Solid state lighting device

• US 8,926,123 B2
• Filed: 04/28/2011
• Issued: 01/06/2015
• Est. Priority Date: 05/24/2010
• Status: Expired due to Fees

• Current Assignee: Diane M. Thrailkill, John E. Thrailkill
• Original Assignee: Diane M. Thrailkill, John E. Thrailkill
• Inventors: Thrailkill, John E.
• Primary Examiner(s): Patel, Vip
• Application Number:
  US13/697,890
• Publication Number:
  US 20130063935A1
• Time in Patent Office: 1,349 Days
• Field of Search: 362/235, 362/241, 362/547, 362/249.02, 362/373
• US Class Current: 362/235
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21S 8/033 the surface being a wall or like vertical structure, e.g. building facade
• CPC Class Codes: F21S 8/06 by suspension
• CPC Class Codes: F21S 8/063 with a rigid pendant, i.e. a pipe or rod
• CPC Class Codes: F21V 13/04 the elements being reflectors and refractors for vehicle rear lights F21S43/40
• CPC Class Codes: F21V 17/005 with keying means, i.e. for enabling the assembling of component parts in distinctive positions, e.g. for preventing wrong mounting
• CPC Class Codes: F21V 17/164 the parts being subjected to bending, e.g. snap joints
• CPC Class Codes: F21V 29/505 of reflectors
• CPC Class Codes: F21V 29/508 of electrical circuits
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

A solid state lighting device includes a relatively rigid, thermal dissipation plate with opposite sides, a printed circuit in intimate thermal contact with one side of the plate, at least one LED positioned against and electrically connected to the printed circuit and a shell having a rim secured to the one side of the plate so that the shell substantially covers the LED whereby when the LED is energized, light therefrom radiates into the shell and heat from the LED is conducted away by the plate.

Claims

1. A solid state lighting device comprising

a relatively rigid, thermally conductive, plate having a first side and a second side, the first and second sides being located oppose each other;

a first subassembly connected to the first side of the plate, the first subassembly comprising;

(a) a printed circuit in intimate thermal contact with one side of the plate;

(b) at least one LED positioned against and electrically connected to the printed circuit, and

(c) a shell having a rim secured to said one side of the plate so that the shell substantially covers the at least one LED whereby when the at least one LED is energized, light therefrom radiates into the shell and heat from the at least one LED is conducted away by the plate; and

a second subassembly connected to the second side of the plate, the second subassembly similar elements to the first subassembly.

2. The device defined in claim 1 wherein said plate is reflective of light emitted by the at least one LED.

3. The device defined in claim 1 wherein said at least one LED comprises a plurality of LEDs.

4. The device defined in claim 3

wherein the plurality of LEDs include LED groups having different color temperatures, and

further including a plural-channel drive circuit connected to said plurality of LEDs for separately controlling the different LED groups.

5. The device defined in claim 1 wherein the plate is perforated to increase its surface area.

6. The device defined in claim 1 wherein the shell is of a substantially transparent material.

7. The device defined in claim 1 wherein the shell is of a translucent material.

8. The device defined in claim 1 wherein the plate is a thermally conductive PCB that carries said printed circuit.

9. The device defined in claim 8 wherein said PCB comprises a pair of electrically conductive layers separated by an electrically insulating layer.

10. The device defined in claim 1

wherein said printed circuit, said at least one LED and said shell constitute a first subassembly, and

further including a second subassembly similar to the first subassembly positioned in intimate thermal contact with the other side of said plate opposite the first subassembly.

11. The device defined in claim 1 including a PCB with front and back sides, said printed circuit being printed on said front side, the back side being substantially flat and secured to the adjacent side of the plate so that said back side is in intimate thermal contact with the plate whereby any heat from the at least one LED is conducted away by the plate;

a base with a plurality of electrical contacts and adapted to be coupled to a lamp socket to establish electric connections therewith;

mounting structure for mounting the base to the plate so that the base is substantially collinear to the plate, and

an electrical connection device connecting the at least one LED to the electrical contacts in the base.

12. The device defined in claim 11 and further including a drive circuit connected electrically to the contacts in the base for converting alternating current from a power source to a lower voltage direct current for driving the at least one LED.

13. The device defined in claim 12 wherein said printed circuit constitutes part of the electrical connection device between the at least one LED and the contacts in the base.

14. The device defined in claim 12 wherein the at least one LED includes a plurality of LED groups having different color temperatures, and

the drive circuit has separate channels enabling separate control of the LED groups.

15. The device defined in claim 11 wherein the mounting structure comprises a pair of covers for positioning on opposite sides of the plate and base, said covers having surfaces which interfit with the plate and base as well as with each other to secure all those components together.

16. The device defined in claim 11 wherein the plate is composed of at least two superimposed plate layers.

17. The device defined in claim 11 wherein the back side of the PCB and the diffuser rim are secured to the plate by a mounting frame having an open center.

18. The device defined in claim 1 including

a mounting frame having opposite first and second sides and an open center;

a PCB with a front side that carries said printed circuit, and a back side that is substantially flat, said PCB being supported by the frame so that the back side of the PCB is more or less flush with the first side of the frame and the at least one LED is opposite said open center, said shell having a rim engaged over the second side of the mounting frame so that the shell surrounds the frame and covers the at least one LED, said frame, PCB and shell constituting a first subassembly, and

fastening devices for fastening the first subassembly against one side of the plate so that said back side of the PCB is pressed against the plate and the shell rim abuts the plate, whereby when the at least one LED is energized, a maximum amount of light from the at least one LED is directed through the shell and waste heat from the at least one LED is efficiently conducted away by the plate.

19. The device defined in claim 18 and further including a reflector positioned opposite the second side of the frame, the reflector having a reflective surface facing the shell and one or more light-transmitting windows opposite the at least one LED to allow light therefrom to shine into the shell.

20. The device defined in claim 19 wherein the reflector is a metallized plastic film.

21. The device defined in claim 18 and further including a thermally conductive layer sandwiched between said back side of the PCB and the plate.

22. The device defined in claim 21 wherein said layer is an electrically insulating adhesive layer.

23. The device defined in claim 18 wherein the shell is substantially hemispherical in shape.

24. The device defined in claim 18 wherein the shell has the general shape of an oblate hemisphere.

25. The device defined in claim 15 wherein the shell is translucent.

26. The device defined in claim 18 wherein the shell is transparent.

27. The device defined in claim 18 wherein said frame includes

a plurality of flexible resilient fingers extending from between said sides of the frame towards said open center and on which said one side of the PCB is seated, and

a plurality of clips extending from the frame that engage the PCB, thereby securing the PCB to the frame.

28. The device defined in claim 18 wherein the fastening devices include

a plurality of clips projecting from said first side of the frame, and

a corresponding plurality of openings in the plate for receiving the clips.

29. The device defined in claim 28 and further including

a plurality of locating pins projecting from the first side of the frame, and

a corresponding plurality of locating holes in the plate for snugly receiving different ones of said locating pins.

30. The device defined in claim 28 wherein the fastening devices include a bracket positioned against the other side of the plate, said bracket being formed with a plurality of detents and said clips being dimensioned to engage the detents so that the plate is clamped between the frame and the bracket.

31. The device defined in claim 18 and further including

a second subassembly similar to the first subassembly, and

second fastening devices for fastening the second subassembly against the other side of the plate.

32. The device defined in claim 31 wherein

the plate has openings, and

the first and second fastening devices include a plurality of clips projecting from the first side of each frame through selected different ones of said openings and engaging a corresponding plurality of detents on the other frame so that the plate is clamped between said first and second subassemblies.

33. The device defined in claim 32 and further including

a plurality of locating pins projecting from the first side of the frame in each subassembly, and

a plurality of locating holes in the plate for snugly receiving different ones of said plurality of locating pins.

34. The device defined in claim 33 wherein the first and second frames are angularly offset from one another about an axis perpendicular to the plate.

35. The device defined in claim 18 wherein the plate is flat.

36. The device defined in claim 18 wherein the plate is curved with sides which surround the frame and extend beyond the shell.

37. The device defined in claim 18 wherein the plate is comprised of a pair of similar superimposed plate layers.

38. The device defined in claim 18

wherein the at least one LED includes LED groups having different color temperatures, and

further including a plural-channel drive circuit for separately controlling the different LED groups.

39. A lighting fixture comprising:

a rigid, thermally conductive sheet having a plurality of openings;

a corresponding plurality of solid state lighting devices as defined in claim 1, whose plates are designed and dimensioned to engage over and cover different ones of said openings;

securing devices for releasably securing each of said plates to the sheet so that the plates are in intimate thermal contact with the sheet;

an electrical bus for connection to a power source, and

electrical couplings for releasably electrically connecting the at least one LED of each of said lighting devices separately to the bus so that a failed one of said lighting devices can be removed easily from the fixture and replaced without disturbing the remaining lighting devices.