Controlling the device performance by forming a stressed backside dielectric layer
First Claim
1. A method comprising:
- pre-determining a target stress at a selected location in a semiconductor substrate of a wafer;
forming a through-substrate via (TSV) in the selected location;
finding a first stress applied to the selected location by the TSV;
selecting a material and process conditions for forming a dielectric layer that applies a second stress to the semiconductor substrate, wherein at the selected location, a combined stress of the first stress and a second stress is substantially equal to the target stress; and
forming the dielectric layer on a backside of the semiconductor substrate using the material and the process conditions.
0 Assignments
0 Petitions
Accused Products
Abstract
A device includes a p-type metal-oxide-semiconductor (PMOS) device and an n-type metal-oxide-semiconductor (NMOS) device at a front surface of a semiconductor substrate. A first dielectric layer is disposed on a backside of the semiconductor substrate. The first dielectric layer applies a first stress of a first stress type to the semiconductor substrate, wherein the first dielectric layer is overlying the semiconductor substrate and overlapping a first one of the PMOS device and the NMOS device, and is not overlapping a second one of the PMOS device and the NMOS device. A second dielectric layer is disposed on the backside of the semiconductor substrate. The second dielectric layer applies a second stress to the semiconductor substrate, wherein the second stress is of a second stress type opposite to the first stress type. The second dielectric layer overlaps a second one of the PMOS device and the NMOS device.
38 Citations
17 Claims
-
1. A method comprising:
-
pre-determining a target stress at a selected location in a semiconductor substrate of a wafer; forming a through-substrate via (TSV) in the selected location; finding a first stress applied to the selected location by the TSV; selecting a material and process conditions for forming a dielectric layer that applies a second stress to the semiconductor substrate, wherein at the selected location, a combined stress of the first stress and a second stress is substantially equal to the target stress; and forming the dielectric layer on a backside of the semiconductor substrate using the material and the process conditions. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A method comprising:
-
forming a through-substrate via (TSV) extending from a front surface of a semiconductor substrate of a wafer into the semiconductor substrate, wherein the wafer comprises a transistor at the front surface of the semiconductor substrate, wherein the semiconductor substrate comprises a back surface opposite to the front surface, and wherein the TSV applies a first stress to a nearby region of the semiconductor substrate, with the nearby region being adjacent to the TSV; performing a backside grinding on the back surface of the semiconductor substrate to expose the TSV; forming a backside isolation layer over and contacting the back surface, wherein the TSV is exposed through the backside isolation layer; forming a redistribution line on the backside of the semiconductor substrate, wherein the redistribution line is over the backside isolation layer; and forming a passivation layer comprising; a first portion over the redistribution line; a second portion on sidewalls of the redistribution line; and a third portion lower than the first portion and the second portion, wherein the passivation layer applies a second stress to the nearby region, with the second stress being of an opposite type than the first stress. - View Dependent Claims (9, 10, 11, 12)
-
-
13. A method comprising:
-
forming a through-substrate via (TSV) extending from a front surface of a semiconductor substrate of a wafer into the semiconductor substrate, wherein the wafer comprises a transistor at the front surface of the semiconductor substrate, wherein the semiconductor substrate comprises a back surface opposite to the front surface, and wherein the TSV applies a first stress to a nearby region of the semiconductor substrate, with the nearby region being adjacent to the TSV; performing a backside grinding on the back surface of the semiconductor substrate to expose the TSV; forming a backside isolation layer over and contacting the back surface, wherein the TSV is exposed through the backside isolation layer; forming a redistribution line on the backside of the semiconductor substrate, wherein the redistribution line is over the backside isolation layer; and forming a passivation layer comprising; a first portion over the redistribution line; a second portion on sidewalls of the redistribution line; and a third portion lower than the first portion and the second portion, wherein the passivation layer applies a second stress to the nearby region, with the second stress being of a same type as the first stress. - View Dependent Claims (14, 15, 16, 17)
-
Specification