
forming an insulating film over the island-shaped oxide semiconductor film;
forming a gate electrode over the insulating film;
forming sidewalls in contact with side surfaces of the gate electrode;
etching part of the insulating film where the gate electrode and the sidewalls do not overlap to form a gate insulating film;
forming a second oxide insulating film over the gate electrode, the sidewalls, and the island-shaped oxide semiconductor film;
forming a metal film over the second oxide insulating film;
adding oxygen to the metal film to form a metal oxide film, and adding oxygen also to the second oxide insulating film;
forming an interlayer insulating film over the metal oxide film; and
forming a pair of contact plugs electrically connected to the island-shaped oxide semiconductor film through openings in the interlayer insulating film, the metal oxide film, and the second oxide insulating film.
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Accused Products
Abstract
To improve productivity of a transistor that includes an oxide semiconductor and has good electrical characteristics. In a top-gate transistor including a gate insulating film and a gate electrode over an oxide semiconductor film, a metal film is formed over the oxide semiconductor film, oxygen is added to the metal film to form a metal oxide film, and the metal oxide film is used as a gate insulating film. After an oxide insulating film is formed over the oxide semiconductor film, a metal film may be formed over the oxide insulating film. Oxygen is added to the metal film to form a metal oxide film and added also to the oxide semiconductor film or the oxide insulating film.
159 Citations
14 Claims
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1. A method for manufacturing a semiconductor device comprising the steps of:
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forming an oxide semiconductor film over a first oxide insulating film; etching the oxide semiconductor film to form an island-shaped oxide semiconductor film; forming an insulating film over the island-shaped oxide semiconductor film; forming a gate electrode over the insulating film; forming sidewalls in contact with side surfaces of the gate electrode; etching part of the insulating film where the gate electrode and the sidewalls do not overlap to form a gate insulating film; forming a second oxide insulating film over the gate electrode, the sidewalls, and the island-shaped oxide semiconductor film; forming a metal film over the second oxide insulating film; adding oxygen to the metal film to form a metal oxide film, and adding oxygen also to the second oxide insulating film; forming an interlayer insulating film over the metal oxide film; and forming a pair of contact plugs electrically connected to the island-shaped oxide semiconductor film through openings in the interlayer insulating film, the metal oxide film, and the second oxide insulating film. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for manufacturing a semiconductor device comprising the steps of:
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forming an oxide semiconductor film over a first oxide insulating film; etching the oxide semiconductor film to form an island-shaped oxide semiconductor film; forming a first metal film over the island-shaped oxide semiconductor film; adding oxygen to the first metal film to form a first metal oxide film, and adding oxygen also to the island-shaped oxide semiconductor film; forming a gate electrode over the first metal oxide film; forming sidewalls in contact with side surfaces of the gate electrode; etching part of the first metal oxide film where the gate electrode and the sidewalls do not overlap; forming a second oxide insulating film over the gate electrode, the sidewalls, and the island-shaped oxide semiconductor film; forming a second metal film over the second oxide insulating film; adding oxygen to the second metal film to form a second metal oxide film, and adding oxygen also to the second oxide insulating film; forming an interlayer insulating film over the second metal oxide film; and forming a pair of contact plugs electrically connected to the island-shaped oxide semiconductor film through openings in the interlayer insulating film, the second metal oxide film, and the second oxide insulating film. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
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Specification