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Method to perform electrical testing and assembly of electronic devices

  • US 8,941,108 B2
  • Filed: 12/20/2012
  • Issued: 01/27/2015
  • Est. Priority Date: 08/28/2009
  • Status: Active Grant
First Claim
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1. A method, comprising:

  • performing electrical wafer testing and assembly of a first electronic device on a wafer, the first electronic device including an insulating layer on the wafer, a passivation layer covering the insulating layer, and a first pad made in the insulating layer, the performing including;

    realizing a non-active area if said wafer with a lowered surface with respect to a surface of said first electronic device;

    providing said first electronic device with an extended metallization layer extending on said passivation layer from said first pad to the non-active area of said wafer;

    connecting said first electronic device to a testing apparatus;

    performing the electrical wafer testing of said first electronic device by positioning a probe of said testing apparatus on a portion of said extended metallization layer positioned on said non-active area;

    cutting said wafer after performing the electrical wafer testing of said first electronic device, the cutting including reducing an extension of said metallization layer to an edge of said first electronic device; and

    forming on said extended metallization layer an electrical connection after cutting said wafer.

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