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Three dimensional structure memory

DC CAFC
  • US 8,928,119 B2
  • Filed: 03/17/2009
  • Issued: 01/06/2015
  • Est. Priority Date: 04/04/1997
  • Status: Expired due to Fees
First Claim
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1. A stacked integrated circuit comprising:

  • a plurality of substantially flexible integrated circuits having topside and bottom-side surfaces, wherein said integrated circuits are stacked in relation to one another, wherein at least one of the substantially flexible integrated circuits comprises a substantially flexible monocrystalline semiconductor substrate of one piece made from a semiconductor wafer thinned by at least one of abrasion, etching and parting to expose a surface, and subsequently polishing or smoothing the exposed surface to form a polished or smoothed surface; and

    interconnections that pass through one or more of the plurality of substantially flexible integrated circuits and that electrically connect the plurality of substantially flexible integrated circuits, wherein the interconnections are vertical interconnections and are internal to the plurality of substantially flexible integrated circuits.

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