Semiconductor module and cooling unit

• US 8,933,557 B2
• Filed: 07/28/2010
• Issued: 01/13/2015
• Est. Priority Date: 08/10/2009
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Gohara, Hiromichi, Morozumi, Akira, Higuchi, Keiichi
• Primary Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US13/382,621
• Publication Number:
  US 20120139096A1
• Time in Patent Office: 1,630 Days
• Field of Search: 257/706, 257/712, 257/713, 257/717, 257/720, 257/718, 257/719, 257/722, 257/715, 257/704, 257/E23.101, 361/699, 361/715, 165/168, 165/185
• US Class Current: 257/706
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]

Abstract

A semiconductor module including a cooling unit by which a fine cooling effect is obtained is provided. A plurality of cooling flow paths (21c) which communicate with both of a refrigerant introduction flow path which extends from a refrigerant introduction inlet and a refrigerant discharge flow path which extends to a refrigerant discharge outlet are arranged in parallel with one another in a cooling unit (20). Fins (22) are arranged in each cooling flow path (21c). Semiconductor elements (32) and (33) are arranged over the cooling unit (20) so that the semiconductor elements (32) and (33) are thermally connected to the fins (22). By doing so, a semiconductor module (10) is formed. Heat generated by the semiconductor elements (32) and (33) is conducted to the fins (22) arranged in each cooling flow path (21c) and is removed by a refrigerant which flows along each cooling flow path (21c).

Claims

1. A semiconductor module comprising:

a cooling unit including;

a first flow path which extends from a refrigerant introduction inlet, a second flow path which is arranged in parallel with the first flow path and which extends to a refrigerant discharge outlet, a plurality of third flow paths which communicate with the first flow path and the second flow path, a heat sink which is arranged in the plurality of third flow paths, and one or more guides for guiding a refrigerant in the direction of extending the first flow path in the first flow path, wherein the one or more guides are separated from an edge of the plurality of third flow paths; and

at least one semiconductor element which is thermally connected to the cooling unit.

2. The semiconductor module according to claim 1, wherein the at least one semiconductor element is arranged over at least one of the plurality of third flow paths.

3. The semiconductor module according to claim 1, wherein the plurality of third flow paths are arranged in parallel with one another.

4. The semiconductor module according to claim 1, wherein the plurality of third flow paths are arranged so that the plurality of third flow paths are approximately perpendicular to the first flow path and the second flow path.

5. The semiconductor module according to claim 1, wherein the plurality of third flow paths are arranged so that the plurality of third flow paths cross the first flow path and the second flow path obliquely.

6. The semiconductor module according to claim 1, wherein cross-sectional area of at least one of the plurality of third flow paths is partially small.

8. The semiconductor module according to claim 1, wherein the cooling unit including:

a fin base having the heat sink;

an enclosure having partition wall which form the plurality of the third flow paths;

wherein the guide is formed at the bottom of the enclosure.

9. The semiconductor module according to claim 1, wherein a fin base having the heat sink;

an enclosure having partition wall which form the plurality of the third flow paths;

wherein the guide is formed at over a fin base placed over the enclosure.

10. The semiconductor module according to claim 1, wherein a fin base having the heat sink;

an enclosure having partition wall which form the plurality of the third flow paths;

wherein the guide is formed both at the bottom of the enclosure and over the fin base.

11. The semiconductor module according to claim 1, wherein:

one semiconductor element, and a second semiconductor element which generates less heat than the one semiconductor element, are include as the at least one semiconductor element; and

the one semiconductor element is arranged on a rear end side of the first flow path over the cooling unit and the second semiconductor element is arranged on a front end side of the first flow path over the cooling unit.

7. A cooling unit comprising:

a first flow path which extends from a refrigerant introduction inlet;

a second flow path which is arranged in parallel with the first flow path and which extends to a refrigerant discharge outlet;

a plurality of third flow paths which communicate with the first flow path and the second flow path;

a heat sink which is arranged in the plurality of third flow paths and

one or more guides for guiding a refrigerant in the direction of extending the first flow path in the first flow path, wherein the one or more guides are separated from an edge of the plurality of third flow paths.

12. The cooling unit according to claim 7, wherein

the guides are a plurality of plate-like guide and arranged to be shifted from each other and over the inlets of at least one of the plurality of third flow paths in the first flow path.