Lithographic apparatus and device manufacturing method with radiation beam inspection using moveable reflecting device
First Claim
1. A lithographic apparatus, comprising:
- a patterning system configured to provide a patterned radiation beam;
a projection system configured to project the patterned radiation beam onto a target portion of a substrate;
a radiation beam inspection device comprising a sensor and a reflecting device and configured to inspect at least a part of the patterned radiation beam;
a required pattern data store configured to store data corresponding to at least a part of a required pattern corresponding to a pattern feature to be exposed on the substrate; and
a controller device configured to;
cause the lithographic apparatus to expose the required pattern onto the target portion of the substrate;
cause the lithographic apparatus to move between a radiation beam inspection position for inspection of the patterned radiation beam by the radiation beam inspection device and a substrate exposure position; and
determine a difference between the pattern detected by the radiation beam inspection device with the required pattern and to determine at least one modification to an operation of the lithographic apparatus necessary in order to minimize the difference.
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Accused Products
Abstract
A lithographic apparatus can include the following devices: a patterning system, a projection system, and a radiation beam inspection device. The patterning system can be configured to provide a patterned radiation beam. The projection system can be configured to project the patterned radiation beam onto a target portion of a substrate. Further, the radiation beam inspection device can be configured to inspect at least a part of the patterned radiation beam. In a substrate exposure position, the projection system is configured to expose a pattern of radiation on the substrate using the patterned radiation beam and the radiation beam device is configured to move the reflecting device away from a light path of the patterned radiation beam. In a radiation beam inspection position, the radiation beam inspection device is configured to move the reflecting device into the light path of the patterned radiation beam.
39 Citations
26 Claims
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1. A lithographic apparatus, comprising:
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a patterning system configured to provide a patterned radiation beam; a projection system configured to project the patterned radiation beam onto a target portion of a substrate; a radiation beam inspection device comprising a sensor and a reflecting device and configured to inspect at least a part of the patterned radiation beam; a required pattern data store configured to store data corresponding to at least a part of a required pattern corresponding to a pattern feature to be exposed on the substrate; and a controller device configured to; cause the lithographic apparatus to expose the required pattern onto the target portion of the substrate; cause the lithographic apparatus to move between a radiation beam inspection position for inspection of the patterned radiation beam by the radiation beam inspection device and a substrate exposure position; and determine a difference between the pattern detected by the radiation beam inspection device with the required pattern and to determine at least one modification to an operation of the lithographic apparatus necessary in order to minimize the difference. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of optimizing operation of a lithographic apparatus for formation of a device on a substrate, the method comprising:
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moving a reflecting device into an exposure light path to direct a patterned beam of radiation onto a radiation beam inspection device, wherein the radiation beam inspection device is configured to inspect the pattern of radiation that would be exposed on the substrate that is along the exposure light path; determining at least one modification to an operation of the lithographic apparatus to minimize a difference between a required pattern corresponding to a pattern feature to be exposed on the substrate and the pattern determined by the radiation beam inspection device; and projecting a modified patterned radiation beam onto the substrate, after moving the reflecting device out of the exposure light path, with the at least one modification used to produce the modified patterned radiation beam. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26)
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Specification