Micro device stabilization post
First Claim
Patent Images
1. A structure comprising:
- a stabilization layer comprising an array of stabilization posts;
an array of micro chips on the array of stabilization posts;
wherein each micro chip includes bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface, each micro chip is on a plurality of stabilization posts, and each micro chip comprises a through hole extending completely through the micro chip and the through hole is not directly above a stabilization post.
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Abstract
A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
164 Citations
20 Claims
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1. A structure comprising:
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a stabilization layer comprising an array of stabilization posts; an array of micro chips on the array of stabilization posts; wherein each micro chip includes bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface, each micro chip is on a plurality of stabilization posts, and each micro chip comprises a through hole extending completely through the micro chip and the through hole is not directly above a stabilization post. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification