Semiconductor packages with heat dissipation structures and related methods
First Claim
1. A semiconductor package, comprising:
- a die pad;
at least one connecting bar extending outwardly from the die pad;
at least one supporting portion extending from the at least one connecting bar at a location spaced from the die pad and including an upper surface that is elevated above an upper surface of the die pad;
a plurality of leads disposed around the die pad, and being electrically isolated from each other and the die pad;
a semiconductor chip disposed on the die pad and electrically connected to the leads;
a heat sink attached to the upper surface of the at least one supporting portion; and
a molding compound encapsulating the semiconductor chip, at least portions of the heat sink, at least portions of the die pad, at least portions of the connecting bar, at least portions of the supporting portion, and at least portions of each of the leads;
wherein the die pad, the connecting bar, and the supporting portion are made of metal.
1 Assignment
0 Petitions
Accused Products
Abstract
Semiconductor packages including a die pad, at least one connecting bar, at least one supporting portion, a plurality of leads, a semiconductor chip, a heat sink and a molding compound. The connecting bar connects the die pad and the supporting portion. The leads are electrically isolated from each other and the die pad. The semiconductor chip is disposed on the die pad and electrically connected to the leads. The heat sink is supported by the supporting portion. The molding compound encapsulates the semiconductor chip and the heat sink. Heat from the semiconductor chip is efficiently dissipated from the die pad through the connecting bar, through the supporting portion, and through the heat sink.
160 Citations
19 Claims
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1. A semiconductor package, comprising:
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a die pad; at least one connecting bar extending outwardly from the die pad; at least one supporting portion extending from the at least one connecting bar at a location spaced from the die pad and including an upper surface that is elevated above an upper surface of the die pad; a plurality of leads disposed around the die pad, and being electrically isolated from each other and the die pad; a semiconductor chip disposed on the die pad and electrically connected to the leads; a heat sink attached to the upper surface of the at least one supporting portion; and a molding compound encapsulating the semiconductor chip, at least portions of the heat sink, at least portions of the die pad, at least portions of the connecting bar, at least portions of the supporting portion, and at least portions of each of the leads; wherein the die pad, the connecting bar, and the supporting portion are made of metal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor package, comprising:
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a die pad; at least one connecting bar extending outwardly from the die pad; at least one supporting portion extending from the at least one connecting bar at a distal end from the die pad; a plurality of leads disposed around the die pad, and being electrically isolated from each other and the die pad; a semiconductor chip disposed on the die pad and electrically connected to the leads; a heat sink attached to an upper surface of the at least one supporting portion, the heat sink comprising a main body portion and at least one leg portion; and a molding compound encapsulating the semiconductor chip, at least portions of the heat sink, at least portions of the die pad, at least portions of the connecting bar, at least portions of the supporting portion, and at least portions of each of the leads; wherein a path for dissipating heat from the semiconductor chip comprises from the die pad through the at least one connecting bar, through the at least one supporting portion, through the at least one leg portion, and through the main body portion; and wherein the die pad, the connecting bar, and the supporting portion are made of metal. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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18. A semiconductor package, comprising:
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a die pad having an upper surface; at least one connecting bar extending outwardly from the die pad and having an upper surface in the same plane as the upper surface of the die pad; at least one supporting portion extending upwardly from the at least one connecting bar at a location spaced from the die pad; a plurality of leads disposed around the die pad, and being electrically isolated from each other and the die pad; a semiconductor chip disposed on the die pad and electrically connected to the leads; a molding compound encapsulating the semiconductor chip, at least portions of the die pad, at least portions of the connecting bar, at least portions of the supporting portion, and at least portions of each of the leads; and a heat sink attached to the at least one supporting portion; wherein the die pad, the connecting bar, and the supporting portion are made of metal. - View Dependent Claims (19)
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Specification