Arrangement of a power semiconductor circuit
First Claim
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1. A power electronic assembly comprising:
- a heat sink as a cooling body (2),a power semiconductor module (1), anda circuit arrangement (3) for controlling the power semiconductor module,wherein the cooling body (2) comprises at least two parallel channels for accommodating flowing coolant,wherein the channels are connected with one another by at least one first connecting channel,wherein a first plurality of first adjacent channels of the channels form supply channels having end regions connected with one another by way of the first connecting channel, and a second plurality of second adjacent channels of the channels form return channels having start regions which are connected with one another via the first connecting channel and which are connected with the end regions of the supply channels,wherein start regions of the supply channels are located on a first side of the cooling body, and the at least one first connecting channel is located on a second, opposite side of the cooling body.
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Abstract
The invention relates to a power electronic assembly (1, 2, 3) with a heat sink (2), a power semiconductor module (1) and a circuit arrangement (3) for controlling the power semiconductor module, wherein the heat sink (2) has at least two parallel channels through which a coolant can flow.
15 Citations
17 Claims
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1. A power electronic assembly comprising:
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a heat sink as a cooling body (2), a power semiconductor module (1), and a circuit arrangement (3) for controlling the power semiconductor module, wherein the cooling body (2) comprises at least two parallel channels for accommodating flowing coolant, wherein the channels are connected with one another by at least one first connecting channel, wherein a first plurality of first adjacent channels of the channels form supply channels having end regions connected with one another by way of the first connecting channel, and a second plurality of second adjacent channels of the channels form return channels having start regions which are connected with one another via the first connecting channel and which are connected with the end regions of the supply channels, wherein start regions of the supply channels are located on a first side of the cooling body, and the at least one first connecting channel is located on a second, opposite side of the cooling body. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An arrangement (A) comprising several power electronic assemblies, each power electronic assembly comprising:
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a heat sink as a cooling body (2), a power semiconductor module (1) and a circuit arrangement (3) for controlling, the power semiconductor module, wherein the cooling body (2) comprises at least two parallel channels for accommodating flowing coolant, wherein the channels are connected with one another by at least one first connecting channel, wherein a first plurality of first adjacent channels of the channels torn supply channels having end regions connected with one another by way of the first connecting channel, and a second plurality of second adjacent channels of the channels form return channels having start regions which are connected with one another via the first connecting channel and which are connected with the end regions of the supply channels, wherein start regions of the supply channels are located on a first side of the cooling body, and the at least one first connecting channel is located on a second, opposite side of the cooling body. - View Dependent Claims (13, 14, 15)
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16. An arrangement (A) comprising several power electronic assemblies, each power electronic assembly comprising:
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a heat sink as a cooling body (2), a power semiconductor module (1) and a circuit arrangement (3) for controlling the power semiconductor module, wherein the cooling body (2) comprises at least two parallel channels for accommodating flowing coolant, wherein the channels are connected with one another by at least one first connecting channel, wherein a first plurality of first adjacent channels of the channels form supply channels having end regions connected with one another by way of the first connecting channel, and a second plurality of second adjacent channels of the channels form return channels having start regions which are connected with one another via the first connecting channel and which are connected with the end regions of the supply channels, wherein the power electronic assemblies are arranged with respect to one another such that the channels are arranged parallel to one another.
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17. An arrangement (A) comprising several power electronic assemblies, each power electronic assembly comprising:
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a heat sink as a cooling body (2), a power semiconductor module (1) and a circuit arrangement (3) for controlling the power semiconductor module, wherein the cooling body (2) comprises at least two parallel channels for accommodating flowing coolant, wherein the channels are connected with one another by at least one first connecting channel, wherein a first plurality of first adjacent channels of the channels form supply channels having end regions connected with one another by way of the first connecting channel, and a second plurality of second adjacent channels of the channels form return channels having start regions which are connected with one another via the first connecting channel and which are connected with the end regions of the supply channels, wherein the arrangement (A) comprises supply lines and return lines for a coolant which are connected to the supply channels and the return channels, respectively, with fittings provided in start regions of the supply channels and in end regions of the return channels, respectively, wherein the power electronic assemblies are connected in parallel.
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Specification