Semiconductor integrated device assembly process
First Claim
1. A process comprising:
- forming a confinement and spacing structure on a first surface of a first body of semiconductor material, the confinement and spacing structure including a confinement element;
placing an elastic spacer material on at least a portion of the confinement and spacing structure;
stacking a second body of semiconductor material over the first body and the elastic spacer material, the stacking causing the elastic spacer material to flow between the first body and the second body while the confinement element confines the flow of the elastic spacer material.
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Accused Products
Abstract
A process for assembly of an integrated device, envisages: providing a first body of semiconductor material integrating at least one electronic circuit and having a top surface; providing a second body of semiconductor material integrating at least one microelectromechanical structure and having a bottom surface; and stacking the second body on the first body with the interposition, between the top surface of the first body and the bottom surface of the second body, of an elastic spacer material. Prior to the stacking step, the step is envisaged of providing, in an integrated manner, at the top surface of the first body a confinement and spacing structure that confines inside it the elastic spacer material and supports the second body at a distance from the first body during the stacking step.
9 Citations
27 Claims
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1. A process comprising:
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forming a confinement and spacing structure on a first surface of a first body of semiconductor material, the confinement and spacing structure including a confinement element; placing an elastic spacer material on at least a portion of the confinement and spacing structure; stacking a second body of semiconductor material over the first body and the elastic spacer material, the stacking causing the elastic spacer material to flow between the first body and the second body while the confinement element confines the flow of the elastic spacer material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method comprising:
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forming a spacing element and a confinement element on a first surface of a first body of semiconductor material, the confinement element having a closed perimeter and the spacing element being located in the closed perimeter of the confinement element; placing an elastic spacer material on the spacing element; placing a second body of semiconductor material over the spacer element and the elastic spacer material, the placing causing the elastic spacer material to flow between the first body and the second body, the elastic spacer material being confined in the closed perimeter by the confinement element. - View Dependent Claims (14, 15, 16, 17)
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18. An assembly of an integrated device, the assembly comprising:
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a first body of semiconductor material and having a top surface; a confinement element located on the top surface of the first body; a spacing element located on the top surface of the first body and within the confinement element; a second body of semiconductor material having a bottom surface, the second body being stacked on the first body and the bottom surface of the second body being over the spacing element; and an elastic spacer material being confined within the confinement element and surrounding the spacer element. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27)
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Specification