Composite heat-dissipation substrate and manufacturing method of the same

• US 8,920,707 B2
• Filed: 12/24/2012
• Issued: 12/30/2014
• Est. Priority Date: 02/20/2012
• Status: Active Grant

• Current Assignee: Korea Institute of Materials Science (Korea Test Institute of Machinery & Metals)
• Original Assignee: Korea Institute of Machinery & Materials (Dawonsys Co., Ltd.)
• Inventors: Lee, Sang-Kwan, Lee, Sang-Bok, Yun, Jung-Yeul
• Primary Examiner(s): Del Sole, Joseph S
• Assistant Examiner(s): KEMMERLE III, RUSSELL J
• Application Number:
  US13/726,378
• Publication Number:
  US 20130213629A1
• Time in Patent Office: 736 Days
• Field of Search: 264/643
• US Class Current: 264/643
• CPC Class Codes: B22F 7/062 involving the connection or repairing of preformed parts
• CPC Class Codes: B29C 67/04 Sintering combined with compression B29C43/00
• CPC Class Codes: B32B 15/04 comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042
• CPC Class Codes: B32B 18/00 Layered products essentially comprising ceramics, e.g. refractory products
• CPC Class Codes: B32B 2250/03 3 layers
• CPC Class Codes: B32B 2264/107 Ceramic
• CPC Class Codes: B32B 2307/302 Conductive
• CPC Class Codes: B32B 5/16 characterised by features of a layer formed of particles, e.g. chips, powder or granules layer formed of natural mineral particles B32B19/00; layer being formed of wood fibres, chips or particles B32B21/02
• CPC Class Codes: B32B 5/18 characterised by features of a layer of foamed material
• CPC Class Codes: B32B 7/04 Interconnection of layers
• CPC Class Codes: B32B 9/005 comprising one layer of ceramic material, e.g. porcelain, ceramic tile layered products with at least two ceramic layers composed mainly of ceramic B32B18/00
• CPC Class Codes: B32B 9/041 of metal
• CPC Class Codes: C04B 2111/00844 for electronic applications
• CPC Class Codes: C04B 2237/34 Oxidic
• CPC Class Codes: C04B 2237/341 Silica or silicates
• CPC Class Codes: C04B 2237/343 Alumina or aluminates
• CPC Class Codes: C04B 2237/36 Non-oxidic
• CPC Class Codes: C04B 2237/361 Boron nitride
• CPC Class Codes: C04B 2237/365 Silicon carbide
• CPC Class Codes: C04B 2237/366 Aluminium nitride
• CPC Class Codes: C04B 2237/368 : Silicon nitride
• CPC Class Codes: C04B 2237/586 : by joining layers or articles of the same composition but having different densities
• CPC Class Codes: C04B 2237/704 : of one or more of the ceramic layers or articles
• CPC Class Codes: C04B 35/00 : Shaped ceramic products characterised by their composition porous ceramic products C04B38/00; ceramic articles characterised by particular shape, see the relevant classes, e.g. linings for casting ladles, tundishes, cups or the like B22D41/02; ceramic substrates for microelectronic semi-conductors H01L23/15; Ceramics compositions containing free metal bonded to carbides, diamond, oxides, borides, nitrides, silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides or sulfides other than as macroscopic reinforcing agents C22C; shaping of ceramics B28B; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products chemical preparation of powders of inorganic compounds C01; infiltration of sintered ceramic preforms with molten metal C04B41/51
• CPC Class Codes: C04B 35/10 : based on aluminium oxide
• CPC Class Codes: C04B 35/645 : Pressure sintering
• CPC Class Codes: C04B 38/00 : Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof treating slag with gases or gas generating material C04B5/06 ; expanded graphite C04B35/536
• CPC Class Codes: C04B 41/009 : characterised by the material treated
• CPC Class Codes: C04B 41/4521 : application under increased pressure
• CPC Class Codes: C04B 41/4523 : applied from the molten state vitreous materials C04B41/5022; Thermal spraying, e.g. plasma spraying
• CPC Class Codes: C04B 41/5127 : Cu, e.g. Cu-CuO eutectic
• CPC Class Codes: C04B 41/515 : Other specific metals
• CPC Class Codes: C04B 41/5155 : Aluminium
• CPC Class Codes: C04B 41/88 : Metals
• CPC Class Codes: C09K 5/14 : Solid materials, e.g. powdery or granular
• CPC Class Codes: C22C 32/0005 : with at least one oxide and at least one of carbides, nitrides, borides or silicides as the main non-metallic constituents
• CPC Class Codes: C22C 32/0021 : Matrix based on noble metals, Cu or alloys thereof
• CPC Class Codes: C22C 32/0036 : Matrix based on Al, Mg, Be or alloys thereof
• CPC Class Codes: C22C 32/0047 : with carbides, nitrides, borides or silicides as the main non-metallic constituents
• CPC Class Codes: C22C 32/0052 : only carbides
• CPC Class Codes: C22C 32/0068 : only nitrides
• CPC Class Codes: F21V 29/86 : Ceramics or glass
• CPC Class Codes: F21V 29/89 : Metals
• CPC Class Codes: F28F 13/003 : by using permeable mass, perforated or porous materials F28F13/18 takes precedence
• CPC Class Codes: F28F 21/04 : of ceramic; of concrete; of natural stone
• CPC Class Codes: F28F 21/08 : of metal
• CPC Class Codes: H01L 23/3731 : Ceramic materials or glass H01L23/3732, H01L23/3733, H01L23/3735, H01L23/3737, H01L23/3738 take precedence
• CPC Class Codes: H01L 23/3733 : having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures H01L23/3732, H01L23/3737 take precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/642 : characterized by the shape
• CPC Class Codes: Y10T 428/24992 : Density or compression of components
• CPC Class Codes: Y10T 428/249957 : Inorganic impregnant

Abstract

The present disclosure provides a composite heat-dissipation substrate and a method of manufacturing the same. The composite heat-dissipation substrate includes a first ceramic layer having insulating properties, a second porous ceramic layer and a metal layer, wherein the first ceramic layer and the second ceramic layer are continuously connected to each other so as not to form an interface therebetween, and the metal layer is infiltrated into plural pores of the second ceramic layer to be coupled to the ceramic layers, whereby interfacial coupling force between the ceramic layers and the metal layer is very high, thereby providing significantly improved heat dissipation characteristics.

Claims

1. A method of manufacturing a composite heat-dissipation substrate, comprising:

i) preparing a first ceramic powder having insulating properties;

ii) stacking a powder mixture of a second ceramic powder and a pore forming material on the first ceramic powder;

iii) forming a porous ceramic structure by evaporating the pore forming material and sintering the first ceramic powder and the powder mixture; and

iv) infiltrating a molten metal into plural pores formed in the porous ceramic structure to be impregnated into the porous ceramic structure.

2. The method according to claim 1, wherein the first ceramic layer and the second ceramic layer have a thermal conductivity of 1 W/m·

K or more at room temperature.

3. The method according to claim 2, wherein the ceramic material comprises at least one selected from carbides such as SiC and B₄C, oxides such as Al₂O₃, MgO and SiO₂, and nitrides such as AlN, Si₃N₄ and BN.

4. The method according to claim 1, wherein the first ceramic layer and the second ceramic layer comprise a ceramic material having a coefficient of thermal expansion of 12×

10<sup>−

6</sup> or less and an insulation resistance of 10⁵ Ω

cm or more.

5. The method according to claim 1, wherein the pore forming material is evaporated at a temperature less than or equal to a sintering temperature of the first and second ceramic powders.

6. The method according to claim 1, wherein the metal layer comprises a metal having a thermal conductivity of 50 W/m·

K or more at room temperature.

7. The method according to claim 6, wherein the metal comprises at least one selected from Al, Al alloys, Mg, Mg alloys, Cu and Cu alloys.

8. The method according to claim 1, wherein the sintering temperature ranges from 1000°

C. to 1800°

C.

9. The method according to claim 1, wherein the squeeze infiltrating is performed at a temperature 30˜

200°

C. higher than the melting point of the metal and at a pressure of 60 MPa or less.