Method for making a solder joint
First Claim
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1. A method of bonding a component to a substrate comprising:
- applying solder paste on to a substrate;
urging a solder preform made of solder or braze material into contact with the solder paste, the solder preform having a channel in the form of at least one of an aperture and a notch formed therethrough, such that solder paste is urged through the channel in an amount sufficient to fill and at least partially spill over edges of the channel; and
urging a component into contact with the solder preform and into contact with the solder paste that has been urged through the channel, thereby bonding the component, the solder preform, and the substrate together to define a reflow subassembly.
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Abstract
A method of bonding an electrical component to a substrate includes applying solder paste on to a substrate. Solder preform has an aperture is formed therethrough and is then urged into contact with the solder paste, such that solder paste is urged through the aperture. An electrical component is then urged into contact with the solder preform and into contact with the solder paste that has been urged through the aperture, thereby bonding the electrical component, the solder preform, and the substrate together to define a reflow subassembly.
203 Citations
18 Claims
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1. A method of bonding a component to a substrate comprising:
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applying solder paste on to a substrate; urging a solder preform made of solder or braze material into contact with the solder paste, the solder preform having a channel in the form of at least one of an aperture and a notch formed therethrough, such that solder paste is urged through the channel in an amount sufficient to fill and at least partially spill over edges of the channel; and urging a component into contact with the solder preform and into contact with the solder paste that has been urged through the channel, thereby bonding the component, the solder preform, and the substrate together to define a reflow subassembly. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of bonding a MEMS device to a substrate comprising:
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applying solder paste on to a substrate; urging a solder preform made of solder or braze material into contact with the solder paste, the solder preform having an aperture formed therethrough, such that solder paste is urged through the aperture in an amount sufficient to fill and at least partially spill over edges of the aperture; and urging a MEMS device into contact with the solder preform and the solder paste that has been urged through the aperture, thereby bonding the MEMS device, the solder preform, and the substrate together to define a reflow subassembly. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A method of bonding a component to a substrate comprising:
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a) applying a quantity of a fluxing agent on to a substrate; b) providing a solder preform made of solder or braze material having at least one channel in the form of at least one of an aperture and a notch formed therethrough, c) urging the solder preform into the fluxing agent, such that a portion of the fluxing agent is displaced through the channel formed in the solder preform in an amount sufficient to fill and at least partially spill over edges of the channel; and d) urging a component into contact with some of the fluxing agent that has been urged through the channel. - View Dependent Claims (17, 18)
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Specification