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Insert molded cowling structures

  • US 8,927,881 B2
  • Filed: 09/07/2012
  • Issued: 01/06/2015
  • Est. Priority Date: 09/07/2012
  • Status: Active Grant
First Claim
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1. An electronic device, comprising:

  • a substrate;

    an electronic component mounted against the substrate; and

    a support structure having a metal portion in contact with the electronic component that presses the electronic component against the substrate, wherein the metal portion comprises at least one engagement feature that extends into and is at least partially surrounded by an insert-molded insulating portion and wherein the insert-molded insulating portion extends laterally from the metal portion.

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