×

Semiconductor device for effectively disperse heat generated from heat generating device

  • US 8,946,857 B2
  • Filed: 11/23/2011
  • Issued: 02/03/2015
  • Est. Priority Date: 06/29/2009
  • Status: Expired due to Fees
First Claim
Patent Images

1. A semiconductor device comprising:

  • a semiconductor substrate;

    a heat generating device provided on the semiconductor substrate;

    a heat radiating part provided above the heat generating device; and

    an interconnect provided above the heat radiating part, whereinthe heat radiating part is thermally coupled with the semiconductor substrate through at least one contact part, andan entire region overlapping with the interconnect in the heat generating device, in planar view, is entirely covered by the heat radiating part.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×