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Stacked die package for MEMS resonator system

  • US 8,941,247 B1
  • Filed: 02/27/2014
  • Issued: 01/27/2015
  • Est. Priority Date: 06/15/2006
  • Status: Active Grant
First Claim
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1. A packaging structure for a microelectromechanical-system (MEMS) resonator system, the packaging structure comprising:

  • a lead frame including an electrical lead having a mounting surface and an electrical contact surface;

    a resonator-control chip electrically coupled to the electrical lead through a first electrically conductive bump [CS1]disposed between a first surface of the resonator-control chip and the mounting surface of the electrical lead;

    a MEMS resonator chip disposed in a stacked die configuration with the resonator-control chip and electrically coupled to the resonator-control chip through a second electrically conductive bump disposed between the first surface of the resonator-control chip and a first surface of the MEMS resonator chip; and

    a package enclosure that encloses the MEMS resonator chip, resonator-control chip and mounting surface of the electrical lead and that exposes the contact surface of the electrical lead at an external surface of the packaging structure.

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