×

Micro device stabilization post

  • US 8,941,215 B2
  • Filed: 12/11/2012
  • Issued: 01/27/2015
  • Est. Priority Date: 09/24/2012
  • Status: Active Grant
First Claim
Patent Images

1. A structure comprising:

  • a stabilization layer comprising an array of stabilization posts;

    an array of micro chips on the array of stabilization posts;

    wherein each micro chip includes bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface, each micro chip is on a plurality of stabilization posts, and each micro chip comprises a through hole extending completely through the micro chip and the through hole is not directly above a stabilization post.

View all claims
  • 5 Assignments
Timeline View
Assignment View
    ×
    ×