Integrated image sensor package with liquid crystal lens

• US 8,921,759 B2
• Filed: 07/26/2012
• Issued: 12/30/2014
• Est. Priority Date: 07/26/2012
• Status: Active Grant

• Current Assignee: Optiz, Inc.
• Original Assignee: Optiz, Inc.
• Inventors: Oganesian, Vage
• Primary Examiner(s): Epps, Georgia Y
• Assistant Examiner(s): WILLIAMS, DON J
• Application Number:
  US13/559,510
• Publication Number:
  US 20140027612A1
• Time in Patent Office: 887 Days
• Field of Search: 250/208.1, 250/214.1, 250/214.R, 250/216, 250/239, 349/33, 349/37, 349/95, 349/147, 349/149, 349/151, 349/152, 349/155, 349/156, 349/157, 349/158, 345/40, 345/42, 345/90, 345/95, 345/102, 345/103, 257/431, 257/432, 257/433
• US Class Current: 250/216
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A package structure with a sensor chip having a first substrate with front and back opposing surfaces, a plurality of photo detectors and contact pads formed at the front surface and electrically coupled together, a plurality of first electrical contacts each extending from the back surface and through the first substrate to one of the contact pads, and a plurality of second electrical contacts each extending from the back surface and through the first substrate to the front surface. The liquid crystal lens includes a layer of liquid crystal material, one or more lead patterns adjacent the layer of liquid crystal material, and a plurality of third electrical contacts each extending from one of the one or more lead patterns. The sensor chip is mounted to the liquid crystal lens such that each of the third electrical contacts is electrically connected to one of the plurality of second electrical contacts.

Claims

1. A package structure, comprising:

a sensor chip that includes;

a first substrate with front and back opposing surfaces,

a plurality of photo detectors formed at the front surface,

a plurality of contact pads formed at the front surface which are electrically coupled to the photo detectors,

a plurality of first electrical contacts each extending from the back surface and through the first substrate to one of the contact pads, and

a plurality of second electrical contacts each extending from the back surface and through the first substrate to the front surface;

a liquid crystal lens that includes;

a layer of liquid crystal material,

one or more lead patterns adjacent the layer of liquid crystal material, and

a plurality of third electrical contacts each extending from one of the one or more lead patterns;

wherein the sensor chip is mounted to the liquid crystal lens such that each of the third electrical contacts is electrically connected to one of the plurality of second electrical contacts and the plurality of photo detectors are disposed under the liquid crystal material for receiving light passing through the liquid crystal material.

2. The package structure of claim 1, wherein at least one of the second electrical contacts is in electrical contact with one of the contact pads.

3. The package structure of claim 1, wherein at least one of the second electrical contacts is formed through, and in electrical contact with, one of the contact pads.

4. The package structure of claim 1, wherein the sensor chip is mounted to the liquid crystal lens by a spacer which is disposed between the sensor chip and the liquid crystal lens, and wherein the spacer includes a plurality of fourth electrical contacts each extending through the spacer and each electrically connected between one of the plurality of third electrical contacts and one of the plurality of second electrical contacts.

5. The package structure of claim 4, wherein the spacer comprises a cavity disposed over the plurality of photo detectors.

6. The package structure of claim 1, wherein the liquid crystal lens further comprises:

a second substrate adjacent the one or more lead patterns and the layer of liquid crystal material, wherein each of the third electrical contacts extends through the second substrate.

7. The package structure of claim 6, wherein the second substrate is optically transparent.

8. The package structure of claim 6, wherein the liquid crystal lens further comprises:

a third substrate, wherein the one or more lead patterns and the layer of liquid crystal material are disposed between the second and third substrates.

9. The package structure of claim 8, wherein the liquid crystal lens further comprises:

a lens module mounted to one of the second substrate and the third substrate, wherein the lens module includes a plurality of lenses therein.

10. The package structure of claim 9, wherein the sensor chip is mounted to the liquid crystal lens such that the lens module is disposed between the sensor chip and the liquid crystal lens.

11. The package structure of claim 6, wherein the liquid crystal lens further comprises:

an optical element mounted to one of the second substrate and the third substrate.

12. The package structure of claim 1, wherein the sensor chip is mounted to the liquid crystal lens by a layer of adhesive which is disposed between the sensor chip and the liquid crystal lens, and wherein the electrical connections between the third electrical contacts and the second electrical contacts is through the adhesive.

13. A package structure, comprising:

a sensor chip that includes;

a first substrate with front and back opposing surfaces,

a plurality of photo detectors formed at the front surface,

a plurality of contact pads formed at the front surface which are electrically coupled to the photo detectors, and

a plurality of first electrical contacts each extending from the back surface and through the first substrate to one of the contact pads;

a liquid crystal lens that includes;

second and third substrates,

a layer of liquid crystal material disposed between the second and third substrates,

one or more lead patterns adjacent the layer of liquid crystal material and disposed between the second and third substrates, and

a plurality of second electrical contacts each extending from one of the one or more lead patterns and through the second substrate;

wherein the front surface of the sensor chip is mounted to the third substrate of the liquid crystal lens such that the plurality of photo detectors are disposed under the liquid crystal material for receiving light passing through the liquid crystal material.

14. The package structure of claim 13, wherein the front surface of the sensor chip is mounted to the third substrate of the liquid crystal lens by a spacer which is disposed between and attached to the front surface of the sensor chip and the third substrate of the liquid crystal lens.

15. The package structure of claim 14, wherein the spacer comprises a cavity disposed over the plurality of photo detectors.

16. The package structure of claim 13, wherein the second and third substrates are optically transparent.

17. The package structure of claim 13, wherein the liquid crystal lens further comprises:

an optical element mounted to the second substrate.

18. The package structure of claim 13, wherein the liquid crystal lens further comprises:

a lens module mounted to one of the second substrate and the third substrate, wherein the lens module includes a plurality of lenses therein.

19. The package structure of claim 18, wherein the sensor chip is mounted to the liquid crystal lens such that the lens module is disposed between the sensor chip and the liquid crystal lens.

20. The package structure of claim 13, further comprising:

a printed circuit board that includes a plurality of third electrical contacts and which is mounted to the sensor chip such that each of the first electrical contacts is electrically connected to one of the third electrical contacts.

21. The package structure of claim 20, wherein the printed circuit board further includes fourth electrical contacts, the structure further comprising:

a plurality of wires each extending between and electrically connecting one of the second electrical contacts and one of the fourth electrical contacts.

22. The package structure of claim 13, wherein the front surface of the sensor chip is mounted to the third substrate of the liquid crystal lens by a layer of adhesive therebetween.

23. A package structure, comprising:

a sensor chip that includes;

a first substrate with front and back opposing surfaces,

a plurality of photo detectors formed at the back surface,

a plurality of contact pads formed at the back surface which are electrically coupled to the photo detectors, and

a plurality of first electrical contacts each extending from the back surface and through the first substrate to the front surface;

a liquid crystal lens that includes;

a layer of liquid crystal material,

one or more lead patterns adjacent the layer of liquid crystal material, and

a plurality of second electrical contacts each extending from one of the one or more lead patterns;

wherein the sensor chip is mounted to the liquid crystal lens such that each of the second electrical contacts is electrically connected to one of the plurality of first electrical contacts and the plurality of photo detectors are disposed under the liquid crystal material for receiving light passing through the liquid crystal material and through the front surface.

24. The package structure of claim 23, wherein at least one of the first electrical contacts is in electrical contact with one of the contact pads.

25. The package structure of claim 23, wherein at least one of the first electrical contacts is formed through, and in electrical contact with, one of the contact pads.

26. The package structure of claim 23, wherein the sensor chip is mounted to the liquid crystal lens by a spacer which is disposed between the sensor chip and the liquid crystal lens, and wherein the spacer includes a plurality of third electrical contacts each extending through the spacer and each electrically connected between one of the plurality of second electrical contacts and one of the plurality of first electrical contacts.

27. The package structure of claim 26, wherein the spacer comprises a cavity disposed over the plurality of photo detectors.

28. The package structure of claim 23, wherein the liquid crystal lens further comprises:

a second substrate adjacent the one or more lead patterns and the layer of liquid crystal material, wherein each of the second electrical contacts extends through the second substrate.

29. The package structure of claim 28, wherein the liquid crystal lens further comprises:

a third substrate, wherein the one or more lead patterns and the layer of liquid crystal material are disposed between the second and third substrates.

30. The package structure of claim 28, wherein the liquid crystal lens further comprises:

an optical element mounted to one of the second substrate and the third substrate.

31. The package structure of claim 28, wherein the liquid crystal lens further comprises:

a lens module mounted to one of the second substrate and the third substrate, wherein the lens module includes a plurality of lenses therein.

32. The package structure of claim 31, wherein the sensor chip is mounted to the liquid crystal lens such that the lens module is disposed between the sensor chip and the liquid crystal lens.

33. The package structure of claim 23, further comprising:

a handler mounted to the back surface of the sensor chip;

a plurality of third electrical contacts that each extend through the handler and to one of the contact pads;

wherein each of the plurality of first electrical contacts extends through the handler.

34. A package structure, comprising:

a sensor chip that includes;

a first substrate with front and back opposing surfaces,

a plurality of photo detectors formed at the back surface, and

a plurality of contact pads formed at the back surface which are electrically coupled to the photo detectors;

a liquid crystal lens that includes;

second and third substrates,

a layer of liquid crystal material disposed between the second and third substrates,

one or more lead patterns adjacent the layer of liquid crystal material and disposed between the second and third substrates, and

a plurality of first electrical contacts each extending from one of the one or more lead patterns and through the second substrate;

wherein the front surface of the sensor chip is mounted to the third substrate of the liquid crystal lens such that the plurality of photo detectors are disposed under the liquid crystal material for receiving light passing through the liquid crystal material and the front surface.

35. The package structure of claim 34, wherein the front surface of the sensor chip is mounted to the third substrate of the liquid crystal lens by a spacer which is disposed between and attached to the front surface of the sensor chip and the third substrate of the liquid crystal lens.

36. The package structure of claim 35, wherein the spacer comprises a cavity disposed over the plurality of photo detectors.

37. The package structure of claim 34, wherein the liquid crystal lens further comprises:

an optical element mounted to the second substrate.

38. The package structure of claim 34, wherein the liquid crystal lens further comprises:

a lens module mounted to one of the second substrate and the third substrate, wherein the lens module includes a plurality of lenses therein.

39. The package structure of claim 38, wherein the sensor chip is mounted to the liquid crystal lens such that the lens module is disposed between the sensor chip and the liquid crystal lens.

40. The package structure of claim 34, further comprising:

a printed circuit board that includes a plurality of second electrical contacts and which is mounted to the sensor chip such that each of the contact pads is electrically connected to one of the second electrical contacts.

41. The package structure of claim 40, wherein the printed circuit board further includes third electrical contacts, the structure further comprising:

a plurality of wires each extending between and electrically connecting one of the first electrical contacts and one of the third electrical contacts.

42. The package structure of claim 34, further comprising:

a handler mounted to the back surface of the sensor chip;

a plurality of second electrical contacts that each extend through the handler and to one of the contact pads.