Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments

• US 8,921,702 B1
• Filed: 01/21/2010
• Issued: 12/30/2014
• Est. Priority Date: 01/21/2010
• Status: Expired due to Fees

• Current Assignee: HRL Laboratories LLC (The Boeing Co.)
• Original Assignee: HRL Laboratories LLC (The Boeing Co.)
• Inventors: Carter, William B., Gross, Adam F., Guinn, Keith V., Jacobsen, Alan J., Brewer, Peter D., Rogers, Jeffrey L.
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US12/691,322
• Time in Patent Office: 1,804 Days
• Field of Search: 174/252, 361/689, 361/697, 361/700, 165/80.4, 165/104.11, 16510421-10426, 165/164, 165/185, 165/236, 165/260, 257713-715
• US Class Current: 174/252
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 7/20336 Heat pipes, e.g. wicks or capillary pumps

Abstract

In one possible implementation, a thermal plane structure includes a non-wicking structural microtruss between opposing surfaces of a multilayer structure and a thermal transport medium within the thermal plane structure for fluid and vapor transport between a thermal source and a thermal sink. A microtruss wick is located between the opposing surfaces and extends between the thermal source and the thermal sink.

Claims

1. A thermal plane structure comprising:

a) a non-wicking structural microtruss between opposing surfaces of a multilayer structure, the non-wicking structural microtruss being comprised of non-wicking microtruss struts;

b) a thermal transport medium within the thermal plane structure for fluid and vapor transport between a thermal source and a thermal sink;

c) a microtruss wick located between the opposing surfaces and between the thermal source and the thermal sink; and

d) the microtruss wick comprising an ordered three dimensional network of continuous interpenetrating truss members.

2. The thermal plane structure of claim 1, wherein at least one of the opposing surfaces comprises an electrically conductive ground plane.

3. The thermal plane structure of claim 1, wherein the thermal transport medium is hermetically sealed within the thermal plane structure.

4. The thermal plane structure of claim 1, wherein the non-wicking structural microtruss comprises different sized microtruss members than the microtruss wick.

5. The thermal plane structure of claim 1, wherein the thermal plane structure comprises a vapor transport path adjacent the microtruss wick.

6. The thermal plane structure of claim 5, wherein the vapor path extends through the non-wicking structural microtruss.

7. The thermal plane structure of claim 1, wherein the non-wicking structural microtruss extends through a central region of the microtruss wick.

8. The thermal plane structure of claim 1, wherein the thermal plane structure comprises a vapor path extending through a central region of the microtruss wick.

9. The thermal plane structure of claim 1, wherein the microtruss wick comprises a non-uniform distribution.

10. The thermal plane structure of claim 9, wherein the microtruss wick comprises a higher density near the thermal source and a lower density near the thermal sink.

11. The thermal plane structure of claim 9, wherein the microtruss wick comprises a higher density near a periphery of the microtruss wick and a lower density near a center of the microtruss wick.

12. The thermal plane structure of claim 1, wherein the microtruss wick is separate from the non-wicking structural microtruss.

13. The thermal plane structure of claim 1, wherein the microtruss wick is located on the structural microtruss.

14. The thermal plane structure of claim 1, further comprising:

a) the thermal plane structure being hermetically sealed; and

b) at least one of the opposing surfaces comprising an electrically conductive ground plane.

15. The thermal plane structure of claim 1, further comprising a PWB.

16. The thermal plane structure of claim 15, further comprising an electrically conductive ground plane.

17. The thermal plane structure of claim 1, wherein the non-wicking structural microtruss comprises an ordered three dimensional network of continuous interpenetrating truss members.

18. The thermal plane structure of claim 1, wherein the microtruss wick comprises solid truss members.

19. A thermal plane structure comprising:

a) a non-wicking structural microtruss between opposing surfaces of a multilayer structure;

b) a thermal transport medium within the thermal plane structure for fluid and vapor transport between a thermal source and a thermal sink;

c) a microtruss wick located between the opposing surfaces and between the thermal source and the thermal sink;

d) wherein the microtruss wick comprises a non-uniform distribution; and

e) wherein the microtruss wick comprises a higher density near the thermal source and a lower density near the thermal sink.

20. A thermal plane structure comprising:

a) a non-wicking structural microtruss between opposing surfaces of a multilayer structure;

b) a thermal transport medium within the thermal plane structure for fluid and vapor transport between a thermal source and a thermal sink;

c) a microtruss wick located between the opposing surfaces and between the thermal source and the thermal sink;

d) wherein the microtruss wick comprises a non-uniform distribution; and

e) wherein the microtruss wick comprises a higher density near a periphery of the microtruss wick and a lower density near a center of the microtruss wick.