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Electronic device case, method and mold for manufacturing the same, and mobile communications terminal

  • US 8,922,439 B2
  • Filed: 08/22/2013
  • Issued: 12/30/2014
  • Est. Priority Date: 04/23/2009
  • Status: Expired due to Fees
First Claim
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1. A method of manufacturing an electronic device case, the method comprising:

  • forming a radiator including an antenna pattern portion configured to transmit and receive a signal, a connection terminal portion configured to make contact with a circuit board of an electronic device, and a connection portion configured to connect the antenna pattern portion and the connection terminal portion to be arranged in different planes;

    arranging the radiator in a space defined by an upper mold or a lower mold for molding a radiator frame and injecting a resin material into the space to form the radiator frame including the antenna pattern portion on one side; and

    forming the radiator frame integrally with a case frame so that the radiator is embedded between the radiator frame and the case frame.

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