Apparatus and methods for filament crimping and manufacturing

• US 8,939,180 B2
• Filed: 02/13/2012
• Issued: 01/27/2015
• Est. Priority Date: 06/22/2006
• Status: Active Grant

• Current Assignee: Autosplice, Inc. (Autosplice Parent, Inc.)
• Original Assignee: Autosplice, Inc. (Autosplice Parent, Inc.)
• Inventors: Bogursky, Robert, Foshansky, Leonid, Kennedy, Craig, Wood, Darrel, Saunders, Mark
• Primary Examiner(s): Ekiert, Teresa M
• Application Number:
  US13/372,199
• Publication Number:
  US 20120261025A1
• Time in Patent Office: 1,079 Days
• Field of Search: 140/105, 140/106, 140/113, 723/06, 723/07, 72381-384
• US Class Current: 140/105
• CPC Class Codes: H01R 4/01 Connections using shape memory materials, e.g. shape memory metal
• CPC Class Codes: H01R 4/188 having an uneven wire-receiving surface to improve the contact
• CPC Class Codes: H01R 43/048 Crimping apparatus or processes H01R43/042 takes precedence
• CPC Class Codes: Y10T 29/49181 by deforming
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/5121 Wire working
• CPC Class Codes: Y10T 428/1241 Nonplanar uniform thickness or nonlinear uniform diameter [e.g., L-shape]

Abstract

Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Claims

1. A crimped filament assembly, comprising:

at least one crimp element assembly, said at least one crimp element assembly comprising;

a filament wire; and

a plurality of crimp heads, each of said crimp heads comprising a metal alloy with a plurality of crimping cavities configured to retain said filament wire therein, at least two of said plurality of crimp heads crimped to said filament wire; and

a carrier, said carrier facilitating automated processing of said at least one crimp element assembly;

wherein said carrier comprises a polymer material that is configured to have said at least one crimp element assembly affixed thereon; and

wherein said at least one crimp element assembly is affixed to said polymer material carrier using an adhesive.

2. The assembly of claim 1, wherein said crimp heads have at least one surface adapted for picking by a pick-and-place apparatus, and said carrier further comprises a cover tape, said carrier having at least one aperture or notch formed therein in order to expose said at least one surface.

3. The assembly of claim 1, wherein said filament wire comprises a shape memory alloy, and said crimping cavities are disposed to form a substantially serpentine channel that receive at least a portion of said filament wire.

4. The assembly of claim 3, wherein said filament wire comprises a Nickel-Titanium shape memory alloy, and said crimp heads comprise a material having a hardness less than that of said shape memory alloy so as to preclude substantial deformation of said filament wire alloy during crimping.

5. The assembly of claim 1, wherein said carrier is configured to maintain at least one dimension of said crimp element assembly for subsequent processing.

6. The assembly of claim 5, wherein said at least one dimension comprises a spacing between two components.

7. The assembly of claim 1, wherein said carrier runs adjacent at least a portion of said filament wire, said adjacent portion of said carrier protecting said filament wire during at least product transport.

8. A crimped filament assembly, comprising:

at least one crimp element assembly, said at least one crimp element assembly comprising;

a plurality of crimp heads, each of said crimp heads comprising;

a first plurality of cavities, said first plurality of cavities disposed at a spacing which creates a first plurality of features; and

a second plurality of cavities, said second plurality of cavities disposed at a spacing which creates a second plurality of features;

wherein said first and second pluralities of cavities are substantially opposite to, yet substantially offset from, one another when said crimp head is crimped, thereby forming a substantially serpentine channel therebetween for receiving a filament; and

a filament, at least two of said crimp heads being crimped to said filament; and

a carrier, said carrier facilitating the automated processing of said at least one crimp element assembly.

9. The crimped filament assembly of claim 8, wherein said first and second cavities have substantially rounded edges, said substantially rounded edges mitigating deformation of at least a portion of said filament during crimping.

10. The crimped filament assembly of claim 8, wherein said filament comprises a Nickel-Titanium shaped memory alloy wire.

11. The crimped filament assembly of claim 8, wherein said filament comprises a Nickel-Titanium shape memory alloy wire, and said crimp heads comprise a material having a hardness less than that of said shape memory alloy so as to preclude substantial deformation of said filament alloy during crimping.

12. The crimped filament assembly of claim 8, wherein said carrier is configured to maintain at least one dimension of said crimp element assembly for subsequent processing.

13. The crimped filament assembly of claim 12, wherein said at least one dimension comprises a spacing between two adjacently disposed crimp heads.

14. The crimped filament assembly of claim 8, wherein said carrier runs adjacent at least a portion of said filament, said adjacent portion of said carrier protecting at least said filament during at least product transport.

15. A method of manufacturing a crimped filament assembly comprising a plurality of crimp heads each comprising a first metal alloy with a plurality of crimping cavities configured to retain a filament wire therein, a filament comprising a second metal alloy, and a carrier that facilitates automated processing of the assembly, the assembly manufactured according to the method comprising:

disposing the plurality of crimp heads on the carrier in a substantially longitudinal and aligned orientation;

disposing said filament in the crimping cavities of at least two of the plurality of crimp heads;

placing at least a portion of the filament between the at least two crimp heads under tension;

crimping said at least two crimp heads so as to form said assembly;

disposing said crimped assembly onto a polymer carrier; and

securing said crimped assembly to said polymer carrier utilizing an adhesive, said adhesive configured so as to not leave any residue on said portions of said crimped assembly that are in contact with said adhesive.

16. The method of manufacturing the crimped filament assembly of claim 15, wherein said act of crimping is performed so as to:

(i) avoid any substantial deformation of said filament; and

(ii) cause said filament to assume a substantially serpentine shape within at least said crimp heads, said substantially serpentine shape fixedly retaining said filament within each of said at least two crimp heads.

17. The method of manufacturing the crimped filament assembly of claim 15, further comprising:

placing said disposed crimped assembly on said polymer carrier onto a continuous reel.