Edge-based full chip mask topography modeling
First Claim
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1. A computer-implemented method of performing mask topography effect modeling on a mask design layout, the method comprising:
- applying, using a computing device, a thin mask model to the mask design layout to create a thin mask transmission;
applying a thick mask model to the mask design layout, the thick mask model comprising a plurality of edge-based kernels;
applying a rasterization filter to the plurality of edge-based kernels to generate a plurality of filtered kernels, the applying of the thick mask model comprising applying the plurality of filtered kernels to edges in the mask design layout to produce a mask 3D residual; and
combining the thin mask transmission and the mask 3D residual to create a mask 3D transmission, wherein the mask topography effect modeling on the mask design layout is used to create an improved optical mask for creating an integrated circuit.
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Abstract
A method and apparatus of a novel full chip edge-based mask three-dimensional (3D) model for performing photolithography simulation is described. The method applies a thin mask model to a mask design layout to create a thin mask transmission. The method generates a thick mask model that has a plurality of edge-based kernels. The method applies the thick mask model to the mask design layout to create a mask 3D residual. The method combines the thin mask transmission and the mask 3D residual to create a mask 3D transmission.
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Citations
25 Claims
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1. A computer-implemented method of performing mask topography effect modeling on a mask design layout, the method comprising:
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applying, using a computing device, a thin mask model to the mask design layout to create a thin mask transmission; applying a thick mask model to the mask design layout, the thick mask model comprising a plurality of edge-based kernels; applying a rasterization filter to the plurality of edge-based kernels to generate a plurality of filtered kernels, the applying of the thick mask model comprising applying the plurality of filtered kernels to edges in the mask design layout to produce a mask 3D residual; and combining the thin mask transmission and the mask 3D residual to create a mask 3D transmission, wherein the mask topography effect modeling on the mask design layout is used to create an improved optical mask for creating an integrated circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A data processing system for performing mask topography effect modeling on a mask design layout, the data processing system comprising:
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means for applying a thin mask model to the mask design layout to create a thin mask transmission; means for applying a thick mask model comprising a plurality of edge-based kernels to the mask design layout; means for applying a rasterization filter to the plurality of edge-based kernels to generate a plurality of filtered kernels, wherein the applying of the thick mask model comprises applying the plurality of filtered kernels to edges in the mask design layout to produce a mask three-dimensional (3D) residual; and means for combining the thin mask transmission and the mask 3D residual to create a mask 3D transmission, wherein the mask topography effect modeling on the mask design layout is used to create an improved optical mask for creating an integrated circuit. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A computer program product stored as program code on a non-transitory computer-readable medium, the program code executable by at least one processor for performing mask topography effect modeling on a mask design layout, the computer program product comprising a computer readable program code comprising instructions for:
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applying a thin mask model to the mask design layout to create a thin mask transmission; applying a thick mask model comprising a plurality of edge-based kernels to the mask design layout; applying a rasterization filter to the plurality of edge-based kernels to generate a plurality of filtered kernels, wherein the applying of the thick mask model comprises applying the plurality of filtered kernels to edges in the mask design layout to produce a mask three-dimensional (3D) residual; and combining the thin mask transmission and the mask 3D residual to create a mask 3D transmission, wherein the mask topography effect modeling on the mask design layout is used to create an improved optical mask for creating an integrated circuit. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25)
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Specification