Semiconductor device for effectively disperse heat generated from heat generating device
First Claim
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1. A semiconductor device comprising:
- a semiconductor substrate;
a heat generating device provided on the semiconductor substrate;
a heat radiating part provided above the heat generating device; and
an interconnect provided above the heat radiating part, whereinthe heat radiating part is thermally coupled with the semiconductor substrate through at least one contact part, andan entire region overlapping with the interconnect in the heat generating device, in planar view, is entirely covered by the heat radiating part.
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Abstract
A semiconductor device includes a semiconductor substrate, a heat generating device, and a heat radiating part. The heat generating device is provided on the semiconductor substrate, and the heat radiating part is provided above the heat generating device. The heat radiating part is thermally coupled with the semiconductor substrate through at least one contact part.
25 Citations
9 Claims
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1. A semiconductor device comprising:
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a semiconductor substrate; a heat generating device provided on the semiconductor substrate; a heat radiating part provided above the heat generating device; and an interconnect provided above the heat radiating part, wherein the heat radiating part is thermally coupled with the semiconductor substrate through at least one contact part, and an entire region overlapping with the interconnect in the heat generating device, in planar view, is entirely covered by the heat radiating part. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification