×

Sputtering target and manufacturing method thereof, and transistor

  • US 8,937,020 B2
  • Filed: 06/20/2013
  • Issued: 01/20/2015
  • Est. Priority Date: 11/13/2009
  • Status: Active Grant
First Claim
Patent Images

1. A manufacturing method of a sputtering target, comprising:

  • mixing and baking a plurality of metal oxides to form a sintered body;

    performing a mechanical processing on the sintered body so as to form a target;

    cleaning the target; and

    performing a heat treatment on the cleaned target.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×