Systems and methods for application of optical materials to optical elements
First Claim
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1. A method, comprising:
- heating an optical element that includes at least one non-planar surface; and
after heating the optical element, applying an optical material to at least one non-planar surface on the heated optical element,wherein heating the optical element comprises heating a plurality of LED chips arranged on a common surface.
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Abstract
Methods are disclosed including heating an optical element. An optical material is applied to the heated optical element to provide a conformal layer that is cured via the thermal energy in the heated optical element.
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Citations
44 Claims
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1. A method, comprising:
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heating an optical element that includes at least one non-planar surface; and after heating the optical element, applying an optical material to at least one non-planar surface on the heated optical element, wherein heating the optical element comprises heating a plurality of LED chips arranged on a common surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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33. A method, comprising:
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heating an optical element that includes at least one non-planar surface; and after heating the optical element, applying an optical material to at least one non-planar surface on the heated optical, wherein the optical element comprises an LED wafer, the method further comprising singulating the LED wafer into a plurality of LED chips after applying the optical material on the heated LED wafer.
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34. A method, comprising:
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heating an optical element that includes at least one non-planar surface; and after heating the optical element, applying an optical material to at least one non-planar surface on the heated optical element, wherein the optical element comprises an LED wafer, the method further comprising forming a plurality of sacrificial patterns on a surface of the LED wafer, wherein applying the optical material onto the heated LED structure comprises spraying an atomized luminescent solution onto the sacrificial patterns and onto exposed surfaces of the LED wafer between the sacrificial patterns. - View Dependent Claims (35, 36)
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37. A method of forming a device for interacting with emitted light, the method comprising:
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heating an optical element; applying a first conformal layer of optical material to the heated optical element; testing a light emission characteristic of the optical element; and in response to the light emission characteristic of the optical element not being acceptable, applying a second conformal layer of optical material on the optical element. - View Dependent Claims (38, 39, 40)
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41. A method, comprising:
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curing an optical material on a light transmissive optical element during application of the optical material to the light transmissive optical element, wherein curing the optical material comprises heating the light transmissive optical element before application of the optical material to the light transmissive optical element. - View Dependent Claims (42, 43, 44)
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Specification