Hybrid MEMS bump design to prevent in-process and in-use stiction

• US 8,921,145 B2
• Filed: 03/07/2014
• Issued: 12/30/2014
• Est. Priority Date: 08/01/2012
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Shu, Chia-Pao, Tai, Kelvin, Hung, Calvin, Chen, Benior
• Primary Examiner(s): Blum, David S
• Application Number:
  US14/200,635
• Publication Number:
  US 20140186986A1
• Time in Patent Office: 298 Days
• Field of Search: 438/50, 257/E21.002, 257/E29.324
• US Class Current: 438/50
• CPC Class Codes: B81B 3/00 Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes B81B5/00 takes precedence
• CPC Class Codes: B81B 3/001 Structures having a reduced contact area, e.g. with bumps or with a textured surface
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: B81C 1/00015 for manufacturing microsystems
• CPC Class Codes: B81C 99/00 Subject matter not provided for in other groups of this subclass
• CPC Class Codes: H01L 29/84 controllable by variation of applied mechanical force, e.g. of pressure

Abstract

A micro-electro-mechanical systems (MEMS) device and method for forming a MEMS device is provided. A proof mass is suspended a distance above a surface of a substrate by a fulcrum. A pair of sensing plates are positioned on the substrate on opposing sides of the fulcrum. Metal bumps are associated with each sensing plate and positioned near a respective distal end of the proof mass. Each metal bump extends from the surface of the substrate and generally inhibits charge-induced stiction associated with the proof mass. Oxide bumps are associated with each of the pair of sensing plates and positioned between the respective sensing plate and the fulcrum. Each oxide bump extends from the first surface of the substrate a greater distance than the metal bumps and acts as a shock absorber by preventing the distal ends of the proof mass from contacting the metal bumps during shock loading.

Claims

1. A method for forming a micro-electro-mechanical systems (MEMS) device, the method comprising:

providing a substrate;

forming a metal layer over the substrate;

patterning the metal layer to form a pair of sensing plates and a plurality of metal bumps, wherein a pivot axis of a proof mass is defined between the pair of sensing plates, and wherein each of the plurality of metal bumps are positioned proximate to a respective distal end of the proof mass, wherein each metal bump generally inhibits charge-induced stiction associated with the proof mass;

forming an oxide layer over the substrate; and

patterning the oxide layer to form an oxide bump associated with each of the pair of sensing plates, wherein each oxide bump is positioned between the respective sensing plate and the pivot axis, and wherein each oxide bump generally acts as a shock absorber by preventing the distal ends of the proof mass from contacting the metal bumps during shock loading.

2. The method of claim 1, further comprising forming the proof mass over the substrate, wherein a lower surface of the proof mass is suspended a first distance above a first surface of the substrate by a fulcrum associated with the pivot axis.

3. The method of claim 2, wherein the proof mass comprises a rectangular beam, and wherein each metal bump is associated with a respective corner of the rectangular beam.

4. The method of claim 1, wherein forming the metal layer comprises depositing a metal on the substrate.

5. The method of claim 1, wherein each oxide bump extends a greater distance from the substrate than each metal bump.

6. A method for forming a micro-electro-mechanical systems (MEMS) device, the method comprising:

providing a substrate having a first surface;

forming a proof mass having a fulcrum, wherein a lower surface of the proof mass is suspended a first distance above the first surface of the substrate by the fulcrum, and wherein the proof mass is configured to rotate about the fulcrum;

forming a pair of sensing plates associated with the first surface of the substrate and positioned on opposing sides of the fulcrum;

forming a metal bump associated with each of the pair of sensing plates and positioned proximate to a respective distal end of the proof mass, wherein each metal bump extends a second distance from the first surface of the substrate; and

forming an oxide bump associated with each of the pair of sensing plates and positioned between the respective sensing plate and the fulcrum, wherein each oxide bump extends a third distance from the first surface of the substrate.

7. The method of claim 6, wherein forming the pair of sensing plates further comprises forming a plurality of metal bumps associated with each of the pair of sensing plates, wherein the plurality of metal bumps are arranged on the first surface of the substrate at respective corners of the proof mass.

8. The method of claim 6, wherein forming the pair of sensing plates further comprises forming a plurality of oxide bumps associated with each of the pair of sensing plates, wherein the plurality of oxide bumps are arranged generally parallel to the fulcrum on the first surface of the substrate.

9. The method of claim 6, wherein the substrate comprises silicon.

10. The method of claim 9, wherein providing the substrate comprises forming one or more of an oxide layer and a metal layer formed over the silicon, therein defining the first surface of the substrate.

11. The method of claim 6, wherein each of the metal bumps generally inhibits Van der Waals force stiction associated with the proof mass.

12. The method of claim 6, wherein the fulcrum is displaced from the center of gravity of the proof mass.

13. The method of claim 6, wherein the pair of sensing plates and the proof mass form a capacitance which changes with an acceleration of the substrate induced in one direction.

14. A method for forming a micro-electro-mechanical systems (MEMS) device, the method comprising:

providing a substrate;

suspending a proof mass over the substrate by a fulcrum, wherein the proof mass is configured to rotate about the fulcrum;

forming first and second sensing plates on respective sides of the fulcrum on the substrate;

forming a plurality of metal bumps on the substrate, wherein the plurality of metal bumps are positioned proximate to each distal end of the proof mass, and wherein each of the plurality of metal bumps extends from the substrate; and

forming a plurality of oxide bumps on the substrate, wherein the plurality of oxide bumps are positioned between the respective first and second sensing plates and the fulcrum, and wherein each of the plurality of oxide bumps from the substrate a greater distance than the plurality of metal bumps.

15. The method of claim 14, wherein the proof mass is generally rectangular, and wherein the plurality of metal bumps are arranged on a surface of the substrate proximate to respective corners of the proof mass.

16. The method of claim 14, wherein the plurality of oxide bumps comprise at least two oxide bumps arranged on a surface of the substrate generally parallel to the fulcrum and on each side of the fulcrum.

17. The method of claim 14, wherein the plurality of metal bumps generally inhibits Van der Waals force stiction associated with the proof mass.

18. The method of claim 14, wherein the fulcrum is displaced from the center of gravity of the proof mass.

19. The method of claim 14, wherein the first and second sensing plates and the proof mass form a capacitance which changes with an acceleration of the substrate induced in one direction.

20. The method of claim 14, wherein the forming the metal bumps comprises depositing a metal on the substrate and patterning the metal.