Conformal electromagnetic (EM) detector

• US 8,947,889 B2
• Filed: 08/16/2011
• Issued: 02/03/2015
• Est. Priority Date: 10/14/2010
• Status: Expired due to Fees

• Current Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Original Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Inventors: Kelley, Matthew, Adams, Christian, Reim, Richard
• Primary Examiner(s): Dinh, Tuan T
• Assistant Examiner(s): Barnes, Ahmad D
• Application Number:
  US13/211,131
• Publication Number:
  US 20120091456A1
• Time in Patent Office: 1,267 Days
• Field of Search: 361/816, 36167901-67961, 361/737, 361/752, 361/753, 361796-812, 361760-765, 361/792, 361/818, 257666-738, 257/49, 257/659, 257788-790, 4555751-5759, 454/184, 174250-261, 174/382, 174/384, 174/386, 174/262, 174/520
• US Class Current: 361/800
• CPC Class Codes: H01L 23/573 using passive means
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/0275 Security details, e.g. tampering prevention or detection
• CPC Class Codes: H05K 2201/09872 Insulating conformal coating
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H10K 39/30 Devices controlled by radiation
• CPC Class Codes: H10K 39/36 Devices specially adapted for detecting X-ray radiation

Abstract

A conformal electro-magnetic (EM) detector and a method of applying such a detector are provided herein as well as variations thereof Variations include, but are not limited to, single-element, area detectors; an array of multiple active elements.

Claims

1. A conformal electromagnetic (EM) detector, the detector comprising:

a conformal electrically insulating layer configured to conform to and he disposed over at least part of a component;

a first conformal electrode layer disposed over said conformal electrically insulating layer;

a conformal semiconductor layer disposed over said first conformal electrode layer;

a second conformal electrode layer disposed over said conformal semiconductor layer; and

a capping layer disposed on top of said second conformal electrode layer, wherein the capping layer provides at least one of mechanical rigidity, corrosion resistance, waterproofing, and temperature control;

wherein at least one electrode layer of the first conformal electrode layer and the second conformal electrode layer is divided into pixel regions and where the at least one electrode layer has at least one connection or a connection point for read-out of EM detection data.

2. The detector of claim 1. where said component is an electronic component.

3. The detector of claim 1, said detector further including a memory storage portion that captures the EM detection data captured from a pixel region of the at least one electrode layer.

4. The detector of claim 3, where said memory storage portion includes a microchip or a microcircuit configured with an analog-to-digital signal converter.

5. The detector of claim 4, where said microchip or said microcircuit is configured to reset a charge detecting matrix in the divided layer after data read-out.

6. The detector of claim 3, where said memory storage portion stores information about a detector compromise event as a single image having a time-stamp.

7. The detector of claim 3, the detector further comprising a scintillation layer disposed over said second conformal electrode layer.

8. The detector of claim 7, where said scintillation layer is configured to convert incident x-ray radiation into visible-spectrum radiation for detection.

9. The detector of claim 7, where the second conformal electrode layer is transparent to visible light.

10. The detector of claim 9, where said second conformal electrode layer is made of indium tin oxide (ITO).

11. The detector of claim 7, where the scintillation layer includes a phosphor with little or no hygroscopic properties.

12. The detector of claim 3, where each pixel region is associated with a data read-out interface.

13. The detector of claim 1, where the conformal electrically insulating layer is configured to be easily peeled or stripped back from said component.

14. The detector of claim 1, where said conformal electrically insulating layer is an elastomeric layer.

15. The detector of claim 1, the detector further comprising a ground plane disposed between said conformal electrically insulating layer and said first conformal electrode layer.

16. The detector of claim 1, where the conformal semiconductor layer includes two adjacent layers of semiconductor material that form a p-n junction, causing the conformal semiconductor layer to function as a photo-diode.

17. The detector of claim 1, where the conformal semiconductor layer includes one or more nanocrystalline oxide polymer composites.

18. A conformal X-ray detector comprising:

a conformal and flexible electrically insulating layer configured to conform to a body part;

an electrode-semiconductor-electrode photon detector assembly comprising;

a first conformal electrode layer disposed over the conformal and flexible electrically insulating layer;

a conformal semiconductor layer disposed over the first conformal electrode layer; and

a second conformal electrode layer disposed over the conformal semiconductor layer;

a capping layer disposed on top of said second conformal electrode layer, where the capping layer provides at least one of mechanical rigidity, corrosion resistance, waterproofing and temperature control;

wherein at least one electrode layer of the first conformal electrode layer and the second conformal electrode layer is divided into pixel regions and wherein the at least one electrode layer has at least one connection or a connection point for read-out of EM detection data;

a conformal scintillation layer disposed over the electrode-semiconductor-electrode photon detector assembly, the conformal scintillation layer comprising a scintillator material configured to convert incoming X-ray radiation into photons for detection by the electrode-semiconductor-electrode photon detector assembly; and

a capping layer disposed on top of said conformal scintillation layer, wherein the capping layer provides at least one of mechanical rigidity, corrosion resistance, waterproofing, and temperature control.

19. A conformal electromagnetic (EM) detector, the detector comprising:

a conformal electrically insulating layer configured to conform to and be disposed over at least part of a component;

a first conformal electrode layer disposed over said conformal electrically insulating layer;

a conformal semiconductor layer disposed over said first conformal electrode layer; and

a second conformal electrode layer disposed over said conformal semiconductor layer;

wherein at least one electrode layer of the first conformal electrode layer and the second conformal electrode layer is divided into pixel regions and where the at least one electrode layer has at least one connection or a connection point for read-out of EM detection data; and

a memory storage portion configured to capture the EM detection data captured from a pixel region of the at least one electrode layer.

20. A conformal electromagnetic (EM) detector, the detector comprising:

a conformal electrically insulating layer configured to conform to and be disposed over at least part of a component, the conformal electrically insulating layer being configured to be easily peeled or stripped back from said at least part of the component;

a first conformal electrode layer disposed over said conformal electrically insulating layer;

a conformal semiconductor layer disposed over said first conformal electrode layer; and

a second conformal electrode layer disposed over said conformal semiconductor layer;

wherein at least one electrode layer of the first conformal electrode layer and the second conformal electrode layer is divided into pixel regions and where the at least one electrode layer has at least one connection or a connection point for read-out of EM detection data.

21. A conformal electromagnetic (EM) detector, the detector comprising:

a conformal electrically insulating layer configured to conform to and be disposed over at least part of a component;

a first conformal electrode layer disposed over said conformal electrically insulating layer;

a conformal semiconductor layer disposed over said first conformal electrode layer, the conformal semiconductor layer comprising two adjacent layers of semiconductor material that form a p-n junction, causing the conformal semiconductor layer to function as a photo-diode; and

a second conformal electrode layer disposed over said conformal semiconductor layer;

wherein at least one electrode layer of the first conformal electrode layer and the second conformal electrode layer is divided into pixel regions and Where the at least one electrode layer has at least one connection or a connection point for read-out of EM detection data.

22. A conformal electromagnetic (EM) detector, the detector comprising:

a conformal electrically insulating layer configured to conform to and be disposed over at least part of a component;

a first conformal electrode layer disposed over said conformal electrically insulating layer;

a ground plane disposed between said conformal electrically insulating layer and said first conformal electrode layer;

a conformal semiconductor layer disposed over said first conformal electrode layer; and

a second conformal electrode layer disposed over said conformal semiconductor layer;

wherein at least one electrode layer of the first conformal electrode layer and the second conformal electrode layer is divided into pixel regions and where the at least one electrode layer has at least one connection or a connection point for read-out of EM detection data.

23. A conformal X-ray detector comprising:

a conformal and flexible electrically insulating layer configured to conform to a body part;

an electrode-semiconductor-electrode photon detector assembly comprising;

a first conformal electrode layer disposed over the conformal and flexible electrically insulating layer;

a conformal semiconductor layer disposed over the first conformal electrode layer; and

a second conformal electrode layer disposed over the conformal semiconductor layer;

a capping layer disposed On top of said second conformal electrode layer, where the capping layer provides at least one of mechanical rigidity, corrosion resistance, waterproofing, and temperature control;

wherein at least one electrode layer of the first conformal electrode layer and the second conformal electrode layer is divided into pixel regions and wherein the at least one electrode layer has at least one connection or a connection point for read-out of EM detection data;

a memory storage portion that captures the EM detection data captured from a pixel region of the at least one electrode layer; and

a conformal scintillation layer disposed over the electrode-semiconductor-electrode photon detector assembly, the conformal scintillation layer comprising a scintillator material configured to convert incoming X-ray radiation into photons for detection by the electrode-semiconductor-electrode photon detector assembly.