Dual-substrate capacitive touch panel
First Claim
1. A capacitive touch panel, comprising:
- a lower panel comprising;
a first transparent substrate having a first circuit surface;
a lower touch sensitive layer mounted on the first circuit surface of the first transparent substrate; and
a lower conductor layer mounted on the first circuit surface of the first transparent substrate and electrically connected to the lower touch sensitive layer;
an upper panel comprising;
a second transparent substrate having a second circuit surface;
an upper touch sensitive layer mounted on the second circuit surface of the second transparent substrate;
an upper insulation ink layer made of opaque material, mounted on an edge portion of the upper touch sensitive layer, and having a plurality of upper through slots formed through the upper insulation ink layer, wherein each of the plurality of upper through slots is filled in with an upper conductive layer; and
an upper conductor layer mounted on the upper insulation ink layer and electrically connected to the upper touch sensitive layer via the upper conductive layer; and
a transparent insulation adhesive layer interposed between the upper panel and the lower panel.
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Abstract
A capacitive touch panel sequentially has a first transparent substrate, a lower touch sensitive layer, a lower conductor layer, a lower insulation layer, a lower conductive adhesive layer, a flexible circuit board, a transparent insulation adhesive layer, an upper insulation layer, an upper conductive adhesive layer, an upper conductor layer, an upper insulation ink layer, an upper touch sensitive layer and a second transparent substrate. The aforementioned structure allows fabrication of the capacitive touch panel to be separated into a lower panel fabrication process and an upper panel fabrication process. The two independent fabrication processes prevent the capacitive touch panel from being damaged in one of the processes when the process is completed, thereby increase the yield in production and further facilitate producing large-size touch panel.
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Citations
30 Claims
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1. A capacitive touch panel, comprising:
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a lower panel comprising; a first transparent substrate having a first circuit surface; a lower touch sensitive layer mounted on the first circuit surface of the first transparent substrate; and a lower conductor layer mounted on the first circuit surface of the first transparent substrate and electrically connected to the lower touch sensitive layer; an upper panel comprising; a second transparent substrate having a second circuit surface; an upper touch sensitive layer mounted on the second circuit surface of the second transparent substrate; an upper insulation ink layer made of opaque material, mounted on an edge portion of the upper touch sensitive layer, and having a plurality of upper through slots formed through the upper insulation ink layer, wherein each of the plurality of upper through slots is filled in with an upper conductive layer; and an upper conductor layer mounted on the upper insulation ink layer and electrically connected to the upper touch sensitive layer via the upper conductive layer; and a transparent insulation adhesive layer interposed between the upper panel and the lower panel. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A capacitive touch panel, comprising:
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a first transparent substrate having a first circuit surface; a lower touch sensitive layer mounted on the first circuit surface of the first transparent substrate; a lower conductor layer mounted on the first circuit surface of the first transparent substrate and electrically connected to the lower touch sensitive layer; a transparent insulation adhesive layer mounted on the lower touch sensitive layer; an upper conductor layer mounted on the transparent insulation adhesive layer; an upper insulation ink layer made of opaque material, mounted on the upper conductor layer, and having a plurality of upper through slots formed through the upper insulation ink layer, wherein each of the plurality of upper through slots is filled in with a upper conductive layer; an upper touch sensitive layer mounted on the transparent insulation adhesive layer, partially covering the upper insulation ink layer, and electrically connected to the upper conductor layer via the upper conductive layers in the corresponding upper through slots of the upper insulation ink layer; and a second transparent substrate mounted on the upper touch sensitive layer and the upper insulation ink layer and having a second circuit surface in contact with the upper touch sensitive layer and the upper insulation ink layer. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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Specification