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Trench Schottky diode and method for manufacturing the same

  • US 8,927,401 B2
  • Filed: 01/07/2013
  • Issued: 01/06/2015
  • Est. Priority Date: 06/26/2009
  • Status: Active Grant
First Claim
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1. A method for manufacturing a trench Schottky diode, comprising steps of:

  • providing a semiconductor substrate having a first surface;

    forming a first mask layer on the first surface, wherein the first mask layer includes a first plurality of openings and a second plurality of opening;

    forming a first plurality of trenches and a second plurality of trenches in the semiconductor substrate according to the first mask layer;

    forming a first plurality of gate oxide layers correspondingly formed on surfaces of the first plurality of trenches and a second plurality of gate oxide layers correspondingly formed on surfaces of the second plurality of trenches, wherein the first plurality of gate oxide layers and the second plurality of gate oxide layers protrude above the first surface of the semiconductor substrate;

    filling a first plurality of polysilicon structures in the first plurality of trenches and a second plurality of polysilicon structures in the second plurality of trenches, wherein the first plurality of polysilicon structures and the second plurality of polysilicon structures protrude above the first surface of the semiconductor substrate;

    forming a second mask layer covering mask layer, the first plurality of polysilicon structures and the second plurality of polysilicon structures;

    removing a portion of the first mask layer and a portion of the second mask layer, wherein a remained portion of the first mask layer is on a portion of the first surface among the first plurality of trenches and covers the first surface among the first plurality of trenches and the first plurality of gate oxide layers, and wherein a remained portion of the second mask layer is on the remained portion of the first mask layer and the first plurality of polysilicon structures, and completely covers the remained portion of the first mask layer; and

    forming an electrode on the other portion of the first surface, the remained portion of the second mask layer, the second plurality of the protruding polysilicon structures and the second plurality of the protruding gate oxide layers.

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