Semiconductor device with micro electromechanical system die

• US 8,921,955 B1
• Filed: 02/24/2011
• Issued: 12/30/2014
• Est. Priority Date: 02/24/2011
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Kim, Byong Jin, Lee, Jae Ung, Jeon, Hyung Il, Jo, Eun Jung, Jeong, Koo Woong
• Primary Examiner(s): Ho, Anthony
• Application Number:
  US13/034,517
• Time in Patent Office: 1,405 Days
• Field of Search: 257/416
• US Class Current: 257/416
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/16151 Cap comprising an aperture, e.g. for pressure control, encapsulation

Abstract

In one embodiment, a miniaturized, multi-function, highly integrated and high performance semiconductor device or package includes a microphone implemented using a MEMS (Micro Electro Mechanical System) die. The semiconductor device includes a leadframe and a body collectively defining a port hole. The port hole facilitates the exposure of a diaphragm of the MEMS die in the semiconductor device.

Claims

1. A semiconductor device, comprising:

a die pad including a die pad aperture, the die pad having opposed first and second die pad major surfaces;

a plurality of leads disposed in spaced relation to the die pad;

a semiconductor die attached to the first die pad major surface and electrically connected to at least one of the leads;

a MEMS die attached to the first die pad major surface and electrically connected to at least the semiconductor die, the MEMS die including a diaphragm;

a body at least partially encapsulating the die pad and the leads such that at least portions of the leads are exposed therein, the body including a body aperture, the die pad and body apertures collectively defining a port hole exposing the diaphragm, the body partially undercut to expose portions of the second die pad major surface adjacent opposed sides of the body aperture; and

a lid attached to the body and at least one of the leads in a manner covering the semiconductor die and the MEMS die.

2. The semiconductor device of claim 1, wherein the exposed portions of the second die pad major surface are partially recessed and have a beveled surface, and wherein the body aperture has a circularly configured beveled surface substantially flush with the beveled surface of the second die pad major surface.

3. The semiconductor device of claim 1, wherein the lid includes an acoustic hole generally aligned with the diaphragm of the MEMS die.

4. The semiconductor device of claim 1 wherein the lid is attached to the body and at least one of the leads with an adhesion member.

5. The semiconductor device of claim 4, wherein the adhesion member comprises one or more of an insulating material and a conductive material.

6. The semiconductor device of claim 1, wherein:

the body defines a generally planar bottom surface having the body aperture;

the die pad aperture and the body aperture are aligned with each other; and

the body aperture is of gradually increasing width as it extends from die pad aperture to the bottom surface of the body.

7. The semiconductor device of claim 1, wherein:

the semiconductor die is electrically connected to at least one of the leads by a first conductive wire;

the MEMS die is electrically connected to the semiconductor die by a second conductive wire; and

the first and second conductive wires are covered by the lid.

8. The semiconductor device of claim 1, wherein each of the plurality of leads defines an inner portion which is partially embedded in the body, and an outer portion which protrudes from the body.

9. The semiconductor device of claim 8, wherein the outer portion of each of the plurality of leads comprises a gull-wing configuration.

10. The semiconductor device of claim 8 further comprising a plurality of conductive members, wherein the only conductive members present are the plurality of conductive members formed on bottom surfaces of the plurality of leads.

11. The semiconductor device of claim 8 further comprising a plurality of conductive members, wherein the only conductive members present are the plurality of conductive members formed on bottom surfaces of the plurality of leads, wherein each conductive member which is partially encapsulated by the body such that a portion of each conductive member is exposed in a common exterior surface defined by the body.

12. A semiconductor device, comprising:

a leadframe having first and second leadframe major surfaces;

a semiconductor die attached and electrically connected to the leadframe;

a MEMS die attached to the leadframe and electrically connected to at least the semiconductor die, the MEMS die including a diaphragm;

a body at least partially encapsulating the leadframe such that at least portions of the first leadframe major surface are exposed therein, the body and the leadframe collectively defining a port hole which exposes a first surface of the diaphragm; and

a lid attached to at least one of the leadframe and the body in a manner covering the semiconductor die and the MEMS die, the lid having an acoustic hole generally aligned with a second surface of the diaphragm.

13. The semiconductor device of claim 12, wherein a portion of the body is undercut to expose portions of the second leadframe major surface adjacent the port hole.

14. The semiconductor device of claim 13, wherein the exposed portions of the second leadframe major second surface are partially recessed and have beveled surfaces.

15. The semiconductor device of claim 12, wherein the lid is attached to at least the leadframe through the use of an adhesion member, and wherein the adhesion member comprises one or more of an insulating material and a conductive material.

16. The semiconductor device of claim 12, wherein the body defines an exterior surface, and at least a portion of the port hole is of gradually increasing width as it extends from the MEMS die to the exterior surface of the body.

17. The semiconductor device of claim 12, wherein:

the semiconductor die is electrically connected to the leadframe by a first conductive wire;

the MEMS die is electrically connected to the semiconductor die by a second conductive wire; and

the first and second conductive wires are covered by the lid.

18. The semiconductor device of claim 12, wherein the leadframe includes portions protruding from the body.

19. The semiconductor device of claim 12 further comprising a plurality of conductive members, wherein the only conductive members present consist of the plurality of conductive members formed on the second major surface of the leadframe.

20. A semiconductor device, comprising:

a die pad having opposed first and second die pad major surfaces;

a plurality of leads which are disposed in spaced relation to the die pad;

a semiconductor die attached to the first die pad major surface and electrically connected to at least one of the leads;

a MEMS die attached to the die pad and electrically connected to at least the semiconductor die, the MEMS die including a diaphragm;

a body at least partially encapsulating the die pad and the leads such that at least portions of the leads are exposed therein, the body and the die pad collectively defining a port hole exposing a first surface of the diaphragm, the body undercut to expose portions of the second die pad major surface adjacent opposed sides of the port hole; and

a lid attached to the body and at least one of the leads in a manner covering the semiconductor die and the MEMS die, the lid including an opening generally aligned with a second surface of the diaphragm.