LED package having an array of light emitting cells coupled in series

• US 8,937,326 B2
• Filed: 02/24/2011
• Issued: 01/20/2015
• Est. Priority Date: 03/11/2005
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: Lee, Chung Hoon, Lee, Keon Young, Kim, Hong San, Kim, Dae Won, Choi, Hyuck Jung
• Primary Examiner(s): Tran, Tran
• Application Number:
  US13/033,702
• Publication Number:
  US 20110140135A1
• Time in Patent Office: 1,426 Days
• Field of Search: 257/79, 257/88, 257/E33.056, 257 98-100
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/153 in a repetitive configuration, e.g. LED bars
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/36 characterised by the electrodes
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

Claims

1. A light emitting diode (LED) package, comprising:

a package body comprising a substrate comprising a first side, a second side, and an opening, the first and second sides being opposite sides of the substrate;

a metallic portion arranged in the opening, the metallic portion being exposed at the second side of the substrate;

a first lead electrode and a second lead electrode spaced apart from each other and the metallic portion; and

a light emitting device arranged on the metallic portion and electrically connected to the first lead electrode and the second lead electrode,

wherein the entire first side of the substrate is substantially flat,

wherein the light emitting device is arranged on a first side of the metallic portion, and the first lead electrode and the second lead electrode are arranged on the second side of the substrate,

wherein the first side of the metallic portion is at an opposite side of the second side of the substrate,

wherein the LED package is configured to be driven by an alternating current (AC) and by a voltage higher than that for driving one light emitting diode,

wherein a second side of the metallic portion is substantially flush with the second side of the substrate, the second side of the metallic portion being an opposite side than the first side of the metallic potion,

wherein inside surfaces of each of the first lead electrode and the second lead electrode only directly contact the substrate,

wherein at least a portion of the first side of the metallic portion is substantially flush with the entire first side of the substrate,

wherein the metallic portion consists of a homogenous metallic material structure, and

wherein the substrate is an insulating substrate, and the metallic portion consisting of the homogenous metallic material structure directly contacts the insulating substrate in the opening.

2. The LED package of claim 1, wherein the first lead electrode and the second lead electrode extend from the second side of the substrate to the first side of the substrate, and the metallic portion is exposed at the first side of the substrate.

3. The LED package of claim 1, wherein the metallic portion comprises a recessed portion, and the light emitting device is arranged in the recessed portion.

4. The LED package of claim 1, further comprising:

a molding member configured to convert a direction of light and/or a wavelength of light emitted from the light emitting device.

5. The LED package of claim 4, wherein the molding member comprises a phosphor.

6. The LED package of claim 1, wherein a side surface of the substrate contacting the metallic portion is parallel to side surfaces of each of the first lead electrode and the second lead electrode.

7. The LED package of claim 4, wherein the first lead electrode and the second lead electrode extend from the second side of the substrate to the first side of the substrate, and

wherein a portion of each of the first lead electrode and the second lead electrode on the first side of the substrate is not covered by the molding portion.

8. A light emitting diode (LED) package, comprising:

a substrate comprising a first side and a second side, the first and second sides being opposite sides of the substrate;

a metallic portion arranged in the substrate, the metallic portion being exposed at the second side of the substrate;

a first lead electrode and a second lead electrode spaced apart from each other and the metallic portion; and

a light emitting device arranged on the metallic portion and electrically connected to the first lead electrode and the second lead electrode,

wherein the entire first side of the substrate is substantially flat,

wherein the light emitting device comprises a plurality of light emitting cells connected in series and is arranged on a first side of the metallic portion, and the first lead electrode and the second lead electrode are arranged on the second side of the substrate,

wherein the first side of the metallic portion is at an opposite side of the second side of the substrate,

wherein inside surfaces of each of the first lead electrode and the second lead electrode only directly contact the substrate,

wherein a portion of the first side of the metallic portion is substantially flush with the entire first side of the substrate,

wherein the metallic portion consists of a homogenous metallic material structure, and

wherein the substrate is an insulating substrate, and the metallic portion consisting of the homogenous metallic material structure directly contacts the insulating substrate in the opening.

9. The LED package of claim 8, wherein a side surface of the substrate contacting the metallic portion is parallel to side surfaces of each of the first lead electrode and the second lead electrode.

10. The LED package of claim 8, wherein a second side of the metallic portion opposite to the first side of the metallic portion is substantially flush with the second side of the substrate.

11. The LED package of claim 8, further comprising:

a molding member configured to convert a direction of light and/or a wavelength of light emitted from the light emitting device.

12. The LED package of claim 11, wherein the first lead electrode and the second lead electrode extend from the second side of the substrate to the first side of the substrate, and

wherein a portion of each of the first lead electrode and the second lead electrode on the first side of the substrate is not covered by the molding portion.