Test circuit of an integrated circuit on a wafer
First Claim
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1. A wafer, comprising:
- a first integrated circuit, including;
at least one test pad configured to couple to a testing device;
a first embedded antenna coupled to the at least one test pad of the first integrated circuit; and
a first test antenna to form a wireless link with the first embedded antenna in a test mode of operation;
a second integrated circuit, including;
at least one test pad configured to couple to the testing device;
a second embedded antenna coupled to the at least one test pad of the second integrated circuit; and
a second test antenna to form a wireless link with the second embedded antenna in the test mode of operation; and
at least one network to form a wired link between the first test antenna of the first integrated circuit and the second test antenna of the second integrated circuit in the test mode of operation, wherein in the test mode of operation a communication link is formed between the at least one test pad of the first integrated circuit and the at least one test pad of the second integrated circuit by the wireless link between the first embedded antenna and the first test antenna, the wired link between the first test antenna and the second test antenna and the wireless link between the second test antenna and the second embedded antenna.
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Abstract
A test circuit is described of a circuit integrated on wafer of the type comprising at least one antenna of the embedded type comprising at least one test antenna associated with said at least one embedded antenna that realizes its connection of the wireless loopback type creating a wireless channel for said at least one embedded antenna and allows its electric test, transforming an electromagnetic signal of communication between said at least one embedded antenna and said at least one test antenna into an electric signal that can be read by a test apparatus.
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Citations
33 Claims
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1. A wafer, comprising:
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a first integrated circuit, including; at least one test pad configured to couple to a testing device; a first embedded antenna coupled to the at least one test pad of the first integrated circuit; and a first test antenna to form a wireless link with the first embedded antenna in a test mode of operation; a second integrated circuit, including; at least one test pad configured to couple to the testing device; a second embedded antenna coupled to the at least one test pad of the second integrated circuit; and a second test antenna to form a wireless link with the second embedded antenna in the test mode of operation; and at least one network to form a wired link between the first test antenna of the first integrated circuit and the second test antenna of the second integrated circuit in the test mode of operation, wherein in the test mode of operation a communication link is formed between the at least one test pad of the first integrated circuit and the at least one test pad of the second integrated circuit by the wireless link between the first embedded antenna and the first test antenna, the wired link between the first test antenna and the second test antenna and the wireless link between the second test antenna and the second embedded antenna. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A testing device, comprising:
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a first test antenna configured to form a wireless loopback connection with a first embedded antenna of a semiconductor wafer to facilitate testing of the first embedded antenna by transforming an electromagnetic signal between the first test antenna and the first embedded antenna into an electrical signal; and a second test antenna configured to form a wireless loopback connection with a second embedded antenna of the semiconductor wafer to facilitate testing of the second embedded antenna by transforming an electromagnetic signal between the second test antenna and the second embedded antenna, wherein the first and second embedded antennas each comprise a magnetic dipole and the first and second test antennas have a planar structure in a single level of conductive material that surrounds with a closed loop said first and second embedded antennas. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A testing device, comprising:
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a first test antenna configured to form a wireless loopback connection with a first embedded antenna of a semiconductor wafer to facilitate testing of the first embedded antenna by transforming an electromagnetic signal between the first test antenna and the first embedded antenna into an electrical signal; and a second test antenna configured to form a wireless loopback connection with a second embedded antenna of the semiconductor wafer to facilitate testing of the second embedded antenna by transforming an electromagnetic signal between the second test antenna and the second embedded antenna, wherein the first and second embedded antennas each comprise a hertzian dipole, each embedded antenna being coupled to a respective receiver/transmitter, wherein said test antennas each have a hertzian dipole, facing a respective embedded antenna with hertzian dipole, and are coupled to at least one of a transmission line or circuit network.
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26. A testing device, comprising:
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a first test antenna configured to form a wireless loopback connection with a first embedded antenna of a semiconductor wafer to facilitate testing of the first embedded antenna by transforming an electromagnetic signal between the first test antenna and the first embedded antenna into an electrical signal; and a second test antenna configured to form a wireless loopback connection with a second embedded antenna of the semiconductor wafer to facilitate testing of the second embedded antenna by transforming an electromagnetic signal between the second test antenna and the second embedded antenna, wherein the first and second embedded antennas are of a capacitive type and the first and second test antennas comprise one strip of conductive material that overlaps at least in part onto said first and second embedded antennas of the capacitive type. - View Dependent Claims (27)
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28. A testing device, comprising:
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a first test antenna configured to form a wireless loopback connection with a first embedded antenna of a semiconductor wafer to facilitate testing of the first embedded antenna by transforming an electromagnetic signal between the first test antenna and the first embedded antenna into an electrical signal; and a second test antenna configured to form a wireless loopback connection with a second embedded antenna of the semiconductor wafer to facilitate testing of the second embedded antenna by transforming an electromagnetic signal between the second test antenna and the second embedded antenna, wherein the first and second embedded antennas are of a capacitive type and are above a passivation layer of said wafer, and the first and second test antennas comprise a strip of conductive material positioned so as not to overlap on the first and second embedded antennas and to be near enough to exploit edge capacitive effects. - View Dependent Claims (29)
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30. An integrated circuit, comprising:
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at least one embedded antenna; at least a residual portion of a first testing device configured to form a wireless loopback connection with the first embedded antenna to transform an electromagnetic signal between the first testing device and the first embedded antenna into an electrical signal, wherein said embedded antenna is of a capacitive type and said at least a residual portion of said testing device comprises at least a residual portion of a strip of conductive material coupled to a corresponding transceiver/transponder and configured to form a capacitive hertzian dipole. - View Dependent Claims (31, 32, 33)
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Specification