Method and apparatus for image sensor packaging
First Claim
Patent Images
1. A device comprising:
- a sensor die comprisinga sensor region;
a plurality of pixels disposed within the sensor region; and
a plurality of sensor bond pads disposed outside the sensor region, each of the plurality of sensor bond pads having a surface exposed through a front side of the sensor die; and
a control circuit die comprising;
at least one sensor control circuit; and
a plurality of control circuit bond pads, each of the plurality of control circuit bond pads bonded to at least one of the plurality of sensor bond pads.
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Accused Products
Abstract
A backside illuminated image sensor having a photodiode and a first transistor in a sensor region and located in a first substrate, with the first transistor electrically coupled to the photodiode. The image sensor has logic circuits formed in a second substrate. The second substrate is stacked on the first substrate and the logic circuits are coupled to the first transistor through bonding pads, the bonding pads disposed outside of the sensor region.
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Citations
20 Claims
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1. A device comprising:
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a sensor die comprising a sensor region; a plurality of pixels disposed within the sensor region; and a plurality of sensor bond pads disposed outside the sensor region, each of the plurality of sensor bond pads having a surface exposed through a front side of the sensor die; and a control circuit die comprising; at least one sensor control circuit; and a plurality of control circuit bond pads, each of the plurality of control circuit bond pads bonded to at least one of the plurality of sensor bond pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A sensor device comprising:
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a sensor region; a plurality of backside illuminated pixels disposed within the sensor region; a plurality of sensor bond pads disposed outside the sensor region, each of the plurality of sensor bond pads having an exposed surface; a plurality of row select lines, each of the plurality of row select lines electrically connected to a plurality of pixels in a row and extending from within the sensor region to outside of the sensor region, each of the plurality of row select lines further electrically connected to a sensor bond pad; and a plurality of output lines, each of the plurality of output lines electrically connected to a plurality of pixels in a column extending from within the sensor region to outside of the sensor region, each of the plurality of output lines electrically connected to a sensor bond pad. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A device, comprising:
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a plurality of backside illuminated pixels disposed within a sensor region of a sensor die; a plurality of sensor bond pads disposed in the sensor die and outside the sensor region, each of the plurality of sensor bond pads having a surface exposed at a front side of the sensor die; a plurality of row select lines, each of the plurality of row select lines electrically connecting a plurality of the pixels in a row to a respective one of the plurality of sensor bond pads; a plurality of output lines, each of the plurality of output lines electrically connecting a plurality of pixels in a column to a respective one of the plurality of sensor bond pads; at least one sensor control circuit disposed in a control circuit die; and a plurality of control circuit bond pads disposed in the control circuit die, each of the control circuit bond pads having a surface exposed at a front side of the control circuit die; wherein each of the plurality of control circuit bond pads are coupled to a respective one of the plurality of sensor bond pads; and wherein the sensor region is substantially free of metal features exposed at the front side of the sensor die. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification