Stacked die package for MEMS resonator system
First Claim
1. A packaging structure for a microelectromechanical-system (MEMS) resonator system, the packaging structure comprising:
- a lead frame including an electrical lead having a mounting surface and an electrical contact surface;
a resonator-control chip electrically coupled to the electrical lead through a first electrically conductive bump [CS1]disposed between a first surface of the resonator-control chip and the mounting surface of the electrical lead;
a MEMS resonator chip disposed in a stacked die configuration with the resonator-control chip and electrically coupled to the resonator-control chip through a second electrically conductive bump disposed between the first surface of the resonator-control chip and a first surface of the MEMS resonator chip; and
a package enclosure that encloses the MEMS resonator chip, resonator-control chip and mounting surface of the electrical lead and that exposes the contact surface of the electrical lead at an external surface of the packaging structure.
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Accused Products
Abstract
In a packaging structure for a microelectromechanical-system (MEMS) resonator system, a resonator-control chip is mounted on a lead frame having a plurality of electrical leads, including electrically coupling a first contact on a first surface of the resonator-control chip to a mounting surface of a first electrical lead of the plurality of electrical leads through a first electrically conductive bump. A MEMS resonator chip is mounted to the first surface of the resonator-control chip, including electrically coupling a contact on a first surface of the MEMS resonator chip to a second contact on the first surface of the resonator-control chip through a second electrically conductive bump. The MEMS resonator chip, resonator-control chip and mounting surface of the first electrical lead are enclosed within a package enclosure that exposes a contact surface of the first electrical lead at an external surface of the packaging structure.
83 Citations
20 Claims
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1. A packaging structure for a microelectromechanical-system (MEMS) resonator system, the packaging structure comprising:
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a lead frame including an electrical lead having a mounting surface and an electrical contact surface; a resonator-control chip electrically coupled to the electrical lead through a first electrically conductive bump [CS1]disposed between a first surface of the resonator-control chip and the mounting surface of the electrical lead; a MEMS resonator chip disposed in a stacked die configuration with the resonator-control chip and electrically coupled to the resonator-control chip through a second electrically conductive bump disposed between the first surface of the resonator-control chip and a first surface of the MEMS resonator chip; and a package enclosure that encloses the MEMS resonator chip, resonator-control chip and mounting surface of the electrical lead and that exposes the contact surface of the electrical lead at an external surface of the packaging structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of packaging a microelectromechanical-system (MEMS) resonator system, the method comprising:
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mounting a resonator-control chip on a lead frame having a plurality of electrical leads, including electrically coupling a first contact on a first surface of the resonator-control chip to a mounting surface of a first electrical lead of the plurality of electrical leads through a first electrically conductive bump; mounting a MEMS resonator chip to the first surface of the resonator-control chip, including electrically coupling a contact on a first surface of the MEMS resonator chip to a second contact on the first surface of the resonator-control chip through a second electrically conductive bump; and enclosing the MEMS resonator chip, resonator-control chip and mounting surface of the first electrical lead within a package enclosure that exposes a contact surface of the first electrical lead at an external surface of the packaging structure. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification