Electronic device case, method and mold for manufacturing the same, and mobile communications terminal
First Claim
1. A method of manufacturing an electronic device case, the method comprising:
- forming a radiator including an antenna pattern portion configured to transmit and receive a signal, a connection terminal portion configured to make contact with a circuit board of an electronic device, and a connection portion configured to connect the antenna pattern portion and the connection terminal portion to be arranged in different planes;
arranging the radiator in a space defined by an upper mold or a lower mold for molding a radiator frame and injecting a resin material into the space to form the radiator frame including the antenna pattern portion on one side; and
forming the radiator frame integrally with a case frame so that the radiator is embedded between the radiator frame and the case frame.
0 Assignments
0 Petitions
Accused Products
Abstract
An electronic device case having an antenna pattern embedded therein includes: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion of the radiator is provided on one side of the radiator frame and the connection terminal portion is provided on the other side thereof; and a case frame covering the one side of the radiator frame on which the antenna pattern portion is provided so that the antenna pattern portion is embedded between the case frame and the radiator frame.
26 Citations
10 Claims
-
1. A method of manufacturing an electronic device case, the method comprising:
-
forming a radiator including an antenna pattern portion configured to transmit and receive a signal, a connection terminal portion configured to make contact with a circuit board of an electronic device, and a connection portion configured to connect the antenna pattern portion and the connection terminal portion to be arranged in different planes; arranging the radiator in a space defined by an upper mold or a lower mold for molding a radiator frame and injecting a resin material into the space to form the radiator frame including the antenna pattern portion on one side; and forming the radiator frame integrally with a case frame so that the radiator is embedded between the radiator frame and the case frame. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A mold for molding a case of an electronic device, the mold comprising:
-
an upper mold and a lower mold for molding the case for receiving a radiator frame injection-molded on a radiator including an antenna pattern portion for transmitting and receiving a signal, a connection terminal portion brought into contact with a circuit board of the electronic device, and a connection portion for connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; and a resin material injection portion provided through at least one of the upper mold or the lower mold, the resin material injection portion being configured to inject a resin material into a space between the upper and lower molds so that the resin material is filled in the space to form the case upon the upper and lower molds being joined. - View Dependent Claims (9, 10)
-
Specification