Leadframe-based packages for solid state light emitting devices having heat dissipating regions in packaging
First Claim
1. A modular package for a light emitting device, comprising:
- a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness, the leadframe further including an electrical lead extending laterally away from the second region, wherein the first region comprises a reflector cup having sidewalls extending from an upper corner of the reflector cup to a base of the reflector cup, and wherein the second region extends laterally beyond a sidewall of the first region such that the second region extends beyond the sidewall on opposing sides of the first region; and
a package body on the leadframe and surrounding the first region, wherein the package body is on the top and bottom surfaces of the electrical lead and on the bottom surface of the second region.
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Accused Products
Abstract
A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed.
30 Citations
27 Claims
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1. A modular package for a light emitting device, comprising:
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a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness, the leadframe further including an electrical lead extending laterally away from the second region, wherein the first region comprises a reflector cup having sidewalls extending from an upper corner of the reflector cup to a base of the reflector cup, and wherein the second region extends laterally beyond a sidewall of the first region such that the second region extends beyond the sidewall on opposing sides of the first region; and a package body on the leadframe and surrounding the first region, wherein the package body is on the top and bottom surfaces of the electrical lead and on the bottom surface of the second region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A modular package for a light emitting device, comprising:
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a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness, the leadframe further including an electrical lead extending laterally away from the second region, wherein the second region extends laterally beyond a sidewall of the first region such that the second region extends beyond the sidewall on opposing sides of the first region; a package body on the leadframe and surrounding the first region, wherein the package body is on the top and bottom surfaces of the electrical lead and on the bottom surface of the second region; an encapsulant on the top surface of the second region, wherein the encapsulant is a different material than a material of the package body, and a lens mounted over the first region of the leadframe, wherein the encapsulant is between the lens and leadframe, and wherein sidewalls of the package body extend above a bottom surface of the lens. - View Dependent Claims (22, 23, 24)
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25. A modular package for a light emitting device, comprising:
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a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness, the leadframe further including an electrical lead extending laterally away from the second region, wherein the second region extends laterally beyond a sidewall of the first region such that the second region extends beyond the sidewall on opposing sides of the first region; an isolation region between the second region and the electrical lead on the opposing sides of the first region to electrically isolate the second region from the electrical lead; and a package body on the leadframe and surrounding the first region, wherein the package body is on the top and bottom surfaces of the electrical lead and on the bottom surface of the second region. - View Dependent Claims (26, 27)
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Specification